本文關鍵詞： 環(huán)氧樹脂 導電銀膠 電子封裝　出處：《西華大學》2015年碩士論文　論文類型：學位論文

【摘要】：本論文研究了一種電子封裝用導電銀膠的制備,自主研發(fā)了一種電子封裝用導電膠,對代替鉛錫焊料、保護環(huán)境、滿足電子電路集成化封裝有著重要的意義,并對自主研制的導電銀膠進行了性能測試,滿足生產用。首先敘述了導電膠的各組成成分和各組成成分的選取原則,確定了導電銀膠的成分為:環(huán)氧樹脂(E51型)作為基體樹脂、酸酐類化合物(甲基納迪克酸酐)作為固化劑選、咪唑類化合物(2-已基-4甲基咪唑)作為促進劑、1~3μm片狀銀粉作為導電填料。確定了導電銀膠的最佳配比:樹脂(E51型環(huán)氧樹脂):固化劑(甲基納迪克酸酐):導電填料(1~3μm片狀銀粉):促進劑(2-已基-4甲基咪唑)=100:80:126:0.6。討論了基體樹脂的固化性能,測定其固化時間;通過實驗分別研究了促進劑(2-乙基-4甲基咪唑)對固化性能的影響、銀粉填充量對導電銀膠性能的影響、助劑對導電膠性能的影響、高溫對導電膠電性能的影響、導電促進劑(二乙二醇丁醚)對導電膠電性能的影響、增韌劑對導電膠電性能的影響、稀釋劑對導電銀膠絲網印刷技術的影響;研究表明:促進劑(2-乙基-4甲基咪唑)量多,固化時間就少,同時剪切強度也隨之下降;導電銀膠的電學性能和力學性能與銀粉填充量有很大關系,銀粉填充量越大,導電銀膠體積電阻率越低,但同時拉伸剪切強度下降;二乙二醇丁醚(DBGE)的加入有利于提高導電銀膠的導電性能,但導電銀膠的拉伸剪切強度卻連續(xù)下降;隨著增韌劑量的不斷增加,導電銀膠的剪切強度不斷增加,但導電性能呈現遞減趨勢;導電銀膠通過添加偶聯(lián)劑、促進劑、稀釋劑可以大大提高導電銀膠的導電性能;通過實驗驗證了自制的導電銀膠具有耐高溫性能;研究了導電銀膠的制備工藝和流程,測試了自主研發(fā)的導電銀膠的電學性能,測量體積電阻率為:7.2×10-4??cm;利用材料力學實驗機測定了自制導電銀膠的拉伸剪切強度,剪切強度達14.6(MPa),基本滿足生產用。通過此次導電銀膠的制備與性能研究項目,為更進一步研究導電銀膠奠定了實驗和理論基礎。
[Abstract]:This paper studies the preparation of a conductive silver gel for electronic packaging, and develops a conductive adhesive for electronic packaging, which is of great significance to replace lead and tin solder, protect the environment and meet the requirements of integrated electronic circuit packaging. The properties of the conductive silver adhesive developed by ourselves were tested to meet the needs of production. Firstly, the composition of the conductive adhesive and the selection principle of each component were described. The composition of conductive silver adhesive was determined as follows: epoxy resin E51) as matrix resin and acid anhydride compound (methyl Nadidiic anhydride) as curing agent. Imidazole compounds (2-hexyl-4-methyl imidazole) were used as accelerators. The best proportion of conductive silver colloid was determined as follows: resin E51 type epoxy resin: curing agent (methyl Nadeic anhydride: conductive filler 1 1 渭 m flake silver powder). The curing properties of the matrix resin were discussed. The curing time was determined. The effects of accelerator 2-ethyl-4-methylimidazole) on the curing properties, the effect of the amount of silver powder on the properties of conductive silver adhesives and the effect of additives on the properties of conductive adhesives were studied. The effect of high temperature on the electrical properties of conductive adhesive, the effect of conductive accelerator (diethylene glycol butyl ether) on the electrical properties of conductive adhesive, the effect of toughening agent on electrical properties of conductive adhesive, and the influence of diluent on screen printing technology of conductive silver gel; The results show that the curing time is less and the shear strength decreases with the increase of the amount of accelerator 2-ethyl-4-methylimidazole. The electrical and mechanical properties of conductive silver gel are related to the content of silver powder. The larger the amount of silver powder is, the lower the volume resistivity of conductive silver colloid is, but the tensile shear strength decreases at the same time. The addition of diethylene glycol butyl ether (DBGE) can improve the conductivity of conductive silver gel, but the tensile shear strength of conductive silver adhesive decreases continuously. With the increasing of the amount of toughening agent, the shear strength of conductive silver adhesive is increasing, but the conductivity is decreasing. Through adding coupling agent, accelerator and diluent, conductive silver adhesive can greatly improve its conductive property. It is proved by experiments that the self-made conductive silver adhesive has high temperature resistance. The preparation process and process of conductive silver colloid were studied. The electrical properties of the conductive silver gel developed by ourselves were tested. The volume resistivity was measured to be 7. 7 脳 10 ~ (-4)? ? Cm; The tensile shear strength of self-made conductive silver adhesive was measured by means of material mechanics test machine. The shear strength reached 14.6 mpa, which was basically suitable for production. The preparation and properties of the conductive silver adhesive were studied. It lays an experimental and theoretical foundation for the further study of conductive silver colloid.
【學位授予單位】：西華大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN05

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本文編號：1451509