第一鍵合點(diǎn)銅線焊接的延時(shí)結(jié)球與三步鍵合技術(shù)研究
發(fā)布時(shí)間:2018-05-18 08:50
本文選題:銅線鍵合 + 延時(shí)結(jié)球 ; 參考:《蘇州大學(xué)》2015年碩士論文
【摘要】:研究背景有三:銅線和金線相比具有良好的電性能、機(jī)械性能和價(jià)格優(yōu)勢(shì);傳統(tǒng)鍵合的故障率占比為1/4到1/3;產(chǎn)線曾出現(xiàn)第一鍵合點(diǎn)銅球焊接失效的典型問題。作者負(fù)責(zé)制程的銅線鍵合工藝,以22μm銅線為例,統(tǒng)計(jì)發(fā)現(xiàn)存在著參數(shù)不穩(wěn)定、虛焊、銅球氧化和焊球拉提等具體問題,通過比較產(chǎn)線數(shù)據(jù)記錄、分析焊點(diǎn)失效和調(diào)研鍵合文獻(xiàn),重點(diǎn)分析了三個(gè)工藝參數(shù),分別是結(jié)球時(shí)間、超聲能量和劈刀壓力,通過掃參配比,具體實(shí)踐了延遲結(jié)球和三步鍵合的工藝技巧,此舉已將良率穩(wěn)定提升至相對(duì)滿意的水平。系列改良結(jié)果使得公司的產(chǎn)能增長了近1/5。本技術(shù)解決方案,因細(xì)化了工藝窗口,或可成為推動(dòng)相關(guān)產(chǎn)線優(yōu)化鍵合關(guān)鍵參數(shù)的技術(shù)參考。
[Abstract]:There are three research background: copper wire has good electrical performance, mechanical property and price advantage compared with gold wire; the failure rate of traditional bonding is 1 / 4 to 1 / 3; the production line has the typical problem of the first bond point copper ball welding failure. The author is responsible for the copper wire bonding process. Taking 22 渭 m copper wire as an example, it is found that there are some specific problems such as parameter instability, virtual welding, copper ball oxidation and solder ball pulling. By comparing the production line data records, the paper analyzes the failure of solder joint and the investigation and bonding literature. Three technological parameters, namely, the time of ball junction, ultrasonic energy and chopper pressure, are emphatically analyzed. The process techniques of delayed balling and three-step bonding are concretely practiced through the sweep ratio, which has steadily promoted the yield to a relatively satisfactory level. A series of improvements led to a nearly one-fifth increase in the company's capacity. The technical solution, because of the refinement of the process window, may be a technical reference to promote the optimization of key parameters of production line bonding.
【學(xué)位授予單位】:蘇州大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN405
【參考文獻(xiàn)】
相關(guān)期刊論文 前1條
1 丁雨田;曹軍;許廣濟(jì);寇生中;胡勇;;電子封裝Cu鍵合絲的研究及應(yīng)用[J];鑄造技術(shù);2006年09期
,本文編號(hào):1905208
本文鏈接:http://sikaile.net/kejilunwen/dianzigongchenglunwen/1905208.html
最近更新
教材專著