【摘要】：隨著科學(xué)技術(shù)的提高,垂直連續(xù)電鍍(VCP)線廣泛應(yīng)用于印制電路板行業(yè)。VCP電鍍線相對于傳統(tǒng)的龍門線,由于連續(xù)傳動(dòng)輸送,具有極強(qiáng)的灌孔能力且鍍銅均勻性好。因此對電鍍銅光劑提出更高的要求,即在陰極電流密度較高時(shí),通孔鍍層需有較好的深鍍能力,并且通孔鍍層可靠性能滿足電信號傳輸。目前國內(nèi)電鍍藥水在陰極高電流密度深鍍能力普遍偏低。因此本課題基于VCP線工藝特點(diǎn),研究應(yīng)用于VCP線電鍍銅光劑。在赫爾槽和哈林槽初步篩選出酸性鍍銅光劑基礎(chǔ)配方,光劑各組分進(jìn)行參數(shù)優(yōu)化后光亮劑濃度為10~40 mg/L,整平劑濃度50~200 mg/L,抑制劑濃度100~1000 mg/L。在陰極電流密度3.5 A/dm~2時(shí),測試樣板厚2.0 mm,孔直徑0.3 mm,鍍層深鍍能力可達(dá)70%,利用循環(huán)伏安剝離法建立光劑的分析方法,進(jìn)行放大模擬實(shí)驗(yàn)。通過模擬VCP線槽進(jìn)行放大模擬實(shí)驗(yàn),研究光劑體系的鍍銅層可靠性能。研究結(jié)果表明,在陰極電流密度4.0 A/dm~2時(shí),板厚2.0 mm,縱橫比10:1時(shí),六點(diǎn)法深鍍能力可到64.26%,解決了孔銅鍍層偏薄問題。鍍層抗熱沖擊性能在溫度288℃,浸錫三次后無孔銅斷裂。用掃描電子顯微鏡放大鍍銅層形貌,均無柱狀結(jié)晶,鍍銅層結(jié)晶致密。電鍍銅箔延展率均在20%以上。對鍍銅光劑穩(wěn)定性機(jī)理研究表明,在動(dòng)態(tài)電鍍過程中,往槽液中添加開缸穩(wěn)定劑使光亮劑和整平劑的消耗速率變慢,同時(shí)發(fā)現(xiàn)添加醛類化合物對盲孔板底部拐角處鍍銅層底部有一定加速鍍層沉積作用。通過模擬放大實(shí)驗(yàn)和光劑穩(wěn)定性機(jī)理研究表明,酸性電鍍銅缸槽液優(yōu)化參數(shù)如下:100 g/L五水硫酸銅,200 g/L硫酸,60 mg/L氯離子,15 mg/L光亮劑聚二硫丙烷磺酸鈉(SPS),200 mg/L抑制劑聚乙二醇(PEG8000),200 mg/L抑制劑聚環(huán)氧乙烷與環(huán)氧丙烷共聚物(50HB),100 mg/L整平劑L2,1.0 g/L醛類化合物,噴流壓力30~50赫茲(Hz),槽液溫度20~26℃,其中整平劑L2的結(jié)構(gòu)為含氮雜環(huán)類衍生物。在VCP產(chǎn)線試用鍍銅光劑,鍍層可靠性結(jié)果表明,在陰極電流密度3.0 A/dm~2時(shí),鍍層板面外觀光亮,面銅厚度要求1.0密耳(mil),孔銅最薄處至少有0.7 mil以上,解決了高電流密度下通孔鍍層偏薄問題。盲孔底部拐角處無螃蟹腳現(xiàn)象,可以實(shí)現(xiàn)通盲孔共浴電鍍。鍍銅層在溫度288℃下浸錫三次無孔銅斷裂,電鍍銅箔延展率在20%以上,該酸性鍍銅光劑可應(yīng)用于印制電路板VCP線試用。
[Abstract]:With the development of science and technology, the vertical continuous electroplating (VCP) line is widely used in the printed circuit board industry. Compared with the traditional gantry line, the VCP electroplating line has strong capacity of filling holes and good uniformity of copper plating due to continuous transmission. Therefore, a higher requirement is put forward for copper electroplating, that is, when the cathode current density is high, the through hole coating should have better deep plating ability, and the reliability of the through hole coating can satisfy the transmission of electrical signal. At present, the cathodic high current density deep plating capacity of domestic electroplating solution is generally low. Therefore, based on the process characteristics of VCP line, the research is applied to copper electroplating agent for VCP wire. The basic formula of acid copper-plating gloss agent was preliminarily screened in Hull trough and Harling trough. The concentration of brightener was 10 ~ 40 mg/L, the concentration of inhibitor was 50 ~ 200 mg/L, and the concentration of inhibitor was 100 ~ 1 000 mg/L.. When the cathode current density is 3.5A / dm ~ 2, the depth plating ability of the sample thickness 2.0 mm, hole diameter 0.3 mm, coating can be up to 700.The analytical method of the photoagent is established by cyclic voltammetry, and the amplification simulation experiment is carried out. The reliability of copper coating of optical agent system was studied by simulating VCP wire groove. The results show that when the cathode current density is 4.0 A / D ~ 2 and the aspect ratio of plate thickness 2.0 mm, is 10:1, the depth plating capacity of the six-point method can reach 64.26, which solves the problem of thin copper coating. The thermal shock resistance of the coating was at 288 鈩，

本文編號：2314851