本文關(guān)鍵詞： 發(fā)光二極管 倒裝 填充 氮化鋁 散熱 老化　出處：《南昌大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：倒裝LED與傳統(tǒng)藍(lán)寶石正裝LED、垂直LED相比,具有無(wú)金線、高可靠性等優(yōu)點(diǎn),是未來(lái)LED芯片發(fā)展的趨勢(shì)之一。但是同時(shí)存在著在固晶時(shí)的電極對(duì)位、芯片和基板存在熱膨脹系數(shù)不匹配,容易失效等問(wèn)題。本文主要研究倒裝LED封裝,在倒裝LED芯片與支架之間的芯片PN電極間的溝道空隙填充AlN粉膠體、Al2O3粉膠體、導(dǎo)熱膠,以減少熱沖擊對(duì)LED芯片,尤其是GaN發(fā)光層的影響,降低鍵合層熱阻,增強(qiáng)封裝芯片的散熱性能。實(shí)驗(yàn)表明,填充劑的導(dǎo)熱率越高、填充量量越高,封裝器件的散熱性能越好;但是與無(wú)填充相比,填充劑降低了燈珠2-5%的亮度,在240h老化的過(guò)程中,填充了的燈珠光功率維持率比未填充的高3-5%;其中性能最好的粉膠比為2:1的AlN粉膠體,其光功率在168h時(shí)已經(jīng)比無(wú)填充的對(duì)照組的光功率高。說(shuō)明填充劑在長(zhǎng)時(shí)間的老化過(guò)程中是有效的。同時(shí)研究對(duì)比了填充劑、芯片和支架種類封裝器件的光電、散熱和老化性能。
[Abstract]:The inverted LED has the advantages of no gold wire, high reliability and so on, compared with the traditional sapphire formal Led and vertical LED. It is one of the development trends of LED chips in the future, but at the same time, there are electrode pairs in the solid crystal, and the thermal expansion coefficient mismatch between the chip and the substrate. In this paper, the reverse LED package is mainly studied, and the channel gap between the chip PN electrode between the inverted LED chip and the support is filled with the AlN colloid Al _ 2O _ 3 colloid and thermal conductive adhesive. In order to reduce the influence of thermal shock on LED chip, especially the GaN luminescent layer, reduce the thermal resistance of bonding layer and enhance the heat dissipation performance of the package chip, the experiment shows that the higher the thermal conductivity of the filler, the higher the filling amount. The better the heat dissipation performance of packaging devices; However, compared with the unfilled, the filler decreased the brightness of the lamp beads by 2-5%. During the aging process of 240 h, the power maintenance rate of the filled lamps was 3-5% higher than that of the unfilled ones. The best powder / gel ratio of AlN is 2: 1. The optical power of the filler at 168 h was higher than that of the control group without filling. The results showed that the filler was effective in the aging process for a long time. At the same time, the stuffing agent was studied and compared. Chip and bracket types of packaging devices for optoelectronic, heat dissipation and aging performance.
【學(xué)位授予單位】：南昌大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN312.8

【參考文獻(xiàn)】

相關(guān)期刊論文 前7條

1 羅元;魏體偉;王興龍;;基于倒裝焊芯片的功率型LED熱特性分析[J];半導(dǎo)體光電;2012年03期

2 張樓英;周麗;張家雨;羅宗南;崔一平;;大功率LED的光衰機(jī)制研究[J];半導(dǎo)體技術(shù);2009年05期

3 戴維德;;大功率LED的散熱設(shè)計(jì)[J];今日電子;2007年12期

4 王洪波;陳大慶;薛峰;;環(huán)氧導(dǎo)電銀膠在LED上的應(yīng)用現(xiàn)狀[J];中國(guó)膠粘劑;2007年06期

5 李楊;董素素;王藝燃;王鳳超;鄒軍;;垂直結(jié)構(gòu)LED和倒裝結(jié)構(gòu)LED的發(fā)光特性研究[J];光電技術(shù)應(yīng)用;2014年05期

6 牟秋紅;琚偉;彭丹;劉月濤;李金輝;張敏;;LED封裝用導(dǎo)電銀膠的研制[J];世界橡膠工業(yè);2014年03期

7 郭凌曦;左敦穩(wěn);孫玉利;周馳;方鈺;;LED散熱技術(shù)及其研究進(jìn)展[J];照明工程學(xué)報(bào);2013年04期

相關(guān)碩士學(xué)位論文 前1條

1 陳宇彬;白光LED老化機(jī)理研究[D];華南師范大學(xué);2007年

，

本文編號(hào)：1478139