本文選題：高速PCB板 + 傳輸線��； 參考：《華中科技大學》2015年碩士論文

【摘要】：印制電路板(PCB)作為傳輸高速信號的載體,在通信、計算機、航空等領域扮演著非常重要的角色。隨著信息技術的進步,PCB板自身面臨著嚴峻的挑戰(zhàn)。一方面,隨著PCB板體積的減小和集成度的增加,布線變得密集;另一方面,PCB板上傳輸?shù)男盘柹仙刈兌獭⑿盘査俾始哟�。以上兩個方面將導致反射、串擾、輻射等信號完整性問題。信號完整性問題會使數(shù)字電路誤觸發(fā)、輸出信號波形畸變和系統(tǒng)不穩(wěn)定等,在很大程度上影響產(chǎn)品的性能。因此,在設計之初需要對傳輸線進行信號完整性分析,盡可能將出現(xiàn)的問題放在設計階段解決,從而縮短生成周期并完善PCB板性能,最終提高產(chǎn)品經(jīng)濟效益。首先,本文對高速PCB板上的兩種典型布線(即單端線和差分線)進行了信號完整性分析。由于散射參數(shù)可以用來評估信號完整性的反射、串擾等問題,故圍繞散射參數(shù),從理論上分析兩彎曲耦合微帶線和差分線間的散射參數(shù)。具體來說:對彎曲耦合微帶線,采用分段分析方法,將其分為平行部分和彎曲部分。對于平行部分,使用奇偶模分析法;對于彎曲部分,使用?電路建模。對于差分線間的串擾,應用多導體傳輸線理論中的鏈路參數(shù)矩陣來描述輸入和輸出端電壓和電流的關系,然后將鏈路參數(shù)矩陣轉化成混合模散射參數(shù)矩陣。最后,結合具體PCB板,應用理論推導和電磁軟件仿真,對比結果驗證了理論分析的有效性。接著,本文結合16層PCB板,進行一系列信號完整性仿真分析。首先對16層PCB板進行完整性檢查,得到串擾超過規(guī)定閾值的問題網(wǎng)絡。對這些網(wǎng)絡進行串擾仿真和電磁干擾(EMI)測量,并將測量結果與國際標準值比較。對于幅值超過標準值的傳輸線進行優(yōu)化設計,保證其滿足輻射要求。此外,對PCB板上典型傳輸線進行了散射參數(shù)仿真和差分眼圖分析�？傊�,本文依托散射參數(shù),從理論上分析傳輸線的信號完整性問題。并結合實際PCB板,進行傳輸線的信號完整性系列仿真。本文提出的PCB板信號完整性仿真分析方法可以為其它PCB板仿真提供借鑒。
[Abstract]:As a carrier of high speed signal, printed circuit board (PCB) plays a very important role in communication, computer, aviation and so on.With the development of information technology, PCB board itself is facing severe challenges.On the one hand, with the decrease of the volume and the increase of integration, the wiring becomes dense; on the other hand, the rising edge of the signal transmitted on the PCB board becomes shorter and the signal rate increases.The above two aspects will lead to signal integrity problems such as reflection, crosstalk and radiation.The signal integrity will cause the digital circuit to trigger by mistake, the output signal waveform distortion and the system instability and so on, which will affect the performance of the product to a great extent.Therefore, it is necessary to analyze the signal integrity of the transmission line at the beginning of design, and to solve the problems as far as possible in the design stage, so as to shorten the generation period and improve the performance of PCB board, and finally improve the economic benefit of the product.Firstly, the signal integrity of two typical cabling lines (single terminal and differential line) on high speed PCB board is analyzed.Because scattering parameters can be used to evaluate the reflection and crosstalk of signal integrity, the scattering parameters between two curved coupled microstrip lines and differential lines are theoretically analyzed around the scattering parameters.To be more specific, the bending coupling microstrip line is divided into parallel part and bending part by subsection analysis method.For parallel parts, use parity mode analysis; for bending parts, use?Circuit modeling.For the crosstalk between differential lines, the link parameter matrix in the theory of multi-conductor transmission lines is used to describe the relationship between input and output voltage and current, and then the link parameter matrix is transformed into a mixed mode scattering parameter matrix.Finally, the effectiveness of the theoretical analysis is verified by theoretical derivation and electromagnetic software simulation combined with the concrete PCB board.Then, a series of signal integrity simulation analysis based on 16-layer PCB board is carried out.Firstly, the integrity of 16-layer PCB board is checked, and the problem network whose crosstalk exceeds the specified threshold is obtained.The crosstalk simulation and EMI measurements of these networks are carried out, and the results are compared with the international standard values.The transmission line whose amplitude exceeds the standard value is optimized to meet the radiation requirement.In addition, the scattering parameters of typical transmission lines on PCB plate are simulated and the differential ophthalmograms are analyzed.In a word, based on scattering parameters, the signal integrity of transmission line is analyzed theoretically.And combined with the actual PCB board, the transmission line signal integrity series simulation.The simulation method of PCB board signal integrity presented in this paper can be used for reference for other PCB board simulation.
【學位授予單位】：華中科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN41

【引證文獻】

相關碩士學位論文 前1條

1 王南;基于DM8107平臺的無人機視頻解碼系統(tǒng)硬件設計[D];浙江大學;2017年

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本文編號：1773629