柵控PNP晶體管ELDRS效應(yīng)的開關(guān)劑量率加速試驗(yàn)方法及機(jī)理
本文選題:柵控橫向PNP雙極晶體管 + 開關(guān)劑量率; 參考:《哈爾濱工業(yè)大學(xué)》2017年碩士論文
【摘要】:本文以60Co-γ源作為輻照源,選用柵控橫向PNP型(GLPNP)晶體管為研究對(duì)象,在100rad/s、10mrad/s和變換劑量率下分別進(jìn)行了輻照試驗(yàn),研究了不同輻照條件對(duì)GLPNP晶體管電離輻照損傷缺陷演化行為的影響。輻照過程中,測(cè)試了GLPNP晶體管電性能隨輻照劑量的變化規(guī)律,并結(jié)合柵掃描測(cè)試(GS)及輻照感生缺陷分離技術(shù),驗(yàn)證了開關(guān)劑量率加速輻照試驗(yàn)方法的可行性并探究了其加速機(jī)理。研究結(jié)果表明,晶體管的電流增益在10mrad/s輻照劑量率條件下的退化程度較100rad/s輻照嚴(yán)重。基本微觀缺陷測(cè)試分析表明,與100rad/s輻照相比,相同輻照劑量下,10mrad/s輻照時(shí)晶體管內(nèi)部產(chǎn)生的氧化物電荷濃度較少,但是其內(nèi)部界面態(tài)濃度更多。并且,在低劑量率輻照條件下,相同輻照劑量條件界面態(tài)增長(zhǎng)速率較快,導(dǎo)致下降更加迅速,致使晶體管的電性能退化更加嚴(yán)重。通過模擬分析揭示出了ELDRS效應(yīng)主要是由于氧化物層中的空穴俘獲陷阱和復(fù)合中心對(duì)電離誘導(dǎo)空穴的俘獲和復(fù)合競(jìng)爭(zhēng)機(jī)制所引起。開關(guān)劑量率試驗(yàn)表明,當(dāng)輻照劑量率由高到低切換的短時(shí)間內(nèi),變換劑量率效果與高、低劑量率單獨(dú)輻照相同。但切換為低劑量率后,隨總劑量逐漸增加,開關(guān)劑量率所造成的損傷要遠(yuǎn)小于低劑量率單獨(dú)輻照所造成的損傷。上述結(jié)果說明,開關(guān)劑量率加速試驗(yàn)方法雖然實(shí)現(xiàn)了一定程度的加速,但先進(jìn)行高劑量率輻照會(huì)對(duì)后期的低劑量率輻照產(chǎn)生影響,導(dǎo)致輻照誘導(dǎo)缺陷的退火速率加快,使得電性能的損傷程度減小。
[Abstract]:In this paper, 60Co- 緯 source is used as irradiation source, gate controlled transverse PNP type GLPNPT is chosen as the object of study, irradiation experiments are carried out at 100 radr / s 10mradr / s and conversion dose rate, respectively. The effects of different irradiation conditions on the evolution of ionizing radiation damage defects in GLPNP transistors were studied. In the process of irradiation, the variation of the electrical properties of GLPNP transistors with the irradiation dose was tested, and combined with the gate scanning test of GSH) and the separation technology of irradiation-induced defects, The feasibility of the switching dose rate accelerated irradiation test method was verified and the acceleration mechanism was explored. The results show that the current gain of the transistor is more degraded than that of 100rad/s irradiation at the dose rate of 10mrad/s irradiation. The basic microscopic defect analysis shows that compared with 100rad/s irradiation, the oxide charge concentration in the transistor is less when the irradiation dose is 10 mradr / s, but the interfacial state concentration is more. In addition, under the condition of low dose rate irradiation, the growth rate of interface states is faster, which leads to the decrease more rapidly, and the degradation of the transistor electrical performance is more serious. The simulation results show that the ELDRS effect is mainly caused by the hole trapping trap in oxide layer and the mechanism of ionization induced hole capture and compound competition in the composite center. The switching dose rate test shows that when the dose rate is switched from high to low, the effect of shift dose rate is the same as that of high dose rate and low dose rate alone. However, with the increase of total dose, the damage caused by switching dose rate is much smaller than that caused by low dose rate irradiation alone. The above results show that although the switching dose rate accelerated test method has achieved a certain degree of acceleration, the first high dose rate irradiation will have an effect on the later low dose rate irradiation, resulting in the accelerated annealing rate of radiation induced defects. The damage degree of electrical property is reduced.
【學(xué)位授予單位】:哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類號(hào)】:TN32
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