本文選題：SnAgCu + 剪切強(qiáng)度��； 參考：《哈爾濱理工大學(xué)》2015年碩士論文

【摘要】：科學(xué)技術(shù)的發(fā)展推動(dòng)著電子產(chǎn)品的不斷升級(jí)，微電子封裝技術(shù)在電子產(chǎn)業(yè)中起到的作用越來越大，BGA封裝技術(shù)對(duì)促進(jìn)電子器件微小化，節(jié)能化起到了很大的幫助。焊點(diǎn)作為BGA封裝結(jié)構(gòu)中的關(guān)鍵部位，起到了物理支撐、導(dǎo)電導(dǎo)熱，傳遞信號(hào)的作用，其可靠性決定著電子產(chǎn)品的穩(wěn)定性及使用壽命。焊點(diǎn)的剪切實(shí)驗(yàn)是用來評(píng)價(jià)焊點(diǎn)與基板結(jié)合強(qiáng)度的常用方法，對(duì)焊點(diǎn)的可靠性研究提供了一定的參考依據(jù)。 本文通過有限元模擬及實(shí)驗(yàn)分析方法對(duì)SAC305/Cu焊點(diǎn)的剪切力學(xué)行為進(jìn)行了研究。首先，利用有限元分析方法對(duì)SAC305/Cu焊點(diǎn)進(jìn)行了不同剪切速度下的應(yīng)力應(yīng)變分析，分析剪切速度對(duì)焊點(diǎn)剪切強(qiáng)度的影響規(guī)律。其次，對(duì)SAC305/Cu焊點(diǎn)進(jìn)行了不同剪切速度下的剪切實(shí)驗(yàn)，對(duì)比結(jié)果表明有限元分析方法得到的數(shù)據(jù)與實(shí)驗(yàn)得到的數(shù)據(jù)趨勢(shì)大體相一致。再次，對(duì)SAC305/Cu焊點(diǎn)進(jìn)行了在不同剪切高度下的有限元模擬及實(shí)驗(yàn)分析。然后，對(duì)不同直徑條件下的SAC305/Cu焊點(diǎn)進(jìn)行了有限元模擬分析，分析結(jié)果表明該焊點(diǎn)存在著一定的“尺寸效應(yīng)”。運(yùn)用有限元分析方法對(duì)SAC305/Cu焊點(diǎn)在不同IMC層厚度條件下進(jìn)行了有限元模擬分析，分析結(jié)果表明IMC層對(duì)焊點(diǎn)的剪切力學(xué)性能有著很大的影響。 本文對(duì)高低銀SAC305/Cu和SAC0307/Cu進(jìn)行了剪切實(shí)驗(yàn)及分析，得到在不同剪切速度下， SAC305/Cu焊點(diǎn)表現(xiàn)的剪切力學(xué)強(qiáng)度高于SAC0307/Cu焊點(diǎn)。在不同的剪切高度下做對(duì)比分析，得到SAC305/Cu焊點(diǎn)的剪切力學(xué)強(qiáng)度高于SAC0307/Cu焊點(diǎn)。對(duì)兩種焊點(diǎn)在不同直徑條件下的剪切強(qiáng)度做對(duì)比分析，，以及在焊點(diǎn)時(shí)效后IMC層的增長(zhǎng)趨勢(shì)分析中，得到SAC305/Cu焊點(diǎn)較SAC0307/Cu焊點(diǎn)的綜合力學(xué)性能好。
[Abstract]:The development of science and technology promotes the upgrading of electronic products. The microelectronic packaging technology plays a more and more important role in the electronic industry. BGA packaging technology plays a great role in promoting the miniaturization and energy-saving of electronic devices.As a key part of BGA packaging structure, solder joint plays the role of physical support, conductive heat conduction and signal transfer. The reliability of solder joint determines the stability and service life of electronic products.The shear test of solder joint is a common method to evaluate the bonding strength between solder joint and substrate.In this paper, the shear mechanical behavior of SAC305/Cu solder joints is studied by finite element simulation and experimental analysis.Firstly, the stress and strain analysis of SAC305/Cu solder joints at different shear speeds is carried out by using finite element analysis method, and the influence of shear velocity on the shear strength of solder joints is analyzed.Secondly, the shear experiments of SAC305/Cu solder joints are carried out at different shear rates. The results show that the data obtained by the finite element method are in good agreement with the experimental data.Thirdly, finite element simulation and experimental analysis of SAC305/Cu solder joints at different shear heights are carried out.Then, the finite element analysis of SAC305/Cu solder joints with different diameters is carried out. The results show that the solder joints have a certain "size effect".The finite element analysis method is used to simulate the SAC305/Cu solder joints under different IMC layer thickness. The results show that the IMC layer has a great influence on the shear mechanical properties of the solder joints.In this paper, shear test and analysis of high and low silver SAC305/Cu and SAC0307/Cu are carried out. The results show that the shear mechanical strength of SAC305/Cu solder joints is higher than that of SAC0307/Cu solder joints at different shear rates.The shear mechanical strength of SAC305/Cu solder joint is higher than that of SAC0307/Cu solder joint.The shear strength of two kinds of solder joints under different diameter conditions was compared and the growth trend of IMC layer after solder joint aging was analyzed. It was found that the comprehensive mechanical properties of SAC305/Cu solder joint were better than that of SAC0307/Cu solder joint.
【學(xué)位授予單位】：哈爾濱理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN05

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