發(fā)布時(shí)間：2018-07-23 13:08

【摘要】：隨著電子器件的快速發(fā)展,人們對(duì)電路板的要求越來越高,高速變化的數(shù)字電路和高靈敏度的模擬電路不可避免會(huì)出現(xiàn)在同一印刷電路板上,模數(shù)混合電路的應(yīng)用范圍越來越廣泛。這種高速度、高集成度的趨勢給電子電路的硬件設(shè)計(jì)帶來了許多新的問題,其中電磁兼容性問題尤為顯著,因此印刷電路板的電磁兼容性問題也越來越受到人們的重視。本文首先設(shè)計(jì)了斷路器的控制電路,并以該控制電路的印刷電路板為例,進(jìn)行電路板的電磁兼容性研究分析。本文利用Cadence軟件對(duì)印刷電路板進(jìn)行建模與仿真,得到電路板的空間近磁場強(qiáng)度分布圖和近電場強(qiáng)度分布圖。通過分析近磁場強(qiáng)度分布圖和近電場強(qiáng)度分布圖,得到電路板的敏感頻點(diǎn),同時(shí)直觀地看出電路板周圍場強(qiáng)的強(qiáng)弱,并分析其耦合狀況。選取敏感器件,研究敏感器件的引腳在電磁干擾狀況下的電磁兼容性。對(duì)電路板分別施加近場騷擾和遠(yuǎn)場騷擾,得到敏感器件引腳的感應(yīng)電壓,并經(jīng)過反推計(jì)算,得到電路板的最大耐受場強(qiáng),通過對(duì)比電路板的最大耐受場強(qiáng)與其周圍的空間電場強(qiáng)度,快速判斷出電路板的工作狀態(tài)。對(duì)空間近電磁場強(qiáng)度分布圖進(jìn)行分析,分別從電容性干擾和電感性干擾兩個(gè)方面進(jìn)行原理研究,提出電路板布局布線的修改方案,并通過增加去耦電容和壓敏電阻等方法對(duì)電路板做進(jìn)一步改進(jìn),同時(shí)提出通過給電路板外加屏蔽罩的方法來改善電路板的電磁兼容性和抗干擾能力。最后對(duì)比兩種不同的電路板材料,研究其對(duì)電路板的電磁兼容性和抗擾度的影響,并通過仿真對(duì)比,驗(yàn)證了方法的有效性。
[Abstract]:With the rapid development of electronic devices, more and more people demand the circuit board. The high-speed digital circuit and the high sensitivity analog circuit will inevitably appear on the same printed circuit board. The application of analog-to-digital hybrid circuits is becoming more and more extensive. This trend of high speed and high integration has brought many new problems to the hardware design of electronic circuits, especially electromagnetic compatibility. Therefore, people pay more and more attention to the electromagnetic compatibility of printed circuit boards. In this paper, the control circuit of circuit breaker is designed firstly, and the electromagnetic compatibility of the circuit board is studied and analyzed by taking the printed circuit board of the control circuit as an example. In this paper, the Cadence software is used to model and simulate the printed circuit board, and the spatial near magnetic field intensity distribution and the near electric field intensity distribution diagram of the printed circuit board are obtained. By analyzing the near magnetic field intensity distribution and the near electric field intensity distribution, the sensitive frequency points of the circuit board are obtained. At the same time, the intensity of the field around the circuit board is intuitively seen, and the coupling condition is analyzed. Select the sensitive device to study the electromagnetic compatibility of the pin in the condition of electromagnetic interference. The inductive voltage of the sensitive device pin is obtained by applying near-field disturbance and far-field disturbance to the circuit board, and the maximum withstand field strength of the circuit board is obtained by backstepping calculation. By comparing the maximum withstand field strength of the circuit board with the spatial electric field intensity around the circuit board, the working state of the circuit board can be determined quickly. This paper analyzes the intensity distribution of space near electric magnetic field, studies the principle of capacitive interference and inductive interference, and puts forward the modification scheme of circuit board layout and wiring. The circuit board is further improved by adding decoupling capacitance and varistor. At the same time, the electromagnetic compatibility and anti-interference ability of the circuit board are improved by adding shield to the circuit board. Finally, two different kinds of circuit board materials are compared, and the effects of the two materials on the electromagnetic compatibility and immunity of the circuit board are studied, and the effectiveness of the method is verified by simulation and comparison.
【學(xué)位授予單位】：沈陽工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TM561;TN41

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本文編號(hào)：2139509