彎曲半徑對(duì)柔性電子器件層間分離的影響
發(fā)布時(shí)間:2018-11-02 08:22
【摘要】:根據(jù)歐拉梁理論建立了多層柔性電子器件變形彎曲下能量釋放率的數(shù)學(xué)計(jì)算模型,得到了給定條件下能量釋放率與半徑的關(guān)系式,并利用虛擬裂紋閉合法對(duì)理論模型進(jìn)行了驗(yàn)證,進(jìn)一步分析了彎曲半徑對(duì)給定器件粘結(jié)層分離的影響。該研究為防止器件失效提供了理論參考,對(duì)柔性電子器件制造及應(yīng)用具有參考意義。
[Abstract]:According to Eulerian beam theory, a mathematical model of energy release rate under deformation and bending of multilayer flexible electronic devices is established, and the relation between energy release rate and radius under given conditions is obtained. The virtual crack closure method is used to verify the theoretical model, and the influence of bending radius on the separation of bond layer for given device is further analyzed. The research provides a theoretical reference for preventing device failure and has reference significance for the manufacture and application of flexible electronic devices.
【作者單位】: 中國(guó)工程物理研究院總體工程研究所;華中科技大學(xué)數(shù)字制造裝備與技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室;
【分類號(hào)】:TN05
本文編號(hào):2305466
[Abstract]:According to Eulerian beam theory, a mathematical model of energy release rate under deformation and bending of multilayer flexible electronic devices is established, and the relation between energy release rate and radius under given conditions is obtained. The virtual crack closure method is used to verify the theoretical model, and the influence of bending radius on the separation of bond layer for given device is further analyzed. The research provides a theoretical reference for preventing device failure and has reference significance for the manufacture and application of flexible electronic devices.
【作者單位】: 中國(guó)工程物理研究院總體工程研究所;華中科技大學(xué)數(shù)字制造裝備與技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室;
【分類號(hào)】:TN05
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