3mm波段上變頻組件的研制
發(fā)布時(shí)間:2018-03-09 20:36
本文選題:毫米波 切入點(diǎn):3mm 出處:《電子科技大學(xué)》2015年碩士論文 論文類型:學(xué)位論文
【摘要】:隨著電磁波頻段的日漸擁擠,毫米波技術(shù)將擁有越來越廣泛的應(yīng)用前景。我國目前對(duì)毫米波技術(shù)的研究處在相對(duì)落后的位置,具有十分廣闊的發(fā)展空間。在整個(gè)毫米波系統(tǒng)中,變頻組件是對(duì)其整體性能有極大影響的重要組成部分。而W波段又是毫米波頻譜中重要的窗口頻段,基于此,本課題主要使用國產(chǎn)芯片,采用混合集成技術(shù),研制了一個(gè)3mm波段上變頻組件以及和其配套的本振倍頻源。本文的第一章介紹了毫米波的定義、特點(diǎn)、應(yīng)用,回顧了國內(nèi)外毫米波T/R組件、毫米波頻率源的發(fā)展概況。第二章介紹了3mm上變頻組件的基本原理和主要技術(shù)指標(biāo),根據(jù)項(xiàng)目指標(biāo)要求制定了整體方案,并對(duì)各單元電路、元器件進(jìn)行指標(biāo)分配,元器件選取。第三章完成了上變頻組件的設(shè)計(jì),包括無源過渡部分,有源芯片選取,腔體和基片設(shè)計(jì),電源電路設(shè)計(jì)以及最終的裝配和測試。第四章介紹了毫米波頻率源的理論基礎(chǔ)和技術(shù)指標(biāo),根據(jù)實(shí)際需求制定了倍頻鏈路整體方案,對(duì)組件中用到的MMIC芯片進(jìn)行了介紹。第五章為本振倍頻鏈路的設(shè)計(jì)和測試,包括vco腔體、基片和電源電路設(shè)計(jì),倍頻腔體、基片和電源電路設(shè)計(jì),和最終的裝配測試。第六章為總結(jié)及展望,總結(jié)了課題設(shè)計(jì)中的成功之處和不足之處,并對(duì)不足的地方提出了改進(jìn)設(shè)想。
[Abstract]:As the frequency band of electromagnetic wave becomes more and more crowded, millimeter wave technology will have more and more extensive application prospects. At present, the research on millimeter wave technology in our country is relatively backward and has a very broad development space. In the whole millimeter wave system, Frequency conversion module is an important part of the whole performance, and W band is an important window frequency band in millimeter wave spectrum. A 3mm band up-conversion module and its matching local oscillator frequency multiplier are developed. In the first chapter of this paper, the definition, characteristics and application of millimeter wave are introduced, and the domestic and foreign millimeter wave T / R modules are reviewed. The development of millimeter-wave frequency source. Chapter two introduces the basic principle and main technical indexes of 3mm up-conversion module. According to the requirements of the project, the overall scheme is established, and the unit circuits and components are allocated. In Chapter 3, the up-conversion module is designed, including passive transition, active chip selection, cavity and substrate design. Power circuit design and final assembly and test. Chapter 4th introduces the theoretical basis and technical specifications of millimeter-wave frequency source, and formulates the overall scheme of frequency doubling link according to the actual demand. This paper introduces the MMIC chip used in the module. Chapter 5th is about the design and test of the local oscillator frequency doubling link, including the design of vco cavity, substrate and power circuit, the design of frequency doubling cavity, substrate and power circuit. Chapter 6th summarizes the successes and shortcomings of the design, and puts forward some suggestions for improvement.
【學(xué)位授予單位】:電子科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN015
【參考文獻(xiàn)】
相關(guān)期刊論文 前1條
1 何慶國,孫靜;毫米波倍頻上變頻功放組件[J];半導(dǎo)體情報(bào);2000年04期
,本文編號(hào):1590152
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