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用于IRFPA ROIC的高性能緩沖器模塊的設計

發(fā)布時間:2018-04-15 16:42

  本文選題:紅外焦平面讀出電路 + 緩沖器模塊。 參考:《半導體光電》2017年04期


【摘要】:紅外焦平面讀出電路(IRFPA ROIC)主要用于焦平面陣列與后續(xù)信號處理之間的通信。文章提出了一種用于紅外焦平面讀出電路的緩沖器模塊,包括列緩沖器、高性能的輸出緩沖器以及相應的偏置電路。緩沖器均采用單位增益放大器結(jié)構(gòu),通過放大器的優(yōu)化設計可實現(xiàn)對不同負載的有效驅(qū)動且靜態(tài)功耗較低。該緩沖器模塊用于一款640×512面陣、30μm中心距的中波紅外焦平面讀出電路,采用CSMC 0.5μm DPTM工藝進行流片加工。仿真結(jié)果表明,列緩沖器的開環(huán)增益為40.00dB,單位增益帶寬為48.17MHz(10pF)。輸出緩沖器可實現(xiàn)軌到軌的輸入,開環(huán)增益為39.68dB,單位增益帶寬為46.08 MHz,讀出速率高達20 MHz,功耗為16.02 mW(25pF∥5.1kΩ)。該模塊輸入端拉出的測試管腳可在焦平面讀出電路的晶圓測試中幫助驗證芯片功能。通過調(diào)節(jié)測試端口,測試結(jié)果與仿真結(jié)果大體一致,驗證了該緩沖器模塊的設計可行。
[Abstract]:Infrared focal plane readout circuit (IRFPA ROI) is mainly used for communication between focal plane array and subsequent signal processing.This paper presents a buffer module for infrared focal plane readout circuits, including column buffers, high performance output buffers and corresponding bias circuits.The buffers all adopt the unit gain amplifier structure. By the optimization design of the amplifier, the effective drive for different loads can be realized and the static power consumption is low.The buffer module is used for a 640x512 array with 30 渭 m center distance in the middle wave infrared focal plane readout circuit. The flow sheet is processed by CSMC 0.5 渭 m DPTM process.The simulation results show that the open loop gain of the column buffer is 40.00dB and the unit gain bandwidth is 48.17MHz / 10pFN.The output buffer can realize the rail to rail input. The open-loop gain is 39.68 dB, the unit gain bandwidth is 46.08 MHz, the readout rate is up to 20 MHz, and the power consumption is 16.02 mW(25pF / 5.1 k 惟.The test pin pulled out at the input end of the module can help verify the chip function in the wafer test of the focal plane readout circuit.By adjusting the test port, the test results are in good agreement with the simulation results, and the design of the buffer module is proved to be feasible.
【作者單位】: 中國科學院上海技術(shù)物理研究所中國科學院紅外成像材料與器件重點實驗室;中國科學院大學;
【分類號】:TN215

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相關(guān)博士學位論文 前1條

1 賈功賢;基于VI的IRFPA ROIC參數(shù)測試及熱釋電FPA凝視成像技術(shù)研究[D];重慶大學;2001年

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本文編號:1754934

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