本文選題：LTCC + 微波無(wú)源器件��； 參考：《電子科技大學(xué)》2015年碩士論文

【摘要】：高密度多層基板是實(shí)現(xiàn)多芯片組件MCM(Multichip Module)的關(guān)鍵。低溫共燒陶瓷LTCC(Low Temperature Co-fired Ceramic)由于其獨(dú)特的優(yōu)勢(shì),成為了高速高密度集成封裝技術(shù)研究的熱點(diǎn)。目前,國(guó)內(nèi)多家單位已具有LTCC微波頻段的成熟工藝線,但是對(duì)LTCC建模建庫(kù)和設(shè)計(jì)平臺(tái)建設(shè)的研究相對(duì)落后,并嚴(yán)重制約了LTCC產(chǎn)品的快速開(kāi)發(fā)和設(shè)計(jì)能力。本文的主要工作是微波LTCC設(shè)計(jì)平臺(tái),建模建庫(kù)項(xiàng)目的部分工作,主要針對(duì)常用微波無(wú)源器件和縫隙耦合結(jié)構(gòu)進(jìn)行,并做了一部分小型化設(shè)計(jì)的工作。主要研究?jī)?nèi)容如下:1.LTCC多層電路常用結(jié)構(gòu)分析。介紹了常用的傳輸線結(jié)構(gòu)并給出設(shè)計(jì)解析和經(jīng)驗(yàn)公式,對(duì)LTCC層間和同層互聯(lián)過(guò)渡結(jié)構(gòu)進(jìn)行了仿真優(yōu)化。2.LTCC微波無(wú)源器件建模。分析微波電路特別是三端口和四端口網(wǎng)絡(luò)的工作特點(diǎn)和指標(biāo)特性,并基于解析、經(jīng)驗(yàn)公式以及仿真優(yōu)化的手段建立設(shè)計(jì)指標(biāo)和物理尺寸間映射關(guān)系,建立了耦合線定向耦合器、分支線耦合器、wilkinson功分器、環(huán)形電橋和Marchand巴倫的仿真模型。3.LTCC微波無(wú)源器件小型化設(shè)計(jì)。對(duì)層間互聯(lián)通孔的等效傳輸線特性,主要是等效特性阻抗和等效電長(zhǎng)度進(jìn)行仿真分析;結(jié)合LTCC多層電路技術(shù)的優(yōu)勢(shì),利用枝節(jié)加載法對(duì)λg/4傳輸線進(jìn)行小型化改進(jìn),驗(yàn)證該小型化技術(shù)的可行性;最后針對(duì)耦合線定向耦合器、分支線電橋和環(huán)形電橋進(jìn)行了小型化設(shè)計(jì),達(dá)到了良好的效果。4.投版加工并測(cè)試,對(duì)比仿真模型,驗(yàn)證無(wú)源器件模型有效性,分析了小型化器件的性能,并依據(jù)測(cè)試結(jié)果對(duì)存在的問(wèn)題進(jìn)行了分析,提出了改進(jìn)思路。
[Abstract]:High density multilayer substrate is the key to realize MCM-multichip module. LTCC low temperature Co-fired Ceramic-based ceramic has become a hotspot in high speed and high density integrated packaging technology due to its unique advantages. At present, many units in our country already have the mature process line of LTCC microwave frequency band, but the research on LTCC modeling and building database and design platform is relatively backward, which seriously restricts the rapid development and design ability of LTCC products. The main work of this paper is the microwave LTCC design platform, modeling part of the database project, mainly for the common microwave passive devices and slot coupling structure, and do a part of the miniaturization design work. The main research contents are as follows: 1. Structure analysis of LTCC multilayer circuit. The commonly used transmission line structures are introduced, and the design analysis and empirical formulas are given. The simulation and optimization of LTCC interlayer and colayer interconnection transition structures are carried out. 2. LTCC microwave passive devices are modeled. This paper analyzes the working characteristics and index characteristics of microwave circuits, especially three-port and four-port networks, and establishes the mapping relationship between design indexes and physical dimensions based on analytical, empirical formulas and simulation optimization methods, and establishes the coupled line directional coupler. The simulation model of branch line coupler Wilkinson power divider ring bridge and Marchand Barron. 3. The miniaturization design of LTCC microwave passive devices. The characteristics of equivalent transmission line of interlayer interconnect holes are simulated and analyzed, which are mainly equivalent characteristic impedance and equivalent electric length, combined with the advantage of LTCC multilayer circuit technology, the 位 g / 4 transmission line is miniaturized by the branch loading method. Finally, the miniaturization design of coupling wire directional coupler, branch line bridge and annular bridge has been carried out, and good results have been achieved. 4. Compared with the simulation model, the validity of the passive device model is verified, the performance of the miniaturized device is analyzed, the existing problems are analyzed according to the test results, and the improvement ideas are put forward.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN62
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本文編號(hào)：2007953