【摘要】：隨著微波集成電路小型化及高速化發(fā)展進(jìn)程的加快,多層電路的互連仿真技術(shù)對(duì)于板級(jí)電路設(shè)計(jì)以及信號(hào)完整性的分析也變的越來越重要,使用純粹的數(shù)值計(jì)算和商用仿真軟件來研究復(fù)雜條件下多層電路的層間互連結(jié)構(gòu)已經(jīng)無法滿足科研領(lǐng)域?qū)﹄姶欧治龈呔群涂焖俣鹊囊�。本文以�?fù)雜條件下微波多層電路層間互連結(jié)構(gòu)為研究對(duì)象,以微波網(wǎng)絡(luò)、電磁場(chǎng)理論以及電磁場(chǎng)數(shù)值計(jì)算方法等理論為研究基礎(chǔ),完成了以下工作:對(duì)復(fù)雜條件下微波多層電路層間互連結(jié)構(gòu)進(jìn)行了物理建模,根據(jù)其結(jié)構(gòu)特點(diǎn)將其分解為內(nèi)部結(jié)構(gòu)和外部結(jié)構(gòu),并對(duì)內(nèi)部結(jié)構(gòu)和外部結(jié)構(gòu)的影響因素以及分析方法進(jìn)行了探討,實(shí)現(xiàn)了一種混合的分析方法對(duì)微波多層電路層間互連結(jié)構(gòu)進(jìn)行分析的思路。采用矩陣束矩量法分析過孔的外部結(jié)構(gòu),選用RWG函數(shù)做為基函數(shù)生成對(duì)應(yīng)的三角形網(wǎng)格面元,應(yīng)用矩量法求解過孔外部結(jié)構(gòu)的表面電流分布,再應(yīng)用矩陣束矩量法提取其電流極值,從而實(shí)現(xiàn)對(duì)過孔外部結(jié)構(gòu)散射參數(shù)的求解。采用過孔的本征電路模型來分析復(fù)雜條件下過孔內(nèi)部結(jié)構(gòu)的電磁特性,引入了過孔本征三端口網(wǎng)絡(luò)電路模型和五端口網(wǎng)絡(luò)電路模型,并對(duì)三端口網(wǎng)絡(luò)電路模型和五端口網(wǎng)絡(luò)電路模型進(jìn)行了分析,研究了復(fù)雜條件下過孔內(nèi)部結(jié)構(gòu)電路模型中平行板阻抗的引入過程,并采用邊界積分方程法實(shí)現(xiàn)復(fù)雜條件下過孔內(nèi)部結(jié)構(gòu)平行板阻抗的求解。采用遞歸的導(dǎo)納參數(shù)級(jí)聯(lián)的方法實(shí)現(xiàn)過孔內(nèi)部結(jié)構(gòu)層間互連后散射參數(shù)的求解,采用散射參數(shù)級(jí)聯(lián)的方法實(shí)現(xiàn)過孔內(nèi)、外部結(jié)構(gòu)互連后完整結(jié)構(gòu)散射參數(shù)的求解。最后采用HFSS仿真軟件驗(yàn)證了過孔外部結(jié)構(gòu)、內(nèi)部結(jié)構(gòu)以及整體結(jié)構(gòu)的分析方法的可行性,并應(yīng)用該分析方法對(duì)過孔傳輸受其關(guān)鍵參數(shù)的影響以及孔間信號(hào)的傳輸規(guī)律進(jìn)行了討論。
[Abstract]:With the development of miniaturization and high speed of microwave integrated circuits, the interconnection simulation technology of multilayer circuits is becoming more and more important for the design of board level circuits and the analysis of signal integrity. Using pure numerical calculation and commercial simulation software to study the interlayer interconnection structure of multilayer circuits under complex conditions can no longer meet the requirements of high precision and high speed for electromagnetic analysis in the field of scientific research. In this paper, the interconnect structure of microwave multilayer circuits under complex conditions is taken as the research object, and the theory of microwave network, the theory of electromagnetic field and the numerical calculation method of electromagnetic field are taken as the basis. The following works have been accomplished: physical modeling of interlayer interconnection structure of microwave multilayer circuits under complex conditions is carried out. According to its structural characteristics, it is decomposed into internal and external structures. The influence factors and analysis methods of internal and external structures are discussed, and a hybrid analysis method is realized to analyze the interlayer interconnection structure of microwave multilayer circuits. The matrix beam moment method is used to analyze the external structure of the hole, the RWG function is used as the basis function to generate the corresponding triangular mesh surface element, and the moment method is applied to solve the surface current distribution of the external structure. The method of matrix beam moment is used to extract the current extremum, and the scattering parameters of the external structure through the hole are solved. The intrinsic circuit model of perforation is used to analyze the electromagnetic characteristics of the internal structure of the hole under complex conditions, and the intrinsic three-port network model and the five-port network circuit model are introduced. The three-port network circuit model and the five-port network circuit model are analyzed, and the introduction process of parallel plate impedance in the circuit model of the internal structure through a hole under complex conditions is studied. The boundary integral equation method is used to solve the impedance of parallel plate of the internal structure under complex conditions. The recursive admittance parameter cascade method is used to solve the scattering parameters after interconnecting the internal structure of the hole, and the scattering parameter cascade method is used to solve the scattering parameters of the complete structure after the interconnection of the internal and external structures. Finally, HFSS simulation software is used to verify the feasibility of the analysis method of the external structure, the internal structure and the whole structure of the hole. The method is applied to discuss the influence of the key parameters and the transmission law of the signal between the holes.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405.97

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