發(fā)布時(shí)間：2018-04-21 20:14

  本文選題：電磁干擾 + 輻射��； 參考：《浙江大學(xué)》2017年碩士論文

【摘要】：隨著數(shù)據(jù)傳輸速率和工作帶寬的提升,芯片的封裝設(shè)計(jì)面臨著日益嚴(yán)峻的電磁兼容(Electromagnetic Compatibility,EMC)挑戰(zhàn)。電磁干擾(Electromagnetic Interference,EMI)作為電磁兼容領(lǐng)域的核心議題,一直是學(xué)術(shù)界和工業(yè)界的研究熱點(diǎn)。因此,本文圍繞公司商用的芯片封裝集成技術(shù),探究了其在高速信號(hào)傳輸下的EMI風(fēng)險(xiǎn),并進(jìn)行相應(yīng)的解決方案研究。本文首先基于引線鍵合式方形扁平封裝(Wire-Bonded Quad Flat Package,WB-QFP)和引線鍵合式球柵陣列封裝(Wire-Bonded Ball Grid Array,WB-BGA),探究了它們?cè)诟咚傩盘?hào)傳輸下的EMI風(fēng)險(xiǎn)。文中以美國(guó)聯(lián)邦通訊委員會(huì)(Federal Communications Commission,FCC)對(duì)無意輻射的電場(chǎng)限值作為主要依據(jù),結(jié)合S參數(shù)、表面電流分布、電場(chǎng)分布等依據(jù),詳細(xì)闡述和分析了潛在的風(fēng)險(xiǎn)項(xiàng)。其中,鍵合線、基板表層介質(zhì)厚度和基板介電常數(shù)是WB-QFP封裝在25 GHz內(nèi)最主要的EMI風(fēng)險(xiǎn)項(xiàng)。封裝蓋和鍵合線是WB-BGA封裝在25 GHz內(nèi)最主要的EMI風(fēng)險(xiǎn)項(xiàng)。此外,我們構(gòu)建了鍵合線的等效電路,結(jié)合全波和電路仿真準(zhǔn)確預(yù)測(cè)了諧振頻率。接著,針對(duì)WB-BGA封裝面臨的EMI風(fēng)險(xiǎn),本文提出了幾種切實(shí)可行的解決方案,包括基于電磁帶隙(ElectromagneticBandgap,EBG)結(jié)構(gòu)的新型封裝蓋、阻性過孔、阻性封裝蓋和鍵合線返回路徑。這些技術(shù)方案均可以有效抑制寬帶高頻輻射,尤其是阻性封裝蓋在3～25 GHz內(nèi)實(shí)現(xiàn)了超過10 dBμV/m的抑制效果。最后,本文結(jié)合傳統(tǒng)的EMI屏蔽結(jié)構(gòu)和石墨烯獨(dú)特的電學(xué)性能,設(shè)計(jì)了兩款基于石墨烯周期性圖案的寬帶EMI屏蔽結(jié)構(gòu),在39.2～200 GHz內(nèi)實(shí)現(xiàn)了 95%的吸收率。文中詳細(xì)分析了屏蔽結(jié)構(gòu)的參數(shù)特性和工作機(jī)制。
[Abstract]:With the improvement of data transmission rate and working bandwidth, the packaging design of the chip is facing more and more serious challenges of electromagnetic compatibility (EMC). Electromagnetic interference (EMI), as the core topic of electromagnetic compatibility (EMC), has been a hot research topic in academia and industry. Therefore, in this paper, the EMI risk under high speed signal transmission is explored and the corresponding solutions are studied around the chip packaging and integration technology of the company. Firstly, based on Wire-Bonded Quad Flat package WB-QFP) and lead bonded ball gate array package Wire-Bonded Ball Grid Arrayn WB-BGAA, this paper explores their EMI risks under high speed signal transmission. Based on the electric field limit value of the Federal Communications Commission for unintentional radiation, the potential risk terms are described and analyzed in detail according to the S parameters, surface current distribution, electric field distribution and so on. The bonding line, the thickness of the substrate surface medium and the dielectric constant of the substrate are the most important EMI risk factors for WB-QFP encapsulation in 25 GHz. The capping and bonding lines are the main EMI risk items for WB-BGA encapsulation within 25 GHz. In addition, the equivalent circuit of the bonding line is constructed, and the resonant frequency is accurately predicted by combining the full wave and circuit simulation. Then, in view of the EMI risk of WB-BGA packaging, this paper proposes several feasible solutions, including a new packaging cover based on electromagnetic band-gap (EBA) structure, a resistive through hole, a resistive package cover and a bonding line return path. These technical schemes can effectively suppress broadband high frequency radiation, especially the resistive packaging cover can achieve more than 10 dB 渭 V / m suppression effect in 310dB / 25 GHz. Finally, combined with the traditional EMI shielding structure and the unique electrical properties of graphene, two broad band EMI shielding structures based on graphene periodic pattern are designed. The absorptivity of 95% is achieved in 39.2 GHz. The parameter characteristics and working mechanism of shield structure are analyzed in detail.
【學(xué)位授予單位】：浙江大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN03

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本文編號(hào)：1783939