本文選題：熱設(shè)計(jì) + 電子元件　； 參考：《長(zhǎng)安大學(xué)》2017年碩士論文

【摘要】：隨著電動(dòng)汽車以及電力電子設(shè)備技術(shù)的飛速發(fā)展,電子設(shè)備的組成元件正朝著小尺寸、大功率、高集成的方向發(fā)展,由此造成電子元件的熱流密度逐步上升,當(dāng)熱流密度超過(guò)一定的上限時(shí)會(huì)使電子元件工作時(shí)的溫度太高而引發(fā)熱失效問(wèn)題。印制電路板PCB和電子元件在電子設(shè)備中有極為廣泛的應(yīng)用,對(duì)其進(jìn)行熱設(shè)計(jì)和熱分析對(duì)汽車電器設(shè)備的性能提升有重要意義。本文運(yùn)用模擬退火算法對(duì)某一PCB板上若干電子元件的溫度布局進(jìn)行了優(yōu)化研究。以9個(gè)陣列在PCB上電子元件為研究對(duì)象,運(yùn)用有限差分法求解出PCB上電子元件溫度的一般方程式,并應(yīng)用模擬退火算法獲得優(yōu)化前后電子元件的布局。本文隨后利用紅外成像技術(shù),對(duì)上述理論優(yōu)化結(jié)果進(jìn)行實(shí)驗(yàn)驗(yàn)證。實(shí)驗(yàn)結(jié)果表明:所有不同工況下電子元件的全局最高溫度都得到了不同程度的下降,最高降幅8.7%,最低降幅6.5%,證明運(yùn)用模擬退火算法優(yōu)化PCB上電子元件熱布局方法有明顯效果。最后利用三維仿真軟件Icepak針對(duì)本文研究?jī)?nèi)容進(jìn)行仿真研究。首先進(jìn)行各個(gè)工況下優(yōu)化前后實(shí)驗(yàn)結(jié)果與仿真結(jié)果對(duì)比研究,然后再對(duì)各個(gè)工況優(yōu)化前后仿真結(jié)果對(duì)比研究,結(jié)果表明:1)各個(gè)工況下相同電子元件溫度實(shí)驗(yàn)值與仿真值的相對(duì)偏差小于10%,仿真模型建立合理;2)仿真中所有工況全局電子元件最高溫度都有明顯不同程度降低,證明優(yōu)化方法有效;3)數(shù)值模擬可以在一定誤差條件下取代實(shí)驗(yàn),在工程應(yīng)用中發(fā)揮巨大潛力。
[Abstract]:With the rapid development of electric vehicle and power electronic equipment technology, the components of electronic equipment are developing towards the direction of small size, high power and high integration. When the heat flux exceeds a certain upper limit, the temperature of electronic components will be too high to cause thermal failure. Printed circuit board (PCB) and electronic components are widely used in electronic equipment. Thermal design and thermal analysis are of great significance to improve the performance of automotive electrical equipment. In this paper, simulated annealing algorithm is used to optimize the temperature distribution of some electronic components on a PCB board. The finite difference method is used to solve the general equation of the temperature of electronic elements on PCB with nine arrays on PCB. The simulated annealing algorithm is used to obtain the optimized layout of electronic components. In this paper, infrared imaging technology is used to verify the above theoretical optimization results. The experimental results show that the global maximum temperature of electronic components in all different working conditions has been decreased to varying degrees, the highest drop is 8.7, and the lowest is 6.5. It is proved that the simulated annealing algorithm is effective in optimizing the thermal layout of electronic components on PCB. At last, the three-dimensional simulation software Icepak is used to simulate the content of this paper. First, the comparison between the experimental results and the simulation results before and after the optimization under each working condition is carried out, and then the simulation results before and after the optimization under each working condition are compared. The results show that the relative deviation between the experimental value of the same electronic component and the simulation value is less than 10 under each working condition, and the simulation model is reasonable.) in all the simulation conditions, the maximum temperature of the global electronic component has obviously decreased in varying degrees. It is proved that the optimization method is effective and the numerical simulation can replace the experiment under certain error conditions, thus exerting great potential in engineering application.
【學(xué)位授予單位】：長(zhǎng)安大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN41

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 李爭(zhēng);邢殿輝;高培峰;;電機(jī)功率逆變器三維溫度場(chǎng)計(jì)算及散熱結(jié)構(gòu)設(shè)計(jì)[J];微電機(jī);2015年08期

2 吳高峰;冉振云;陳奇志;;EPS無(wú)刷電機(jī)控制器結(jié)構(gòu)設(shè)計(jì)與散熱性能試驗(yàn)[J];現(xiàn)代電子技術(shù);2014年22期

3 余慧;吳昊;陳更生;童家榕;;一種堆疊式3D IC的最小邊界熱分析方法[J];電子學(xué)報(bào);2012年05期

4 呂洪濤;;電子設(shè)備散熱技術(shù)探討[J];電子機(jī)械工程;2011年05期

5 袁曉明;;永磁無(wú)刷直流電機(jī)控制器的散熱設(shè)計(jì)[J];現(xiàn)代電子技術(shù);2011年14期

6 王亞春;;淺談電子設(shè)備熱控制方法及維護(hù)[J];中國(guó)新技術(shù)新產(chǎn)品;2011年11期

7 劉兆洪;龐傳和;;飛行器設(shè)備熱設(shè)計(jì)、試驗(yàn)驗(yàn)證方法探討[J];航天器環(huán)境工程;2009年S1期

8 梁穎;黃春躍;閻德勁;李天明;;基于熱疊加模型的疊層3D多芯片組件芯片熱布局優(yōu)化研究[J];電子學(xué)報(bào);2009年11期

9 楊永軍;;溫度測(cè)量技術(shù)現(xiàn)狀和發(fā)展概述[J];計(jì)測(cè)技術(shù);2009年04期

10 平麗浩;錢吉裕;徐德好;;電子裝備熱控新技術(shù)綜述(上)[J];電子機(jī)械工程;2008年01期

相關(guān)碩士學(xué)位論文 前2條

1 高山;電路組件熱仿真建模方法研究與熱設(shè)計(jì)[D];電子科技大學(xué);2013年

2 李亮;快速插拔航天電子機(jī)箱關(guān)鍵技術(shù)研究[D];沈陽(yáng)航空航天大學(xué);2013年

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