金屬狹縫中連接聲表面波器件的平面?zhèn)鬏斁研究
發(fā)布時(shí)間:2018-08-25 17:24
【摘要】:金屬狹縫等極端環(huán)境中進(jìn)行接觸應(yīng)力的測(cè)量有重要的工程應(yīng)用價(jià)值,在課題的前期研究中選用了聲表面波傳感器進(jìn)行狹縫中接觸應(yīng)力的測(cè)量,本文圍繞這一課題背景,研究狹縫中聲表面波器件的信號(hào)傳輸問(wèn)題。本文研究的難點(diǎn)主要為以下幾點(diǎn)。第一,在狹縫中傳輸高頻信號(hào),傳輸線與芯片的互連封裝必須有足夠薄足夠小的尺寸。二,微波頻段工作中,金屬狹縫對(duì)傳輸線傳輸性能會(huì)產(chǎn)生一定的影響。三,高頻工作時(shí)為了提高傳輸效率,SAW芯片需要與傳輸線阻抗匹配。本文主要是圍繞以上幾個(gè)問(wèn)題展開的研究,首先對(duì)互連方式進(jìn)行選擇并優(yōu)化互連結(jié)構(gòu),其次研究了金屬狹縫對(duì)微帶線傳輸性能的影響,然后設(shè)計(jì)并加工了SAW芯片與傳輸線匹配電路并進(jìn)行實(shí)驗(yàn)驗(yàn)證。具體工作內(nèi)容分以下4方面:1、研究微連接的幾種互連方法,選擇引線鍵合作為芯片與傳輸線間的連接方式。此外,對(duì)引線鍵合的結(jié)構(gòu)(鍵合線拱高、跨距、直徑及根數(shù)等)進(jìn)行優(yōu)化,以減小鍵合連接對(duì)信號(hào)造成的反射,提高信號(hào)傳輸效率。2、在屏蔽微帶線的分析方法中選用一種基于準(zhǔn)靜態(tài)法的近似算法來(lái)計(jì)算微帶線傳輸性能指標(biāo)(特性阻抗、等效相對(duì)介電常數(shù))隨金屬狹縫寬度的變化。其次,用HFSS軟件對(duì)金屬狹縫中一種微帶線的傳輸進(jìn)行模擬仿真,仿真結(jié)果較為精確,與近似計(jì)算相吻合。此外,還分析了金屬狹縫對(duì)微帶線電長(zhǎng)度的影響。3、考慮到與微帶線的集成以及金屬狹縫的影響,選用微帶雙枝短截線匹配電路進(jìn)行阻抗匹配。用ADS中的史密斯圓圖工具設(shè)計(jì)出匹配電路,并在HFSS中進(jìn)行匹配電路的結(jié)構(gòu)優(yōu)化。此外,還設(shè)計(jì)出用于鍵合連接的焊盤。4、對(duì)微帶線匹配電路進(jìn)行加工,并與SAW芯片連接封裝。實(shí)驗(yàn)測(cè)試了SAW芯片的靜態(tài)性能和動(dòng)態(tài)加載性能,并對(duì)技術(shù)指標(biāo)進(jìn)行分析。本文主要針對(duì)金屬狹縫中高頻信號(hào)的傳輸作了相關(guān)研究,綜合考慮了狹縫影響、結(jié)構(gòu)互連、阻抗匹配以及尺寸限制,優(yōu)化設(shè)計(jì)出適合課題背景的聲表面波信號(hào)傳輸部分,并完成實(shí)驗(yàn)測(cè)試,對(duì)金屬狹縫中接觸應(yīng)力的測(cè)量有實(shí)際應(yīng)用價(jià)值。
[Abstract]:The measurement of contact stress in metal slit and other extreme environments has important engineering application value. Saw sensor is used to measure the contact stress in the slit in the early stage of the project. This paper revolves around this subject background. The signal transmission of saw devices in slit is studied. The difficulties of this paper are as follows. First, high frequency signals are transmitted in the slit, and the interconnect between transmission lines and chips must be thin enough and small enough. Secondly, metal slit will affect the transmission performance of transmission line in microwave frequency band. Third, in order to improve transmission efficiency, saw chip needs to match with transmission line impedance. This paper mainly focuses on the above problems. Firstly, the interconnect mode is selected and the interconnect structure is optimized. Secondly, the influence of metal slit on the transmission performance of microstrip line is studied. Then the matching circuit between SAW chip and transmission line is designed and fabricated and verified by experiment. The specific work is divided into the following four aspects: 1, study several interconnection methods of micro-connection, select lead key cooperation as the connection mode between chip and transmission line. In addition, the structure of the lead bonding (arch height, span, diameter, root number, etc.) is optimized to reduce the reflection of the signal caused by the bonding connection, In order to improve the signal transmission efficiency, an approximate algorithm based on quasi-static method is used to calculate the variation of the transmission performance index (characteristic impedance, equivalent relative permittivity) with the metal slit width in the analysis method of shielded microstrip lines. Secondly, the transmission of a microstrip line in a metal slit is simulated by HFSS software. The simulation results are accurate and consistent with the approximate calculation. In addition, the influence of metal slit on the electric length of microstrip line is analyzed. Considering the integration with microstrip line and the influence of metal slit, the impedance matching circuit is selected. The matching circuit is designed by using Smith circle diagram tool in ADS, and the structure of matching circuit is optimized in HFSS. In addition, a pad. 4 for bonding connection is designed to process the microstrip line matching circuit and to connect and encapsulate with SAW chip. The static performance and dynamic loading performance of SAW chip are tested and the technical specifications are analyzed. In this paper, the transmission of high frequency signal in metal slit is studied. The influence of slit, structure interconnection, impedance matching and size limitation are considered comprehensively, and the transmission part of saw signal suitable for the background of the subject is optimized. The experiment is carried out and it has practical application value to measure the contact stress in the metal slit.
【學(xué)位授予單位】:電子科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN65;TN811
,
本文編號(hào):2203583
[Abstract]:The measurement of contact stress in metal slit and other extreme environments has important engineering application value. Saw sensor is used to measure the contact stress in the slit in the early stage of the project. This paper revolves around this subject background. The signal transmission of saw devices in slit is studied. The difficulties of this paper are as follows. First, high frequency signals are transmitted in the slit, and the interconnect between transmission lines and chips must be thin enough and small enough. Secondly, metal slit will affect the transmission performance of transmission line in microwave frequency band. Third, in order to improve transmission efficiency, saw chip needs to match with transmission line impedance. This paper mainly focuses on the above problems. Firstly, the interconnect mode is selected and the interconnect structure is optimized. Secondly, the influence of metal slit on the transmission performance of microstrip line is studied. Then the matching circuit between SAW chip and transmission line is designed and fabricated and verified by experiment. The specific work is divided into the following four aspects: 1, study several interconnection methods of micro-connection, select lead key cooperation as the connection mode between chip and transmission line. In addition, the structure of the lead bonding (arch height, span, diameter, root number, etc.) is optimized to reduce the reflection of the signal caused by the bonding connection, In order to improve the signal transmission efficiency, an approximate algorithm based on quasi-static method is used to calculate the variation of the transmission performance index (characteristic impedance, equivalent relative permittivity) with the metal slit width in the analysis method of shielded microstrip lines. Secondly, the transmission of a microstrip line in a metal slit is simulated by HFSS software. The simulation results are accurate and consistent with the approximate calculation. In addition, the influence of metal slit on the electric length of microstrip line is analyzed. Considering the integration with microstrip line and the influence of metal slit, the impedance matching circuit is selected. The matching circuit is designed by using Smith circle diagram tool in ADS, and the structure of matching circuit is optimized in HFSS. In addition, a pad. 4 for bonding connection is designed to process the microstrip line matching circuit and to connect and encapsulate with SAW chip. The static performance and dynamic loading performance of SAW chip are tested and the technical specifications are analyzed. In this paper, the transmission of high frequency signal in metal slit is studied. The influence of slit, structure interconnection, impedance matching and size limitation are considered comprehensively, and the transmission part of saw signal suitable for the background of the subject is optimized. The experiment is carried out and it has practical application value to measure the contact stress in the metal slit.
【學(xué)位授予單位】:電子科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN65;TN811
,
本文編號(hào):2203583
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