發(fā)布時間：2018-02-28 13:02

  本文關(guān)鍵詞： 切割液 聚乙二醇 摩擦學(xué)性能　出處：《人工晶體學(xué)報》2017年07期 　論文類型：期刊論文

【摘要】：重點研究了晶硅片切割用水基切割液中潤滑劑的摩擦性能影響因素。選用低分子量的聚乙二醇(PEG)作為潤滑劑,研究了不同分子量PEG作為潤滑劑的摩擦學(xué)性能。在使用PEG300作為水基切割液潤滑劑的情況下,相比純水可減小硅片表面的粗糙度達86.51%;磨損體積可以減少50%,磨損表面磨屑變少。
[Abstract]:The factors affecting the friction properties of the lubricant in the water base cutting solution for wafer cutting were studied. The low molecular weight polyethylene glycol (PEG) was used as the lubricant. The tribological properties of PEG with different molecular weight as lubricant were studied. When PEG300 was used as lubricant of water-based cutting liquid, the roughness of silicon wafer surface was reduced to 86.51, and the wear volume was reduced by 50%, and the wear debris was decreased.
【作者單位】： 河南易成新能源股份有限公司;河南大學(xué)納米材料功能研究中心;
【分類號】：TN305.1

【參考文獻】

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本文編號：1547401