本文關(guān)鍵詞： 電磁干擾 信號完整性 電源完整性 導(dǎo)體機(jī)箱 屏蔽效能　出處：《內(nèi)蒙古大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：伴隨著集成電子電路的工作頻率和集成化程度不斷的提高,PCB板布局布線越來越密集,信號之間的影響也越來越大。通過仿真手段在PCB設(shè)計(jì)階段就對潛在的電磁干擾問題進(jìn)行控制,可以降低研發(fā)成本與縮短產(chǎn)品開發(fā)時間。本文以理論研究為基礎(chǔ),利用ANSYS的SIwave、HFSS、Designer等仿真軟件研究高速PCB的電磁干擾(Electromagnetic Interference, EMI)的控制方法,主要包括以下幾個方面：1.在傳輸線理論的基礎(chǔ)上,對高速PCB中的關(guān)鍵信號進(jìn)行完整鏈路分析,主要探討了阻抗匹配,差分走線,串?dāng)_,返回路徑等信號完整性問題(Signal Integrity, SI)對電磁干擾的影響。2.探討電源分配網(wǎng)絡(luò)阻抗曲線與諧振的關(guān)系。以實(shí)際PCB為例,優(yōu)化PI的仿真流程,探討PI(Power Integrity, PI)對PCB遠(yuǎn)場輻射的影響。3.在研究SI/PI/EMI三者之間關(guān)系的基礎(chǔ)上,優(yōu)化傳統(tǒng)的PCB仿真設(shè)計(jì)流程,提出更為高效,符合現(xiàn)代高速設(shè)計(jì)需求的設(shè)計(jì)流程。4.研究屏蔽導(dǎo)體的孔縫耦合效應(yīng)。探討了機(jī)箱諧振、S參數(shù)、屏蔽效能之間的關(guān)系；由于實(shí)際的機(jī)箱存在各種孔縫結(jié)構(gòu),所以本文也探討了孔縫的大小、方向、形狀以及數(shù)量等對屏蔽效能的影響,為實(shí)際機(jī)箱的優(yōu)化設(shè)計(jì)提出理論指導(dǎo)。5.將實(shí)際PCB板的遠(yuǎn)場輻射作為輻射源導(dǎo)入實(shí)際機(jī)箱,探討了實(shí)際機(jī)箱對單板的屏蔽效應(yīng),并對其優(yōu)化。
[Abstract]:With the continuous improvement of the working frequency and integration degree of integrated electronic circuits, the layout and wiring of PCB board is becoming more and more dense. The influence between signals is also increasing. The potential electromagnetic interference problem is controlled by simulation in the PCB design stage. It can reduce the cost of R & D and shorten the time of product development. Based on the theoretical research, this paper makes use of ANSYS's SIwave / HFSS. Designer and other simulation software are used to study the control method of electromagnetic interference (EMI) of high-speed PCB. On the basis of transmission line theory, the key signals in high speed PCB are analyzed by complete link analysis, including impedance matching, differential routing and crosstalk. Signal integrity problem, such as return path, is a signal Integrity. The relationship between impedance curve and resonance of power distribution network is discussed. Taking the actual PCB as an example, the simulation flow of Pi is optimized. The effect of PI(Power Integrity (Pi) on the far-field radiation of PCB. 3. Based on the study of the relationship among the three SI/PI/EMI. Optimize the traditional PCB simulation design flow, propose a more efficient design process that meets the needs of modern high-speed design. 4. Study the hole slot coupling effect of shielded conductor, and discuss the box resonant S parameters. The relationship between shielding effectiveness; Because there are a variety of slot structures in the actual chassis, this paper also discusses the influence of the size, direction, shape and quantity of the slot on the shielding effectiveness. 5. The far-field radiation of the actual PCB board is introduced into the actual chassis as a radiation source, and the shielding effect of the actual chassis to the veneer is discussed and optimized.
【學(xué)位授予單位】：內(nèi)蒙古大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN41

【引證文獻(xiàn)】

相關(guān)會議論文 前1條

1 張婧婧;王志良;;磁性材料的應(yīng)用——PCB中電源接地層構(gòu)造的EMI低減[A];全國電磁兼容學(xué)術(shù)會議論文集[C];2006年

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本文編號：1463839