本文選題：光電子學(xué) + 光互聯(lián)��； 參考：《激光與光電子學(xué)進(jìn)展》2016年08期

【摘要】：柔性光電印制電路板(FEOPCB)作為板級(jí)光互聯(lián)的新發(fā)展方向,不僅具有光互聯(lián)的巨大優(yōu)勢(shì),而且還具有柔性電路板的特性,可實(shí)現(xiàn)不同子系統(tǒng)間的柔性互聯(lián),能夠滿足高速電子系統(tǒng)輕量化、小型化和高性能化的發(fā)展趨勢(shì)。對(duì)國(guó)內(nèi)外柔性光電電路的研究現(xiàn)狀進(jìn)行了詳細(xì)的闡述與分析,并探討了該互聯(lián)電路的關(guān)鍵技術(shù)及未來研究方向。
[Abstract]:As a new development direction of board level optical interconnection, flexible optoelectronic printed circuit board (FEEPC B) not only has the great advantages of optical interconnection, but also has the characteristics of flexible circuit board, which can realize flexible interconnection among different subsystems. It can meet the development trend of high speed electronic system such as lightweight, miniaturization and high performance. The research status of flexible optoelectronic circuit at home and abroad is described and analyzed in detail, and the key technology and future research direction of the interconnection circuit are discussed.
【作者單位】： 中國(guó)電子科技集團(tuán)公司第三十研究所;
【分類號(hào)】：TN491
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本文編號(hào)：1810157