【摘要】：基于熱光效應(yīng)的獨特物理性質(zhì),新型光電子器件正在不斷面世,已經(jīng)逐漸在光通訊等應(yīng)用領(lǐng)域占據(jù)重要地位。但是,熱光效應(yīng)器件的加工工藝與傳統(tǒng)器件大相徑庭,與此同時,日益苛刻的市場要求使器件的集成度進一步提高。因此熱光效應(yīng)器件的可靠性面臨極大的挑戰(zhàn)。目前,基于統(tǒng)計方法的可靠性模型,不僅試驗周期長、經(jīng)濟成本高,而且很難從源頭上找到新型熱光效應(yīng)器件的失效機理并掌握其失效規(guī)律,也幾乎不可能揭示失效機理與可靠性之間的直接關(guān)系。本論文響應(yīng)市場急需進一步提高熱光效應(yīng)器件可靠性的需求,從器件的失效模式入手,基于故障物理學(xué)的基本方法,系統(tǒng)深入地研究器件失效的根本原因,并分析失效與可靠性之間的關(guān)系。以此為依據(jù),建立通用可靠性數(shù)學(xué)模型與仿真模型。首先,基于熱光效應(yīng)可變光衰減器的工作原理和制作工藝,針對集中失效的加熱芯片互連線進行深入的失效行為研究。使用理論分析與試驗?zāi)M相結(jié)合的方法,推測造成器件失效的原因,根據(jù)環(huán)境模擬實驗的結(jié)果,揭示電遷移是引起互連線發(fā)生失效的主要原因之一。通過進一步的理論分析,發(fā)現(xiàn)互連線失效是多物理場(電場、溫度場、應(yīng)力場、原子擴散)共同作用的結(jié)果。然后,根據(jù)理論分析的結(jié)果,以經(jīng)典理論模型為基礎(chǔ),建立符合多物理場耦合條件下的數(shù)學(xué)模型,揭示電遷移作用下多物理量對互連線壽命的影響。在此基礎(chǔ)上,使用ANSYS軟件建立互連線的有限元模型,并完成熱-電耦合和熱-結(jié)構(gòu)耦合仿真,分析互連線失效與溫度梯度分布和應(yīng)力梯度分布之間的關(guān)系。利用單元生死技術(shù),并結(jié)合耦合場分析結(jié)果,模擬互連線失效,即空洞形成與長大過程,建立了仿真模型,為壽命模型打下基礎(chǔ)。最后,通過可靠性壽命模擬試驗驗證了建立的數(shù)學(xué)模型和仿真模型。結(jié)果說明這些模型可合理預(yù)測壽命。本文的研究成果為熱光效應(yīng)器件可靠性的提高給出了新的思路,為加工工藝的優(yōu)化提供了技術(shù)支持和理論基礎(chǔ)。
[Abstract]:Based on the unique physical properties of thermo-optical effect, new optoelectronic devices are emerging and have been playing an important role in optical communication and other applications. However, the fabrication process of thermo-optical devices is quite different from that of traditional devices. At the same time, the increasingly demanding market demands further improve the integration of the devices. Therefore, the reliability of thermo-optical devices is facing a great challenge. At present, the reliability model based on statistical method not only has long test period and high economic cost, but also is difficult to find out the failure mechanism of new thermo-optical devices from the source and to master its failure law. It is also almost impossible to reveal the direct relationship between failure mechanism and reliability. In response to the market demand for further improving the reliability of thermo-optic devices, starting from the failure mode of the devices, based on the basic methods of fault physics, the fundamental causes of device failure are systematically and deeply studied. The relationship between failure and reliability is analyzed. Based on this, the general reliability mathematical model and simulation model are established. Firstly, based on the working principle and fabrication technology of the thermo-optical variable optical attenuator, the failure behavior of the centralized failure heating chip interconnection is studied. By combining theoretical analysis with experimental simulation, the causes of device failure are inferred. According to the results of environmental simulation experiments, it is revealed that electromigration is one of the main causes of interconnection failure. Through further theoretical analysis, it is found that the interconnect failure is the result of the interaction of multiple physical fields (electric field, temperature field, stress field, atomic diffusion). Then, based on the results of theoretical analysis and classical theoretical model, the mathematical model under the condition of multi-physical field coupling is established to reveal the influence of multi-physical variables on the interconnect lifetime under the action of electromigration. On this basis, the finite element model of interconnect is established by using ANSYS software, and thermoelectric coupling and thermal-structural coupling simulation are completed, and the relationship between interconnect failure and temperature gradient distribution and stress gradient distribution is analyzed. Based on the element birth and death technique and coupled field analysis, the failure of interconnect is simulated, that is, the process of cavity formation and growth, and the simulation model is established, which lays the foundation for the life model. Finally, the established mathematical model and simulation model are verified by the reliability life simulation test. The results show that these models can reasonably predict the life span. The research results in this paper provide a new idea for improving the reliability of thermo-optical devices and provide technical support and theoretical basis for the optimization of processing technology.
【學(xué)位授予單位】：湖北工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN715

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