本文選題：半導(dǎo)體應(yīng)變片　切入點(diǎn)：粘彈性　出處：《華中科技大學(xué)》2015年碩士論文

【摘要】：半導(dǎo)體應(yīng)變片由于其靈敏系數(shù)大、橫向效應(yīng)小、尺寸參數(shù)小等特點(diǎn)被廣泛使用,粘彈性材料聚酰亞胺是一種綜合性能非常優(yōu)異的高分子材料,具有優(yōu)異的機(jī)械性能,突出的電氣絕緣性能和優(yōu)良的抗輻射性能等,常用在各種電氣和電子的用途中。本論文中研究的基于柔性基板的微應(yīng)變片陣列,主要用于監(jiān)測重型機(jī)械關(guān)鍵部位的應(yīng)變和應(yīng)力,它正是結(jié)合了上述兩者的優(yōu)勢,致力于增加整個(gè)系統(tǒng)的靈敏系數(shù)和延性。本論文的主要研究內(nèi)容有:首先,在對半導(dǎo)體應(yīng)變片的工作特性進(jìn)行深入研究的基礎(chǔ)上,選擇合適的應(yīng)變片材料和基底材料。在進(jìn)行粘彈性有限元建模分析之前,必須知道粘彈性材料的特征參數(shù),它一般只能通過實(shí)驗(yàn)或經(jīng)驗(yàn)的方法來獲得。本論文中采用實(shí)驗(yàn)的方法和結(jié)合一種成熟的計(jì)算方法來確定粘彈性材料聚酰亞胺的廣義Maxwell模型的特征參數(shù)。其次,采用ANSYS軟件對單個(gè)半導(dǎo)體應(yīng)變片建立粘彈性有限元模型,選擇合適的尺寸數(shù)據(jù),通過仿真計(jì)算來確定硅的最大應(yīng)變和平均應(yīng)變隨各個(gè)尺寸參數(shù)的變化規(guī)律,根據(jù)需要選擇合適的尺寸參數(shù)。選擇單個(gè)應(yīng)變片單元的組合形式,并確定合理的微應(yīng)變片陣列布局方案。最后,在對與微應(yīng)變片陣列工藝過程相關(guān)的微細(xì)加工技術(shù)進(jìn)行深入研究的基礎(chǔ)上,設(shè)計(jì)出其合理的加工工藝流程。
[Abstract]:Semiconductor strain gauges are widely used because of their high sensitivity coefficient, small transverse effect and small size parameters. The viscoelastic material polyimide is a kind of polymer material with excellent comprehensive properties and excellent mechanical properties.Outstanding electrical insulation and excellent radiation resistance, often used in various electrical and electronic applications.The microstrain gauge array based on flexible substrate is mainly used to monitor the strain and stress of the key parts of heavy machinery in this paper. It combines the advantages of the above two methods and is devoted to increase the sensitivity coefficient and ductility of the whole system.The main contents of this thesis are as follows: firstly, on the basis of in-depth study on the working characteristics of semiconductor strain gauges, appropriate strain gauge materials and substrate materials are selected.The characteristic parameters of viscoelastic materials must be known before the viscoelastic finite element modeling and analysis, which can only be obtained by experimental or empirical methods.In this paper, the characteristic parameters of the generalized Maxwell model of viscoelastic polyimide are determined by experimental method and a mature calculation method.Secondly, the viscoelastic finite element model of a single semiconductor strain gauge is established by using ANSYS software, and appropriate size data are selected to determine the variation of the maximum strain and average strain of silicon with each dimension parameter through the simulation calculation.Select the appropriate size parameters according to the need.The combination form of single strain gauge element is selected, and the reasonable microstrain gauge array layout is determined.Finally, on the basis of the deep research on the micromachining technology related to the microstrain gauge array process, the reasonable processing process is designed.
【學(xué)位授予單位】：華中科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN304

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