發(fā)布時間：2018-03-16 11:31

  本文選題：玻璃粉　切入點(diǎn)：導(dǎo)電漿料　出處：《功能材料》2016年02期 　論文類型：期刊論文

【摘要】：研究了無鉛玻璃粘結(jié)相的熔點(diǎn)和含量對銅導(dǎo)電漿料性能的影響。采用四探針法測定銅膜的導(dǎo)電性,采用X射線衍射和顯微組織分析對樣品進(jìn)行表征,并測定了銅膜的附著力。結(jié)果表明,低熔點(diǎn)無鉛玻璃粉有利于防止銅粉高溫氧化,且在較低燒結(jié)溫度時,殘余有機(jī)載體可以包覆銅粉,防止銅粉在低溫?zé)Y(jié)時氧化,制得的導(dǎo)電銅膜樣品表面平整,微觀組織致密,導(dǎo)電性好。當(dāng)?shù)腿埸c(diǎn)無鉛玻璃粉含量為8%時,方阻為47.78mΩ/□,附著力為10N/cm~2左右,符合行業(yè)要求。
[Abstract]:The effect of melting point and content of lead-free glass bonding phase on the properties of copper conductive paste was studied. The conductivity of copper film was measured by four-probe method, and the samples were characterized by X-ray diffraction and microstructure analysis. The adhesion of copper film was measured. The results showed that low melting point lead-free glass powder was beneficial to prevent copper powder from oxidation at high temperature, and at lower sintering temperature, the residual organic carrier could coat copper powder and prevent copper powder from oxidizing at low temperature. When the content of lead-free glass powder at low melting point is 8, the square resistance is 47.78 m 惟 / -and the adhesion is about 10 N / cm ~ (-2), which meets the requirements of the industry.
【作者單位】： 西安工程大學(xué)機(jī)電工程學(xué)院;
【基金】：陜西省科學(xué)技術(shù)研究發(fā)展計劃資助項(xiàng)目(2013K09-33)
【分類號】：TN604

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本文編號：1619730