本文選題：PLC + 芯吸缺陷�。� 參考：《江蘇大學(xué)》2017年碩士論文

【摘要】：在電子產(chǎn)品的生產(chǎn)過(guò)程中,表面組裝技術(shù)(Surface Mount Technology,簡(jiǎn)稱SMT)是很重要的一項(xiàng)工藝流程,在SMT焊接過(guò)程中常常會(huì)出現(xiàn)由于焊錫隨著電子元器件引腳上爬而產(chǎn)生的芯吸缺陷。激光燒蝕能夠剝?nèi)ル娮釉骷_表面的金層,形成“集錫處”,從而抑制芯吸缺陷的產(chǎn)生,在生產(chǎn)過(guò)程中有很大的研究意義與應(yīng)用前景。本文以一特定電子元器件為研究對(duì)象,根據(jù)實(shí)際的生產(chǎn)工序流程,完成了整個(gè)燒蝕系統(tǒng)的機(jī)械與電氣部分設(shè)計(jì),并確定了激光燒蝕的最佳工藝參數(shù)。本文提出的激光雙面燒蝕方法,在一定程度上提高了SMT焊接過(guò)程中抑制芯吸缺陷的能力。運(yùn)行調(diào)試結(jié)果表明,本文研究的基于PLC的激光自動(dòng)剝金系統(tǒng)有效地提高了“集錫處”的加工精度及生產(chǎn)效率,實(shí)現(xiàn)了生產(chǎn)的自動(dòng)化與機(jī)械化,便于較大規(guī)模地生產(chǎn)。具體研究工作如下:(1)以黃銅基材的試驗(yàn)樣品為研究對(duì)象,利用光纖激光器產(chǎn)生的連續(xù)激光進(jìn)行燒蝕,分析對(duì)比了燒蝕前后的表面粗糙度的變化,以及不同激光燒蝕參數(shù)下的粗糙度變化;根據(jù)粗糙度的變化規(guī)律,獲得了粗糙度與抑制芯吸缺陷能力強(qiáng)弱之間的關(guān)系;定性與定量地分析了實(shí)驗(yàn)數(shù)據(jù),得出了激光燒蝕參數(shù)與粗糙度之間的對(duì)應(yīng)關(guān)系;進(jìn)行了SEM電鏡試驗(yàn),觀測(cè)了燒蝕區(qū)域的表面形貌,對(duì)激光燒蝕區(qū)域的表面微觀形貌進(jìn)行了分析,得出了同一燒蝕區(qū)域內(nèi)不同的表面微觀形貌與不同激光參數(shù)下燒蝕區(qū)域表面微觀形貌的變化規(guī)律;最終對(duì)于本文所使用的一種特定的電子元器件給出了最佳激光燒蝕參數(shù)范圍。(2)按照整個(gè)生產(chǎn)流程,設(shè)計(jì)了送料裝置、翻轉(zhuǎn)機(jī)構(gòu)、定位裝置、拉料機(jī)構(gòu)、剎車裝置與裁切裝置;對(duì)氣缸、電磁閥等工控標(biāo)準(zhǔn)件進(jìn)行了選型;計(jì)算校核驗(yàn)證了關(guān)鍵受力部分;闡述了本文設(shè)計(jì)翻轉(zhuǎn)機(jī)構(gòu)實(shí)現(xiàn)雙面燒蝕的功能。(3)完成了整個(gè)系統(tǒng)的軟件設(shè)計(jì)與調(diào)試;對(duì)可編程控制器、伺服控制器、伺服電機(jī)以及氣缸等工控裝備進(jìn)行了選型;闡述了伺服控制器的參數(shù)設(shè)定;編寫(xiě)了伺服控制程序、氣缸控制程序、觸摸屏程序和激光燒蝕設(shè)備控制程序。本文設(shè)計(jì)的系統(tǒng)具有定位精準(zhǔn)度高、運(yùn)行快速平穩(wěn)和響應(yīng)速度快等優(yōu)點(diǎn),實(shí)現(xiàn)了激光雙面自動(dòng)剝金,燒蝕區(qū)域精度達(dá)到±0.0028)8),確保了高效性與高精度,燒蝕成品亦能滿足芯吸缺陷抑制要求,符合實(shí)際生產(chǎn)要求。
[Abstract]:Surface mount technology (SMTs) is an important process in the production of electronic products. In the process of SMT welding, the core absorption defects often occur due to solder climbing with the pin of electronic components. Laser ablation can strip the gold layer on the pin surface of electronic components and form "tin collecting place", which can restrain the production of core absorption defects. It has great research significance and application prospect in the process of production. In this paper, the mechanical and electrical parts of the whole ablation system are designed according to the actual process flow of a specific electronic component, and the optimum technological parameters of laser ablation are determined. The laser double-sided ablation method proposed in this paper improves to some extent the ability of restraining core suction defects in SMT welding process. The results of running and debugging show that the laser automatic gold stripping system based on PLC has effectively improved the processing precision and production efficiency of "tin collecting place", realized the automation and mechanization of production, and is convenient for large-scale production. The specific research work is as follows: (1) taking the experimental sample of brass substrate as the object of study, the continuous laser produced by fiber laser is used for ablation, and the change of surface roughness before and after ablation is analyzed and compared. According to the variation of roughness, the relationship between roughness and the ability of restraining core absorbing defects is obtained, and the experimental data are analyzed qualitatively and quantitatively. The relationship between laser ablation parameters and roughness was obtained, the surface morphology of ablation region was observed by SEM, and the surface microstructure of laser ablation region was analyzed. The variation rules of different surface morphology in the same ablation region and different laser parameters are obtained. Finally, the optimal range of laser ablation parameters for a particular electronic component used in this paper is given. According to the whole production process, the feeding device, the flip mechanism, the positioning device, the material pulling mechanism, the brake device and the cutting device are designed. The selection of industrial control standard parts, such as cylinder, solenoid valve and so on, is carried out; the key force part is verified by calculation and verification; the function of double-sided ablation is described in this paper, and the software design and debugging of the whole system are completed. The PLC, servo motor, cylinder and other industrial control equipment are selected, the parameter setting of the servo controller is expounded, the servo control program, the cylinder control program and so on are compiled. Touch screen program and laser ablation equipment control program. The system designed in this paper has the advantages of high positioning accuracy, fast and steady operation and fast response speed. The system realizes automatic gold stripping on both sides of the laser, and the precision of ablation area reaches 鹵0.0028, which ensures high efficiency and high precision. Ablation products can also meet the core absorption defect suppression requirements, in line with the actual production requirements.
【學(xué)位授予單位】：江蘇大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN405

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