本文選題：無溶劑　切入點(diǎn)：環(huán)氧樹脂　出處：《西安科技大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：傳統(tǒng)環(huán)氧玻纖布半固化片主要是由環(huán)氧樹脂、固化劑、促進(jìn)劑、稀釋劑、填料以及溶劑組成,制備是依靠加熱過程中溶劑的揮發(fā),這種制備方法不僅會(huì)污染環(huán)境,而且殘留的溶劑會(huì)影響半固化片品質(zhì)和覆銅板的性能。所以探索無溶劑FR-4環(huán)氧半固化片的制備技術(shù)是覆銅板行業(yè)目前最重要的任務(wù)和難點(diǎn)。本課題主要是以環(huán)氧樹脂和酚醛環(huán)氧樹脂為主體樹脂,將雙氰胺作為固化劑,加入不同含量的固化促進(jìn)劑2-乙基-4-甲基咪唑(2E4MZ)和取代脲促進(jìn)劑(UR300),采用無溶劑的方法,制備環(huán)氧玻纖布覆銅板。通過對不同方案不同固化促進(jìn)劑所制備膠液的凝膠化時(shí)間(GT)、紅外光譜(FT-IR)、差示掃描量熱法(DSC)、以及熱重分析(TGA)等測試,確定了無溶劑法制備環(huán)氧玻纖布半固化片的浸膠工藝和半固化工藝,實(shí)驗(yàn)得出無溶劑法制備半固化片的浸膠工藝為在雙輥筒壓延機(jī)上,輥筒溫度為90℃的條件下進(jìn)行浸膠;半固化工藝為130℃×15min。并將所得的半固化片制備成覆銅板,其制備工藝為130℃×15min+180℃×60min。將無溶劑法制備的覆銅板與傳統(tǒng)方法進(jìn)行對比可以得出,無溶劑法制備覆銅板的耐浸焊性、剝離強(qiáng)度、介電常數(shù)以及擊穿電壓均高于傳統(tǒng)溶劑法制備的覆銅板,采用無溶劑法制備的環(huán)氧玻纖布半固化片具有較高的分解溫度(310℃)和玻璃化轉(zhuǎn)變溫度(176℃),優(yōu)良的耐熱性能,同時(shí)得出該方法制備的覆銅板耐浸焊性為128s,介電常數(shù)為5.19,剝離強(qiáng)度為1.4N/mm,擊穿電壓能達(dá)到48kV/mm,各項(xiàng)性能均優(yōu)于傳統(tǒng)的溶劑法制備的覆銅板。
[Abstract]:The traditional epoxy glass fiber cloth is mainly composed of epoxy resin, curing agent, accelerator, diluent, filler and solvent. The preparation depends on the volatilization of the solvent in the heating process. This preparation method not only pollutes the environment, And the residual solvent will affect the quality of the semi-cured sheet and the properties of copper clad laminate. Therefore, it is the most important task and difficult point to explore the preparation technology of solvent-free FR-4 epoxy semi-solidified sheet. Resin and phenolic epoxy resin as main resin, Using dicyandiamide as curing agent, the curing accelerator 2-ethyl-4-methylimidazolium (2E4MZ) and the substituted urea accelerator (UR300) were added, and the solvent free method was used. Epoxy glass fiber cloth copper clad sheet was prepared. The gelation time of gelling liquid prepared by different curing accelerators was measured by GTU, FTIR, DSCG, TGA and so on, and TGA, TGA, TGA, TGA, TG, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA, TGA etc. The soaking process and the semi-curing process of preparing epoxy glass fabric semi-solidified pieces by solvent-free method were determined. The results show that the solvent-free preparation process of semi-cured sheets is that the soaking process is carried out on the double-roller calender and the roller temperature is 90 鈩，

本文編號(hào)：1629527