【摘要】：晶圓制造是半導(dǎo)體制造過(guò)程的核心環(huán)節(jié),隨著晶圓的直徑逐漸增大,加工工序日趨復(fù)雜,大直徑的晶圓廣泛采用組合設(shè)備(Cluster tools)加工。由于組合設(shè)備密閉空間的限制,內(nèi)部除了機(jī)械手沒(méi)有其他緩沖區(qū),造成組合設(shè)備的運(yùn)行控制異常困難。某些晶圓的加工常常出現(xiàn)重入加工,如原子層沉積(atomic layer deposition,ALD)通過(guò)多次重入加工達(dá)到離子層的厚度要求,這使組合設(shè)備出現(xiàn)死鎖(deadlock)的可能性增大,其調(diào)度與控制也更復(fù)雜。對(duì)于具有重入加工的組合設(shè)備建模與調(diào)度,現(xiàn)有的研究都側(cè)重于穩(wěn)態(tài)條件下。然而,晶圓加工過(guò)程須經(jīng)歷初始暫態(tài)、穩(wěn)態(tài)、終止暫態(tài)三個(gè)階段,終止暫態(tài)加工過(guò)程的分析和優(yōu)化對(duì)提高系統(tǒng)加工效率及多品種、少批量的加工趨勢(shì)具有重要的實(shí)踐意義。由于組合設(shè)備中資源的限制,采用有限資源的賦時(shí)Petri網(wǎng)(Timed Petri net,TPN)模擬系統(tǒng)能準(zhǔn)確地描述晶圓加工的并行且異步事件,以及各資源之間的邏輯關(guān)系。因此,本文基于雙臂組合設(shè)備穩(wěn)態(tài)的Petri網(wǎng)模型和1-晶圓周期調(diào)度策略,采用虛擬晶圓的加工方式描述和分析了雙臂組合設(shè)備晶圓重入加工的終止暫態(tài)過(guò)程,討論了一般條件下系統(tǒng)終止暫態(tài)的加工時(shí)間分布,并采用解析式進(jìn)行描述�；�1-晶圓周期調(diào)度的終止暫態(tài)過(guò)程的分析,以減少終止暫態(tài)的加工時(shí)間為目標(biāo),對(duì)終止暫態(tài)的加工過(guò)程調(diào)度進(jìn)行優(yōu)化,構(gòu)建了雙臂組合設(shè)備終止暫態(tài)改進(jìn)的Petri網(wǎng)模型,并提出1-晶圓優(yōu)化調(diào)度策略,使系統(tǒng)能快速切換至另一批晶圓產(chǎn)品的加工。同時(shí),討論了終止暫態(tài)加工時(shí)間分布,并通過(guò)解析式有效地表達(dá)出來(lái)。以Plant Simulation軟件為仿真平臺(tái),分別建立了基于1-晶圓周期調(diào)度和1-晶圓優(yōu)化調(diào)度的雙臂組合設(shè)備的仿真模型,實(shí)現(xiàn)了不同調(diào)度策略的終止暫態(tài)仿真,并通過(guò)一些例子獲得了兩組終止暫態(tài)的加工時(shí)間。對(duì)比同等加工條件下的終止暫態(tài)加工時(shí)間可知,1-晶圓優(yōu)化調(diào)度能明顯改善終止暫態(tài)的加工過(guò)程并提高晶圓的加工效率,由此驗(yàn)證了優(yōu)化調(diào)度的可行性和解析式的有效性。最后,對(duì)全文進(jìn)行回顧,分析了內(nèi)容中有待改進(jìn)之處,指出了進(jìn)一步的研究方向。
[Abstract]:Wafer manufacturing is the core of semiconductor manufacturing process. With the increasing of wafer diameter, the processing process is becoming more and more complex. The large diameter wafer is widely used in (Cluster tools) processing. Due to the limitation of the closed space of the combined equipment, there are no other buffers in the inner part except the manipulator, which makes the operation and control of the combined equipment extremely difficult. Some wafer processing often occurs reentry processing, such as atomic layer deposition (atomic layer deposition,ALD) through multiple reentry processing to meet the ion layer thickness requirements, which makes the combination equipment deadlock (deadlock) is more likely, Its scheduling and control are more complex. For the modeling and scheduling of combined equipment with reentry machining, the existing research focuses on steady state conditions. However, the analysis and optimization of the process of wafer processing must go through three stages: initial transient, steady state and termination transient. The analysis and optimization of the termination transient processing process have important practical significance for improving the system processing efficiency and variety, and less batch processing trend. Due to the limitation of resources in combinatorial devices, the time-timed Petri net (Timed Petri net,TPN) simulation system with finite resources can accurately describe the parallel and asynchronous events of wafer processing and the logical relationship between each resource. Therefore, based on the steady-state Petri net model and 1-wafer periodic scheduling strategy of dual-arm combinatorial equipment, this paper describes and analyzes the termination transient process of wafer reentry of dual-arm combiner by using virtual wafer machining method. The processing time distribution of system termination transient under general conditions is discussed and described by analytic formula. Based on the analysis of the termination transient process of 1- wafer periodic dispatching, with the goal of reducing the processing time of the termination transient, the process scheduling of the termination transient is optimized, and the improved Petri net model for the termination transient of the dual-arm combinational equipment is constructed. A 1-wafer optimal scheduling strategy is proposed to enable the system to quickly switch to another batch of wafer products. At the same time, the distribution of termination transient processing time is discussed and expressed effectively by analytic formula. Using Plant Simulation software as the simulation platform, the simulation models of dual-arm combinational equipment based on 1-wafer periodic scheduling and 1-wafer optimal scheduling are established, and the termination transient simulation of different scheduling strategies is realized. The processing time of two groups of termination transient is obtained by some examples. Compared with the processing time of termination transient under the same processing conditions, 1- wafer optimal scheduling can obviously improve the processing process of termination transient and improve the processing efficiency of wafer, which verifies the feasibility of optimal scheduling and the validity of analytical formula. Finally, the paper reviews the whole paper, analyzes the content of the need for improvement, and points out the direction of further research.
【學(xué)位授予單位】：江西理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN405

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