光源封裝對直下式背光模組設(shè)計的影響
發(fā)布時間：2018-08-28 13:17
【摘要】：大尺寸直下式LED背光電視已成為目前液晶電視的主流。但是,隨著背光模組尺寸的增大,傳統(tǒng)側(cè)面注入式背光源的導(dǎo)光板已經(jīng)不能滿足整個模組的要求,因此,采用輕便、低成本的大尺寸直下式LED背光源方案成為發(fā)展趨勢。該方案中背光透鏡對LED光源的光線發(fā)散處理,可以減小光源與目標(biāo)面的距離,由此減小了背光模組的厚度。具有特定目標(biāo)光斑的背光透鏡設(shè)計不僅與透鏡材料參數(shù)相關(guān),更與LED光源器件的特性相關(guān)。它們一起決定了背光模組的亮度、均勻性、對比度等核心參數(shù)性能。LED光源器件的特性不僅與芯片相關(guān),也與封裝密切相關(guān)。目前,LED封裝技術(shù)快速發(fā)展,陸續(xù)出現(xiàn)了多種尺寸小、光效高、封裝工藝簡單的新型“芯片級封裝”LED器件,如CSP、PFC、Po D等。這類LED器件能否作為新一代背光源非常值得探討。本文提出了使用新型封裝LED作為背光源的構(gòu)想,以CSP、PFC為例,從發(fā)光角度、尺寸、亮度、光色空間均勻度以及光源散熱等多個方面進行分析,并與使用3528封裝結(jié)構(gòu)LED器件的傳統(tǒng)背光源進行了對比。分析結(jié)果從一定程度上驗證了將“芯片級封裝”LED器件作為背光源的可行性。本文的主要內(nèi)容分為以下幾個部分:1.簡要概述了背光技術(shù)的發(fā)展趨勢與LED作為背光源的優(yōu)勢、LED封裝技術(shù)的發(fā)展現(xiàn)狀、本論文研究的目的和意義。2.介紹了LED直下式背光模組的組成結(jié)構(gòu),闡述了LED的發(fā)光原理以及實現(xiàn)白光LED的三種方法,并對LED光度學(xué)、色度學(xué)以及熱學(xué)方面進行了分析。詳細(xì)介紹了“芯片級封裝”LED器件。3.研究光源封裝對背光源熱學(xué)性能的影響。利用Ansys熱學(xué)模擬軟件分別對傳統(tǒng)背3528 LED光源和新型“芯片級封裝”LED進行了熱學(xué)仿真,對比三種光源器件的散熱性能,得出了“芯片級封裝”器件在熱學(xué)性能方面優(yōu)勢明顯的結(jié)論。4.研究光源封裝對背光模組光學(xué)性能的影響。對傳統(tǒng)背光源3528 LED和新型“芯片級封裝”LED進行近場光學(xué)測試,利用Light-tools光學(xué)仿真軟件,模擬了三種光源在背光透鏡作用下在混光距離為15mm、25mm時在目標(biāo)面上得到的照度分布,對比分析結(jié)果表明“芯片級封裝”LED在條件相同時更容易得到面積大且照度均勻的光斑。5.研究光源封裝對背光模組光色分布均勻性的影響。利用帶有頻譜顏色信息的光源文件對3528 LED和新型“芯片級封裝”LED進行仿真,模擬加入背光透鏡后在混光距離為15mm時目標(biāo)面上的光色分布均勻程度,分析傳統(tǒng)背光源與新型“芯片級封裝”LED背光源對背光模組光色分布均勻性的影響。6.理論結(jié)合實際進行分析對比,通過實際驗證模擬結(jié)果,表明“芯片級封裝”LED可以應(yīng)用于背光源領(lǐng)域,并具有誘人的優(yōu)勢。
[Abstract]:Large-size straight-down LED backlight TV has become the mainstream of LCD TV. However, with the increase of the size of backlight module, the light guide plate of the traditional side injection backlight source can not meet the requirements of the whole module. Therefore, it is a trend to adopt a light, low cost, large size straight down LED backlight source scheme. In this scheme, the backlight lens can reduce the distance between the light source and the target surface and reduce the thickness of the backlight module. The design of backlight lens with specific target spot is not only related to the lens material parameters, but also to the characteristics of LED light source device. Together, they determine the brightness, uniformity, contrast and other core parameters of the backlight module. The characteristics of LED light source devices are not only related to the chip, but also closely related to the packaging. At present, with the rapid development of LED packaging technology, there are many new "chip level packaging" LED devices, such as CSP,PFC,Po D, which are small in size, high in light efficiency and simple in packaging process. It is worth discussing whether this kind of LED device can be used as a new generation backlight source. In this paper, the idea of using new encapsulated LED as backlight source is put forward. Taking CSP,PFC as an example, this paper analyzes the luminous angle, dimension, brightness, uniformity of light color space and heat dissipation of light source. And compared with the traditional backlight which uses 3528 package structure LED device. The analysis results verify the feasibility of "chip level encapsulation" LED device as backlight to some extent. The main content of this paper is divided into the following parts: 1. The development trend of backlight technology and the current situation of LED packaging technology as backlight source are briefly summarized. The purpose and significance of this paper. This paper introduces the composition and structure of LED backlight module, expounds the principle of LED luminescence and three methods to realize white light LED, and analyses LED photometry, chromaticity and thermodynamics. The chip level package LED device. 3. 3. The effect of light source packaging on thermal performance of backlight was studied. The thermal simulation of traditional back 3528 LED light source and new "chip level encapsulation" LED is carried out by using Ansys thermal simulation software, and the heat dissipation performance of the three light source devices is compared. The conclusion that "chip level package" device has obvious advantage in thermal performance. 4. The effect of light source packaging on optical performance of backlight module was studied. The near-field optical test of traditional backlight 3528 LED and new "chip level encapsulation" LED is carried out. Using Light-tools optical simulation software, the illumination distribution of three kinds of light sources on the target surface under the action of backlight lens is simulated when the light mixing distance is 15mm to 25mm. The results of comparison and analysis show that "chip level packaging" LED is easier to obtain large area and uniform illumination spot. The effect of light source encapsulation on the light color distribution uniformity of backlight module was studied. The 3528 LED and the new "chip level encapsulation" LED are simulated by using the light source file with spectral color information. The uniformity of the light color distribution on the target surface is simulated when the backlight lens is added to the backlight lens when the mixing distance is 15mm. The influence of traditional backlight source and new "chip level package" LED backlight source on the photochromatic distribution uniformity of backlight module is analyzed. The simulation results show that "chip level packaging" LED can be used in backlight field and has an attractive advantage.
【學(xué)位授予單位】：深圳大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN312.8
本文編號：2209498
[Abstract]:Large-size straight-down LED backlight TV has become the mainstream of LCD TV. However, with the increase of the size of backlight module, the light guide plate of the traditional side injection backlight source can not meet the requirements of the whole module. Therefore, it is a trend to adopt a light, low cost, large size straight down LED backlight source scheme. In this scheme, the backlight lens can reduce the distance between the light source and the target surface and reduce the thickness of the backlight module. The design of backlight lens with specific target spot is not only related to the lens material parameters, but also to the characteristics of LED light source device. Together, they determine the brightness, uniformity, contrast and other core parameters of the backlight module. The characteristics of LED light source devices are not only related to the chip, but also closely related to the packaging. At present, with the rapid development of LED packaging technology, there are many new "chip level packaging" LED devices, such as CSP,PFC,Po D, which are small in size, high in light efficiency and simple in packaging process. It is worth discussing whether this kind of LED device can be used as a new generation backlight source. In this paper, the idea of using new encapsulated LED as backlight source is put forward. Taking CSP,PFC as an example, this paper analyzes the luminous angle, dimension, brightness, uniformity of light color space and heat dissipation of light source. And compared with the traditional backlight which uses 3528 package structure LED device. The analysis results verify the feasibility of "chip level encapsulation" LED device as backlight to some extent. The main content of this paper is divided into the following parts: 1. The development trend of backlight technology and the current situation of LED packaging technology as backlight source are briefly summarized. The purpose and significance of this paper. This paper introduces the composition and structure of LED backlight module, expounds the principle of LED luminescence and three methods to realize white light LED, and analyses LED photometry, chromaticity and thermodynamics. The chip level package LED device. 3. 3. The effect of light source packaging on thermal performance of backlight was studied. The thermal simulation of traditional back 3528 LED light source and new "chip level encapsulation" LED is carried out by using Ansys thermal simulation software, and the heat dissipation performance of the three light source devices is compared. The conclusion that "chip level package" device has obvious advantage in thermal performance. 4. The effect of light source packaging on optical performance of backlight module was studied. The near-field optical test of traditional backlight 3528 LED and new "chip level encapsulation" LED is carried out. Using Light-tools optical simulation software, the illumination distribution of three kinds of light sources on the target surface under the action of backlight lens is simulated when the light mixing distance is 15mm to 25mm. The results of comparison and analysis show that "chip level packaging" LED is easier to obtain large area and uniform illumination spot. The effect of light source encapsulation on the light color distribution uniformity of backlight module was studied. The 3528 LED and the new "chip level encapsulation" LED are simulated by using the light source file with spectral color information. The uniformity of the light color distribution on the target surface is simulated when the backlight lens is added to the backlight lens when the mixing distance is 15mm. The influence of traditional backlight source and new "chip level package" LED backlight source on the photochromatic distribution uniformity of backlight module is analyzed. The simulation results show that "chip level packaging" LED can be used in backlight field and has an attractive advantage.
【學(xué)位授予單位】：深圳大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN312.8
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