一種無排氣嘴型非制冷紅外焦平面探測器的封裝設(shè)計(jì)與研究
發(fā)布時(shí)間：2018-10-26 11:42
【摘要】：非制冷紅外焦平面探測器的封裝設(shè)計(jì)在提高器件真空壽命和滿足器件的光學(xué)、力學(xué)、熱學(xué)等需求中有重要的應(yīng)用價(jià)值。本文以無排氣嘴型非制冷探測器為例,分析封裝設(shè)計(jì)涉及的各個(gè)方面,給出設(shè)計(jì)一般流程,系統(tǒng)說明此類型緊密電子器件系列設(shè)計(jì)工作和總結(jié)具體生產(chǎn)的文本文件,為器件實(shí)際生產(chǎn)提供有力的保證和依據(jù)。首先,本文介紹了現(xiàn)常用的器件級非制冷紅外探測器,敘述芯片熱輻射吸收的工作環(huán)境要求和封裝工作的不足,說明探測器真空封裝和設(shè)計(jì)工作必要性。同時(shí)分析了現(xiàn)用探測器的不足,提出探測器的一種無排氣嘴陶瓷封裝樣式。介紹了電子器件一般性的封裝設(shè)計(jì),給出設(shè)計(jì)流程和依據(jù)。系統(tǒng)介紹紅外探測器封裝設(shè)計(jì)整體流程,從無排氣嘴型非制冷紅外探測器封裝設(shè)計(jì)總體要求,結(jié)合力、熱、光、電等方面,結(jié)果確定目標(biāo)探測器的原材料或零部件。在滿足總體裝配設(shè)計(jì)原則要求下,運(yùn)用SolidWorks軟件進(jìn)行合理結(jié)構(gòu)設(shè)計(jì)和COMSOL Multiphysics軟件進(jìn)行模擬仿真,給出具體目標(biāo)探測器裝配樣式。通過分析集成的紅外窗口強(qiáng)度,給出窗口厚度范圍值和粘接強(qiáng)度;通過分析內(nèi)部零部件的耐沖擊強(qiáng)度,給出零部件焊接或粘接強(qiáng)度要求。簡化目標(biāo)探測器熱傳遞模式,選用合適半導(dǎo)體制冷器為芯片提供穩(wěn)定工作溫度點(diǎn)。描述目標(biāo)探測器正常工作對真空環(huán)境的需求,提出安置微型真空規(guī)以實(shí)時(shí)監(jiān)測器件內(nèi)真空值變化,說明非蒸散型吸氣劑的選用必要性和使用要求。對上述目標(biāo)探測器進(jìn)行詳細(xì)的封裝工藝設(shè)計(jì),包括貼片工藝設(shè)計(jì)和一體化排氣、激活和封裝工藝實(shí)施設(shè)計(jì)。本文選用3500貼片機(jī)實(shí)現(xiàn)目標(biāo)探測器高精密度貼片工藝要求,并給出詳細(xì)實(shí)施過程說明。本文采用專用的排氣臺(tái),可同時(shí)實(shí)現(xiàn)檢漏、烘烤排氣和隔斷,簡化工藝。本文選用的液態(tài)吸氣劑,可以與紅外窗口集成一體,縮小占用體積、擴(kuò)大吸氣表面積;該吸氣劑在隔離環(huán)境下激活,激活的溫度和時(shí)間需嚴(yán)格把控。本文選用含銦熔合金的錢焊料,可滿足本目標(biāo)探測器對低溫工藝特殊要求�？偨Y(jié)完整的探測器封裝設(shè)計(jì)和工藝設(shè)計(jì)流程,為今后同種類型器件或其他微電子器件設(shè)計(jì)和生產(chǎn)提供系統(tǒng)參照。
[Abstract]:The packaging design of uncooled infrared focal plane detector has important application value in increasing the vacuum life of the device and satisfying the optical, mechanical and thermal requirements of the device. Taking the uncooled detector without exhaust nozzle as an example, this paper analyzes the various aspects of package design, gives the general design flow, systematically explains the design work of this type of compact electronic device series and summarizes the text file of concrete production. To provide a strong guarantee and basis for the actual production of the device. First of all, this paper introduces the common uncooled infrared detector, describes the working environment requirements of the chip thermal radiation absorption and the shortage of packaging work, and explains the necessity of vacuum packaging and design of the detector. At the same time, the deficiency of the current detector is analyzed, and a ceramic packaging style of the detector without exhaust nozzle is proposed. The general package design of electronic devices is introduced, and the design flow and basis are given. The whole design process of infrared detector package is introduced systematically. From the general requirements of packaging design of uncooled infrared detector without exhaust nozzle, binding force, heat, light and electricity, the results determine the raw materials or parts of the target detector. In order to meet the requirements of the general assembly design principle, reasonable structure design with SolidWorks software and simulation with COMSOL Multiphysics software are carried out, and the assembly style of the specific target detector is given. By analyzing the integrated infrared window strength, the range of window thickness and bonding strength are given, and the requirements of welding or bonding strength are given by analyzing the impact strength of internal parts. The heat transfer mode of the target detector is simplified and the suitable semiconductor cooler is selected to provide the stable working temperature point for the chip. This paper describes the requirements of the target detector for the vacuum environment in normal operation, and puts forward a micro vacuum gauge to monitor the vacuum value change in the device in real time. The necessity and application requirements of the selection of non-evapotranspiration getter are explained. Detailed package process design of the above target detector, including chip process design and integrated exhaust, activation and packaging process implementation design. In this paper, 3500 mounting machine is used to realize the high precision chip technology requirement of target detector, and the detailed implementation process is given. In this paper, a special exhaust platform can be used to detect leakage, bake exhaust and partition, and simplify the process. The liquid getter selected in this paper can be integrated with the infrared window to reduce the occupied volume and enlarge the inspiratory surface area. The getter is activated in isolation environment and the activation temperature and time need to be strictly controlled. In this paper, Qian solder containing indium melting alloy can meet the special requirements of the target detector for low temperature process. The complete package design and process design flow of detector are summarized to provide system reference for the design and production of the same type of devices or other microelectronic devices in the future.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2016
【分類號】：TN215
[Abstract]:The packaging design of uncooled infrared focal plane detector has important application value in increasing the vacuum life of the device and satisfying the optical, mechanical and thermal requirements of the device. Taking the uncooled detector without exhaust nozzle as an example, this paper analyzes the various aspects of package design, gives the general design flow, systematically explains the design work of this type of compact electronic device series and summarizes the text file of concrete production. To provide a strong guarantee and basis for the actual production of the device. First of all, this paper introduces the common uncooled infrared detector, describes the working environment requirements of the chip thermal radiation absorption and the shortage of packaging work, and explains the necessity of vacuum packaging and design of the detector. At the same time, the deficiency of the current detector is analyzed, and a ceramic packaging style of the detector without exhaust nozzle is proposed. The general package design of electronic devices is introduced, and the design flow and basis are given. The whole design process of infrared detector package is introduced systematically. From the general requirements of packaging design of uncooled infrared detector without exhaust nozzle, binding force, heat, light and electricity, the results determine the raw materials or parts of the target detector. In order to meet the requirements of the general assembly design principle, reasonable structure design with SolidWorks software and simulation with COMSOL Multiphysics software are carried out, and the assembly style of the specific target detector is given. By analyzing the integrated infrared window strength, the range of window thickness and bonding strength are given, and the requirements of welding or bonding strength are given by analyzing the impact strength of internal parts. The heat transfer mode of the target detector is simplified and the suitable semiconductor cooler is selected to provide the stable working temperature point for the chip. This paper describes the requirements of the target detector for the vacuum environment in normal operation, and puts forward a micro vacuum gauge to monitor the vacuum value change in the device in real time. The necessity and application requirements of the selection of non-evapotranspiration getter are explained. Detailed package process design of the above target detector, including chip process design and integrated exhaust, activation and packaging process implementation design. In this paper, 3500 mounting machine is used to realize the high precision chip technology requirement of target detector, and the detailed implementation process is given. In this paper, a special exhaust platform can be used to detect leakage, bake exhaust and partition, and simplify the process. The liquid getter selected in this paper can be integrated with the infrared window to reduce the occupied volume and enlarge the inspiratory surface area. The getter is activated in isolation environment and the activation temperature and time need to be strictly controlled. In this paper, Qian solder containing indium melting alloy can meet the special requirements of the target detector for low temperature process. The complete package design and process design flow of detector are summarized to provide system reference for the design and production of the same type of devices or other microelectronic devices in the future.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2016
【分類號】：TN215
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