本文選題：紙基覆銅板 + 腰果酚改性酚醛樹脂�。� 參考：《絕緣材料》2017年03期

【摘要】：通過腰果酚與苯酚的加成反應(yīng)合成了一種新型的酚醛樹脂,制備了一種XPC紙基覆銅板,并研究了原料配比和制備工藝對覆銅板性能的影響,測試了其耐浸焊性、吸水率和體積電阻率等性能。結(jié)果表明:采用優(yōu)化原料配比和工藝制備的紙基覆銅板,其耐浸焊性為25~30 s(260℃),吸水率低于1.3%,且具有優(yōu)良的電絕緣性能和耐熱性能。
[Abstract]:A new type of phenolic resin was synthesized by the addition reaction of cardanol and phenol . An XPC paper - based copper - clad plate was prepared . The properties of copper - clad laminate were studied by the ratio of raw materials and the process of preparation . The results showed that the resistance to dip - welding , water absorption and volume resistivity of the copper - clad laminate were tested . The results show that the resistance to dip - welding is 25 - 30 s ( 260 鈩，

本文編號：1830076