【摘要】：單晶硅因其優(yōu)異的物理和化學(xué)特性被廣泛用作微納米器件的結(jié)構(gòu)功能材料,而在其化學(xué)機(jī)械拋光(CMP)加工以及硅基微納米器件的使用中均存在液下微觀磨損問題。溫度是影響材料微觀磨損(尤其是摩擦化學(xué)磨損)的關(guān)鍵因素,但目前相關(guān)研究仍然欠缺。例如,單晶硅的CMP加工速率和表面質(zhì)量與溫度密切相關(guān),但對(duì)其影響機(jī)理還鮮有研究;另外液體環(huán)境中微納米器件的運(yùn)行極易受到環(huán)境溫度變化的影響,但對(duì)由溫度引起的磨損問題仍未進(jìn)行全面的研究。為了探明環(huán)境溫度對(duì)微納米器件在液下磨損失效的影響機(jī)制,以及深入揭示溫度對(duì)單晶硅CMP中原子級(jí)材料去除的影響機(jī)制,需要開展不同水溫下單晶硅的微觀磨損研究。有鑒于此,本文分別采用多點(diǎn)接觸微納米加工設(shè)備和原子力顯微鏡(AFM)重點(diǎn)研究了液體環(huán)境中溫度對(duì)單晶硅微觀磨損的影響規(guī)律。為了揭示液體溫度對(duì)單晶硅微觀磨損的影響機(jī)理,利用EDX和AFM對(duì)不同溫度水浴后單晶硅的表面性質(zhì)進(jìn)行了表征,并借助拉曼光譜儀(Raman)測(cè)試探明了單晶硅磨損后磨屑中Si-H和Si-OH兩種基團(tuán)隨溫度的變化規(guī)律。本論文的主要研究?jī)?nèi)容與創(chuàng)新點(diǎn)如下:(1)揭示了液體溫度對(duì)單晶硅微觀磨損的影響規(guī)律硅/二氧化硅水下微米接觸磨損包括機(jī)械磨損和摩擦化學(xué)磨損,其中摩擦化學(xué)磨損為主導(dǎo)。微觀條件下單晶硅水下的磨損體積隨著水溫升高而增加,其中機(jī)械磨損部分變化較小,液體溫升對(duì)硅/二氧化硅的摩擦化學(xué)磨損有明顯的促進(jìn)作用。(2)揭示了液體溫度對(duì)單晶硅摩擦化學(xué)磨損的影響規(guī)律硅/二氧化硅水下納米接觸磨損由摩擦化學(xué)磨損主導(dǎo)。隨著水溫的升高,原始硅表面經(jīng)歷無明顯損傷到磨損產(chǎn)生的變化過程,且產(chǎn)生磨損后磨損深度和體積隨著溫度升高而逐漸增大。在相同的水溫范圍內(nèi),疏水硅表面均出現(xiàn)損傷,磨損深度和體積先略微增大,在常溫25℃時(shí)達(dá)到最大值,隨后迅速減小。(3)初步闡明了溫度對(duì)單晶硅水下微納磨損的影響機(jī)理單晶硅的水下微米接觸磨損的磨損率與水溫滿足阿倫尼烏斯公式,同時(shí)拉曼光譜測(cè)試結(jié)果顯示磨屑中Si-H和Si-OH兩種基團(tuán)的綜合強(qiáng)度隨著溫度的升高而增強(qiáng)。因此,溫度通過促進(jìn)單晶硅表面的水解反應(yīng)進(jìn)而加劇微米接觸磨損。進(jìn)一步分析表明,不同水溫下單晶硅的摩擦化學(xué)磨損可能與其表面的水接觸角即表面親疏水性密切相關(guān)。水溫升高會(huì)增強(qiáng)原始硅表面的疏水性,減小硅/二氧化硅配副間的水膜厚度,從而導(dǎo)致接觸界面間更易形成"Si-O-Si"鍵橋,加劇原始硅表面的微觀磨損。與原始硅不同,水溫升高會(huì)降低疏水硅表面的疏水性,增大接觸界面間的水膜厚度,進(jìn)而阻止配副表面間"Si-O-Si"鍵橋的形成,從而減弱摩擦化學(xué)磨損。
[Abstract]:Monocrystalline silicon has been widely used as structural and functional materials for micro and nano devices due to its excellent physical and chemical properties. However, in the process of chemical mechanical polishing (CMP) and in the use of silicon based micro and nano devices, the problem of micro wear exists in liquid. Temperature is the key factor affecting the micro-wear of materials, especially the tribochemical wear. For example, CMP processing rate and surface quality of monocrystalline silicon are closely related to temperature, but there are few studies on its influence mechanism. In addition, the operation of micro-nano devices in liquid environment is easily affected by environmental temperature change. However, the wear problem caused by temperature has not been fully studied. In order to find out the effect of ambient temperature on the wear failure of microdevices under liquid and to reveal the effect of temperature on the removal of atom-grade materials in monocrystalline silicon (CMP), it is necessary to study the micro-wear of monocrystalline silicon at different water temperatures. In view of this, the effects of temperature on the wear of monocrystalline silicon in liquid environment were studied by means of multi-point contact micromachining equipment and atomic force microscope (AFM), respectively. In order to reveal the effect of liquid temperature on the wear of monocrystalline silicon, edX and AFM were used to characterize the surface properties of monocrystalline silicon after water bath at different temperatures. The changes of Si-H and Si-OH groups with temperature in worn monocrystalline silicon chips were investigated by Raman spectroscopy. The main contents and innovations of this thesis are as follows: (1) the effect of liquid temperature on the micro-wear of monocrystalline silicon is revealed. The micro-contact wear of silicon / silicon dioxide underwater includes mechanical wear and tribochemical wear, in which friction and chemical wear are dominant. The wear volume of monocrystalline silicon increases with the increase of water temperature, and the mechanical wear of monocrystalline silicon increases slightly. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. The underwater nano-contact wear of Si / Sio _ 2 is dominated by tribochemical wear. With the increase of water temperature, the original silicon surface experienced no obvious damage to the wear process, and the wear depth and volume increased with the increase of temperature. In the same range of water temperature, the surface of hydrophobic silicon is damaged, the wear depth and volume increase slightly, and reach the maximum at 25 鈩，

本文編號(hào)：2118889