基于3D打印技術(shù)的平面無源集成EMI濾波器研究
[Abstract]:With the increasing frequency of power converter, electromagnetic interference (electromagnetic interference, EMI) becomes a problem that can not be ignored. To reduce EMI, EMI filters are usually installed on power lines and converter ports. However, the commonly used discrete EMI filter is relatively large in volume and low in space utilization ratio, which results in smaller power density of switching power supply. In order to reduce the volume of planar EMI filter, shorten the manufacturing period, reduce the open mode cost and increase the power density, To solve the problem of making complex models, a 3D printer is proposed to realize the planar magnetic integration of EMI filters. This paper presents two different structures of magnetically integrated EMI filters. By deducing a simple and effective mathematical model for estimating inductance and combining 3D finite element simulation with saber simulation method, the correctness and accuracy of the structure are proved. A simple simulation circuit is set up and compared with the curve of eliminating noise insertion loss. It is proved that the planar EMI filter made by this technique has good filtering performance. In order to further reduce the size of EMI filter and increase the power density of power converter, a new elliptical planar LC coil structure is proposed. The rectangular and elliptical planar L-C coils are simulated by finite element method, and the elliptical plane L-C coils are determined as the basic components of EMI filter by comparing their comprehensive factors. Based on this structure, elliptical LC coil passive integrated EMI filter is realized. Considering parasitic capacitance and parasitic inductance of common-mode inductance and their equivalent resistance, the high-frequency equivalent circuit model of planar passive integrated EMI filter under parasitic parameters is established. The formula of insertion loss is derived by using the parameter matrix A of the two-port network analysis method. By analyzing the loss formula of proximity effect, the thickness of copper foil on PCB can be determined and the loss can be minimized. The correctness of the proposed structure and the calculation formula of high frequency circuit and insertion loss are proved by comparison of simulation and experiment.
【學(xué)位授予單位】:遼寧工程技術(shù)大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN713
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