本文關(guān)鍵詞： 工藝輔料 殘留 失效分析 失效機(jī)理　出處：《電子產(chǎn)品可靠性與環(huán)境試驗(yàn)》2016年06期 　論文類型：期刊論文

【摘要】：工藝輔料殘留引起的腐蝕是PCB制程工藝中的常見問題。通過對工藝用料引起的PCB失效案例進(jìn)行分析,發(fā)現(xiàn)工藝輔料殘留主要是材料自身殘留和制程操作不規(guī)范這兩方面的因素引起的,掌握這些現(xiàn)象的機(jī)理,有利于相關(guān)工程技術(shù)人員規(guī)范操作過程、合理地選擇材料,從而降低故障發(fā)生的風(fēng)險(xiǎn)。
[Abstract]:Corrosion caused by residual auxiliary materials is a common problem in PCB process. The case of PCB failure caused by process materials is analyzed. It is found that the residue of technological excipient is mainly caused by the two factors of material itself residue and non-standard process operation. Mastering the mechanism of these phenomena is beneficial to the relevant engineers and technicians in standardizing the operation process and selecting the materials reasonably. Thus reducing the risk of failure.
【作者單位】： 工業(yè)和信息化部電子第五研究所華東分所;
【分類號】：TN41.06
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本文編號：1543056