本文選題：印制線路板　切入點(diǎn)：銅　出處：《南京理工大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：隨著電子技術(shù)的快速發(fā)展,PCB表面處理工藝趨向于無(wú)鉛化。水性O(shè)SP(Organic Solderability Preservatives)是一種由有機(jī)唑類物質(zhì)、低分子有機(jī)酸、水和助劑組成的混合溶液,它在一定的條件下與二價(jià)銅離子在銅表面形成一種致密的絡(luò)合物薄膜,該薄膜不僅能在PCB的銅表面與空氣間充當(dāng)阻隔層,有效防止銅被氧化腐蝕,還可以在焊接前被助焊劑除去,使銅表面保持良好的可焊性。因此,OSP近些年來(lái)得到快速發(fā)展和應(yīng)用。本論文基于PCB銅表面的抗氧化原理,研制出了耐高溫、抗氧化時(shí)間長(zhǎng)的OSP配方,并研究了它們用于PCB銅表面抗氧化處理的方法。具體研究?jī)?nèi)容和結(jié)果如下：首先,基于OSP與銅離子絡(luò)合的基本原理和條件,探討了OSP的主要組成,分析了影響溶液穩(wěn)定性的因素,并提出一種快速測(cè)試穩(wěn)定性的方法。經(jīng)過(guò)試驗(yàn),得到了基于苯并咪唑、苯并咪唑衍生物和苯并咪唑—苯并咪唑衍生物所組成的混合咪唑的OSP配方。這些OSP溶液穩(wěn)定,室溫可穩(wěn)定貯存3個(gè)月以上。其次,研究了采用上述三種OSP對(duì)PCB銅表面進(jìn)行抗氧化處理的方法,得到了最佳工藝條件。結(jié)果表明,在最佳工藝條件下,三種OSP都可以在PCB銅表面形成均勻、致密的抗氧化膜,可以有效延緩PCB銅表面被腐蝕1個(gè)月以上。最后,對(duì)采用三種OSP抗氧化處理的PCB銅表面的抗高溫氧化性進(jìn)行了研究。DSC-TG測(cè)試結(jié)構(gòu)表明,它們的分解峰值都大于275℃,400℃高溫時(shí)的失重都低于62%。模擬高溫焊接沖擊試驗(yàn)結(jié)果表明,在不低于300℃的高溫環(huán)境下,經(jīng)三種OSP抗氧化處理后的PCB銅表面,都能抗擊3次以上的高溫沖擊而不被氧化。
[Abstract]:With the rapid development of electronic technology, the surface treatment process of OSP(Organic Solderability tends to be lead-free. Aqueous OSP(Organic Solderability reservations is a mixed solution composed of organic azoles, low molecular organic acids, water and auxiliaries. Under certain conditions, it forms a dense complex film with divalent copper ions on the surface of copper. The thin film can not only act as a barrier layer between copper surface and air of PCB, but also effectively prevent copper from being oxidized and corroded. It can also be removed by flux before welding to keep good solderability of copper surface. Therefore, OSPs have been rapidly developed and applied in recent years. Based on the oxidation resistance principle of PCB copper surface, high temperature resistance has been developed in this paper. The formula of OSP with long antioxidation time was studied, and the methods of oxidation oxidation treatment of PCB copper surface were studied. The specific contents and results were as follows: firstly, based on the basic principle and conditions of the complexation of OSP with copper ions, the main components of OSP were discussed. The factors that affect the stability of the solution are analyzed, and a method for fast testing the stability of the solution is proposed, which is based on benzimidazole. The OSP formula of mixed imidazole composed of benzimidazole derivatives and benzimidazole-benzimidazole derivatives. These OSP solutions are stable and can be stored for more than 3 months at room temperature. Three kinds of OSP were used to treat the copper surface of PCB, and the optimum conditions were obtained. The results showed that under the optimum conditions, all three kinds of OSP could form uniform and dense antioxidation film on the surface of PCB copper. It can effectively delay the corrosion of PCB copper surface for more than one month. Finally, the high temperature oxidation resistance of PCB copper surface treated with three kinds of OSP oxidation treatment was studied. Their decomposition peak values were all higher than 275 鈩，

本文編號(hào)：1625550