本文選題：QFN + 分層　； 參考：《蘇州大學(xué)》2015年碩士論文

【摘要】：封裝是實(shí)現(xiàn)芯片工作性能的最后一環(huán)。對(duì)QFN(Qual Flat Non Lead,四方扁平無(wú)引腳封裝)而言,解決封裝中所產(chǎn)生的分層問題對(duì)延續(xù)產(chǎn)品壽命具有重要意義。本論文側(cè)重于QFN封裝中發(fā)生概率最高、最難以解決的基島面分層現(xiàn)象,結(jié)合分層面不同微觀表象,針對(duì)性設(shè)計(jì)多達(dá)32組DOE(Design of Experiment,實(shí)驗(yàn)設(shè)計(jì))實(shí)驗(yàn),經(jīng)驗(yàn)證,得出如下結(jié)果:(1)使用貼片膠代替貼片膜、在基島上表面增加凹槽設(shè)計(jì)、對(duì)框架上表面進(jìn)行棕化處理,能不同程度減小或消除框架基島上表面環(huán)芯片區(qū)的分層現(xiàn)象。對(duì)應(yīng)的考量參數(shù)分別是:彈性模量與熱膨脹系數(shù),結(jié)合面積,黏貼強(qiáng)度。(2)減小基島背部半蝕刻面積、對(duì)框架下表面進(jìn)行棕化處理,能不同程度減小和消除基島下表面區(qū)半蝕刻區(qū)的分層現(xiàn)象。對(duì)應(yīng)的考量參數(shù)分別是:填充間隙,黏貼強(qiáng)度。(3)改變框架貼膠帶模式、減小塑封樹脂的熱膨脹系數(shù),均不能使框架基島環(huán)芯片面的分層結(jié)果發(fā)生任何變化。(4)使用貼片膠代替貼片膜的局限性在于芯片堆疊層數(shù);在基島上表面增加凹槽設(shè)計(jì)的局限性在于芯片大小;減小基島背部半蝕刻設(shè)計(jì)的局限性在于客戶端焊盤設(shè)計(jì)。而棕化處理沒有任何局限性。綜上結(jié)論有,材料屬性(彈性模量、熱膨脹系數(shù)),框架設(shè)計(jì)(結(jié)合面積、填充間隙),棕化處理(黏貼強(qiáng)度)是解決分層的三個(gè)重要方向;針對(duì)不同分層現(xiàn)象、不同封裝結(jié)構(gòu)要求和不同客戶質(zhì)量要求,三者之間需要合理調(diào)配。
[Abstract]:Encapsulation is the last step to realize the working performance of the chip. For QFN(Qual Flat Non Lead, quadrilateral flat pin-less packaging, it is very important to solve the delamination problem in packaging. This paper focuses on the highest probability of occurrence and the most difficult to solve the phenomenon of basal island stratification in QFN packaging. In combination with different microcosmic images of different layers, 32 groups of DOE(Design of experimental design experiments are designed and verified. The results are as follows: (1) using patch glue instead of patch film, adding grooves to the surface of the base island and browning the upper surface of the frame can reduce or eliminate the delamination of the chip region on the surface of the frame island in varying degrees. The corresponding parameters are as follows: elastic modulus and thermal expansion coefficient, bonding area, adhesive strength. It can reduce and eliminate the delamination of the semi-etched area on the subsurface of the basal island to varying degrees. The corresponding parameters are as follows: filling gap, adhesive strength. 3) changing the pattern of frame adhesive tape and reducing the coefficient of thermal expansion of plastic seal resin. The limitation of using patch glue instead of patch film lies in the number of stacking layers of chip, the limitation of adding groove to the surface of base island is chip size. The limitation of base island back half etching design is client pad design. However, the browning process has no limitations. It is concluded that the properties of materials (modulus of elasticity, coefficient of thermal expansion), frame design (bonding area, filling gap), brown treatment (adhesive strength) are three important directions to solve the problem of delamination. Different packaging structure requirements and different customer quality requirements, the three need to be reasonably deployed.
【學(xué)位授予單位】：蘇州大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405

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本文編號(hào)：1976882