本文關(guān)鍵詞： 等離子體光刻 金屬-介質(zhì)多層膜 熱分析 仿生流道　出處：《電子科技大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：光刻技術(shù)在半導(dǎo)體工業(yè)中一直扮演核心技術(shù)的角色,但衍射極限的存在限制傳統(tǒng)光學(xué)光刻在光刻分辨率上的提高�；诒砻娴入x子體激元的近場(chǎng)光刻能夠突破衍射極限并具有透射增強(qiáng)效應(yīng),使得光刻分辨率及成像質(zhì)量得到明顯提高。等離子體直寫光刻作為表面等離子體光刻中的一種,能夠?qū)崿F(xiàn)任意圖形的刻寫且成本較低,值得研究開發(fā)。本文來(lái)源于國(guó)家重點(diǎn)實(shí)驗(yàn)室開放課題“接觸型局域SP光刻直寫頭設(shè)計(jì)和掃描性能分析研究”,根據(jù)課題需求,必須對(duì)光刻直寫設(shè)備中存在發(fā)熱現(xiàn)象的物件進(jìn)行相關(guān)散熱研究。本文從傳熱學(xué)和流體方程相關(guān)理論出發(fā),吸取國(guó)內(nèi)外光刻設(shè)備散熱經(jīng)驗(yàn),對(duì)光刻直寫設(shè)備中光刻頭的薄膜結(jié)構(gòu)進(jìn)行散熱性能分析并對(duì)用于投影物鏡等散熱的循環(huán)水冷裝置進(jìn)行深入研究。本文對(duì)在自然風(fēng)冷中處于工作狀態(tài)的金屬-介質(zhì)多層膜及單層鉻膜進(jìn)行熱分析,得到薄膜結(jié)構(gòu)瞬態(tài)溫度場(chǎng)分布規(guī)律及光照功率密度對(duì)薄膜溫度場(chǎng)的影響關(guān)系,確定不需要采用其它制冷方式,并研究金屬-介質(zhì)多層膜散熱特性中存在的尺寸效應(yīng)。對(duì)用于投影物鏡等散熱的循環(huán)水冷裝置進(jìn)行總體設(shè)計(jì),構(gòu)建由制冷模塊、加熱水箱、泵、循環(huán)管路等組成及采用熱電制冷方式的循環(huán)水冷系統(tǒng)。完成制冷模塊的設(shè)計(jì),深入研究分叉流道結(jié)構(gòu)參數(shù)對(duì)流道流動(dòng)及換熱性能的影響,設(shè)計(jì)并優(yōu)化仿生流道;對(duì)換熱器流道結(jié)構(gòu)進(jìn)行對(duì)比選擇,使用有限元分析軟件對(duì)采用平行流道、蛇形流道、仿生流道的換熱器分別進(jìn)行流場(chǎng)-溫度場(chǎng)耦合仿真分析計(jì)算,通過對(duì)比換熱器出口處水溫,選擇制冷效果最優(yōu)的仿生流道作為換熱器流道結(jié)構(gòu),討論材料及邊界條件對(duì)制冷模塊制冷效果的影響,優(yōu)化換熱器相關(guān)參數(shù),達(dá)到較高熱交換效率的目的。
[Abstract]:Lithography has always played a key role in the semiconductor industry. However, the diffraction limit limits the resolution of traditional optical lithography. The near-field lithography based on surface plasmon can break through the diffraction limit and have transmission enhancement effect. As one of the surface plasma photolithography, plasma direct writing lithography can realize the writing of arbitrary graphics and the cost is lower. This paper is derived from the open project of the State key Laboratory, "Design of contact Local SP Lithography Direct Writing head and Analysis of scanning performance", according to the requirements of the project. It is necessary to study the heat dissipation of objects in lithography direct writing equipment. Based on the theory of heat transfer and fluid equation, the heat dissipation experience of lithography equipment at home and abroad should be absorbed in this paper. The heat dissipation performance of the film structure of the lithography head in the lithography direct writing equipment is analyzed, and the circulating water cooling device used for projecting objective lens is studied in depth. In this paper, the metal-medium in the working state in the natural air cooling system is studied. Thermal analysis of multilayer and single-layer chromium film, The distribution of transient temperature field and the influence of illumination power density on the film temperature field are obtained, and it is determined that there is no need for other refrigeration methods. The size effect in the heat dissipation characteristics of metal-dielectric multilayer film is studied. The overall design of circulating water cooling device used for projecting objective lens is carried out, and the cooling module, heating water tank, pump, and so on are constructed. The design of the refrigeration module is completed, the influence of the structural parameters of the bifurcation channel on the flow and heat transfer performance of the channel is studied deeply, and the bionic runner is designed and optimized. The flow field and temperature field of the heat exchanger with parallel channel, snake channel and bionic channel were analyzed and calculated by using finite element analysis software, and the water temperature at the outlet of the heat exchanger was compared. The bionic channel with optimal refrigeration effect is selected as the flow channel structure of heat exchanger. The influence of material and boundary conditions on the refrigeration effect of refrigeration module is discussed. The relative parameters of heat exchanger are optimized to achieve the purpose of higher heat exchange efficiency.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN305.7

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本文編號(hào)：1555657