【摘要】：電子產(chǎn)品的無鉛化和微型化使得作為微電子互連材料的無鉛焊料尺寸越來越�。ㄎ⒚准墸�，從細(xì)觀角度對其相關(guān)力學(xué)性能進(jìn)行研究有著重要的現(xiàn)實(shí)意義。本文基于納米壓入法對三種常用無鉛焊料（Sn-3.0Ag-0.5Cu、Sn-0.7Cu及Sn-3.5Ag）的力學(xué)性能進(jìn)行測試，，并對其應(yīng)變率敏感性予以分析；采用熱機(jī)械分析儀對三者的熱膨脹性能進(jìn)行測試，同時(shí)基于數(shù)值模擬分析了焊點(diǎn)間距對PBGA封裝熱疲勞可靠性的影響，相關(guān)研究內(nèi)容及結(jié)論如下： （1）采用納米壓入應(yīng)變率控制法（P P=C）對三種無鉛焊料（Sn-3.0Ag-0.5Cu，Sn-0.7Cu、Sn-3.5Ag）不同應(yīng)變率下的相關(guān)力學(xué)性能進(jìn)行測試。結(jié)果表明，無鉛焊料的接觸剛度隨壓入深度線性增加，硬度和蠕變變形呈現(xiàn)出明顯的應(yīng)變率敏感性，而彈性模量和蠕變應(yīng)變速率敏感指數(shù)則對應(yīng)變率不敏感；對比分析三種無鉛焊料的力學(xué)性能，為封裝中無鉛焊料的選取提供數(shù)據(jù)參考。 （2）采用RJY-1P型熱機(jī)械分析儀對三種無鉛焊料的熱膨脹性能進(jìn)行測試，結(jié)果發(fā)現(xiàn)溫度對無鉛焊料熱膨脹系數(shù)的影響不明顯，同時(shí)熔點(diǎn)較高的焊料其熱膨脹系數(shù)較低�；贏NSYS有限元分析軟件建立PBGA封裝簡化模型，采用Anand粘塑性本構(gòu)關(guān)系表征Sn-3.0Ag-0.5Cu無鉛焊料的力學(xué)性能，經(jīng)數(shù)值模擬對比分析了不同焊點(diǎn)間距下PBGA封裝的熱疲勞可靠性；結(jié)果發(fā)現(xiàn)焊點(diǎn)間距為1.27mm時(shí)PBGA封裝的熱疲勞壽命相對較高，但整體上焊點(diǎn)間距對封裝疲勞壽命的影響規(guī)律性不大，模擬所得相關(guān)結(jié)論對封裝工業(yè)設(shè)計(jì)具有一定的指導(dǎo)意義。
[Abstract]:The lead-free solder size of microelectronic interconnection materials is becoming smaller and smaller due to the lead-free and miniaturization of electronic products. It is of great practical significance to study the mechanical properties of lead-free solders from a meso perspective. The mechanical properties of three kinds of lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7Cu and Sn-3.5Ag) were tested based on nano-indentation method, and their strain rate sensitivity was analyzed. At the same time, the effect of solder joint spacing on thermal fatigue reliability of PBGA packaging is analyzed based on numerical simulation. The related research contents and conclusions are as follows: (1) the mechanical properties of three lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7CuSn-3.5Ag) at different strain rates were measured by the strain rate control method. The results show that the contact stiffness of lead-free solder increases linearly with the depth of indentation, hardness and creep deformation show obvious strain rate sensitivity, while elastic modulus and creep strain rate sensitivity index are not sensitive to strain rate. The mechanical properties of three lead-free solders are compared and analyzed to provide a data reference for the selection of lead-free solders in package. (2) the thermal expansion properties of three lead-free solders are tested by RJY-1P thermomechanical analyzer. The results show that the influence of temperature on the thermal expansion coefficient of lead-free solder is not obvious, and the thermal expansion coefficient of the solder with higher melting point is lower. Based on the ANSYS finite element analysis software, the simplified model of PBGA package is established, and the mechanical properties of Sn-3.0Ag-0.5Cu lead-free solder are characterized by Anand viscoplastic constitutive relation. The thermal fatigue reliability of PBGA package with different solder joint spacing is compared and analyzed by numerical simulation. The results show that the thermal fatigue life of PBGA packaging is relatively high when the solder joint spacing is 1.27mm, but the effect of solder joint spacing on the package fatigue life is not so regular as a whole. The simulation results have some guiding significance for packaging industry design.
【學(xué)位授予單位】：太原理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN405

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