本文選題：輪式拋光技術(shù) + 廣義Preston方程�。� 參考：《哈爾濱工業(yè)大學(xué)》2015年碩士論文

【摘要】：現(xiàn)今,光學(xué)元件以其良好的性能在各個(gè)領(lǐng)域得到了廣泛的應(yīng)用。非球面元件具有消除像差、減少色散、簡(jiǎn)化結(jié)構(gòu)和降低成本的作用。在紅外光學(xué)系統(tǒng)中,質(zhì)地硬脆、熱變形小、紅外波段透過率高的非球面單晶硅透鏡需求量越來越大,并且對(duì)表面粗糙度和面形的要求也越來越高。而傳統(tǒng)的硅透鏡加工,無論是從生產(chǎn)效率還是加工精度都無法滿足光學(xué)系統(tǒng)對(duì)硅透鏡提出的極高加工和表面粗糙度的要求。因此,研究出一種高效、高精度的光學(xué)非球面技術(shù)具有重要意義。本文重點(diǎn)介紹了一種新形式的拋光技術(shù):輪式拋光技術(shù),即通過計(jì)算機(jī)控制拋光軌跡,利用自行開發(fā)的柔性拋光輪通過拋光液中的氧化鋁顆粒正壓力作用下,對(duì)工件表面材料進(jìn)行微磨削作用,在非球面表面準(zhǔn)確進(jìn)行材料去除,從而獲得較好的表面粗糙度和面形精度。為此本文主要研究了以下內(nèi)容:結(jié)合輪式拋光技術(shù)需要法向加載拋光壓力的特點(diǎn),搭建了基于B軸的拋光平臺(tái)。針對(duì)拋光主軸安裝在B軸中心的偏置誤差會(huì)使得拋光壓力改變的問題,分析安裝偏置誤差影響規(guī)律,并提出了三種偏置誤差測(cè)量方式,并通過設(shè)計(jì)的三維微位移調(diào)整臺(tái)進(jìn)行調(diào)整,波紋面車削實(shí)驗(yàn)結(jié)果表明面形誤差在3μm左右。結(jié)合本拋光平臺(tái)特點(diǎn),設(shè)計(jì)了離線超精密拋光輪修整方案,圓跳動(dòng)在14μm。結(jié)合Hertz接觸相關(guān)理論知識(shí),分析了拋光輪與工件接觸區(qū)域的大小、壓力分布等。在此基礎(chǔ)上運(yùn)用運(yùn)動(dòng)學(xué)和Preston假設(shè)的知識(shí),建立輪式拋光技術(shù)的半經(jīng)驗(yàn)去除函數(shù)模型,并對(duì)此種拋光技術(shù)對(duì)平面工件加工情況進(jìn)行了仿真分析。在理論模型的基礎(chǔ)上,設(shè)計(jì)了關(guān)于拋光壓力、拋光時(shí)間和拋光輪轉(zhuǎn)速的定點(diǎn)單因素工藝實(shí)驗(yàn),獲得了不同參數(shù)下的拋光去除體積以及形貌,根據(jù)去除坑輪廓的不對(duì)稱性,將壓力模型下進(jìn)行了修正,更加貼近實(shí)際加工。通過數(shù)據(jù)擬合計(jì)算出廣義Preston系數(shù)以及速度修正指數(shù)。設(shè)計(jì)環(huán)帶正交拋光工藝實(shí)驗(yàn),分析了拋光工藝參數(shù)對(duì)輪式拋光技術(shù)加工單晶硅表面的拋光去除效率和表面粗糙度的影響規(guī)律,最后結(jié)合拋光特點(diǎn)優(yōu)選出最佳的拋光工藝參數(shù)。最后結(jié)合去除函數(shù)通過離散矩陣算法計(jì)算駐留時(shí)間,并對(duì)口徑為30mm的單晶硅平面、半徑300mm的凸球面以及非球面進(jìn)行了拋光加工實(shí)驗(yàn),得到表面粗糙度分別為3.8nm、4.3nm和4.6nm,并且面形也得到一定的改善,驗(yàn)證了輪式拋光技術(shù)良好的加工性能。
[Abstract]:Nowadays, optical elements have been widely used in various fields because of their good performance. Aspheric elements can eliminate aberration, reduce dispersion, simplify structure and reduce cost. In infrared optical system, the demand for aspheric monocrystalline silicon lens with hard and brittle texture, small thermal deformation and high transmittance in infrared band is increasing, and the demand for surface roughness and surface shape is also increasing. However, the traditional silicon lens processing, whether from the production efficiency or machining accuracy, can not meet the optical system for silicon lens processing and surface roughness requirements. Therefore, it is of great significance to develop an efficient and accurate optical aspherical technique. In this paper, a new type of polishing technology, wheeled polishing, is introduced, which is controlled by computer, and the flexible polishing wheel is developed under the positive pressure of alumina particles in the polishing fluid. The surface of workpiece is ground by micro-grinding, and the material is removed accurately on the aspherical surface, so that the better surface roughness and surface shape accuracy can be obtained. The main contents of this paper are as follows: the polishing platform based on B axis is built according to the characteristic that the wheel polishing technology needs normal loading polishing pressure. Aiming at the problem that the bias error of the polishing spindle installed in the center of the B axis will cause the change of the polishing pressure, this paper analyzes the influence law of the installation bias error, and puts forward three ways to measure the bias error. The experimental results of corrugated surface turning show that the error of surface shape is about 3 渭 m. According to the characteristics of the polishing platform, an off-line ultra-precision polishing wheel dressing scheme is designed. The circle runout is 14 渭 m. Based on the theory of Hertz contact, the size and pressure distribution of contact area between polishing wheel and workpiece are analyzed. Based on the knowledge of kinematics and Preston hypothesis, the semi-empirical removal function model of wheel polishing technology is established, and the machining of planar workpiece is simulated and analyzed. On the basis of theoretical model, single factor experiments on polishing pressure, polishing time and rotation speed of polishing wheel are designed. The removal volume and morphology of polishing are obtained under different parameters. The pressure model is modified to get closer to the actual processing. The generalized Preston coefficient and velocity correction index are calculated by data fitting. The experiment of ring belt orthogonal polishing was designed, and the influence of polishing parameters on the removal efficiency and surface roughness of single crystal silicon surface was analyzed. Finally, the best polishing process parameters were selected according to the polishing characteristics. Finally, the dwell time is calculated by the discrete matrix algorithm combined with the removal function, and the polishing experiments are carried out on the single crystal silicon plane with the aperture of 30mm, the convex sphere with radius 300mm and the aspheric surface. The surface roughness is 3.8 nm and 4.6 nm, respectively, and the surface shape is improved to a certain extent, which verifies the good machinability of wheel polishing technology.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN305.2

【引證文獻(xiàn)】

相關(guān)會(huì)議論文 前1條

1 尹韶輝;徐志強(qiáng);;小口徑單晶硅非球面復(fù)合超精密加工工藝[A];中國光學(xué)學(xué)會(huì)2011年學(xué)術(shù)大會(huì)摘要集[C];2011年

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本文編號(hào)：1853233