本文關(guān)鍵詞： 環(huán)氧樹(shù)脂 導(dǎo)電銀膠 電子封裝　出處：《西華大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：本論文研究了一種電子封裝用導(dǎo)電銀膠的制備,自主研發(fā)了一種電子封裝用導(dǎo)電膠,對(duì)代替鉛錫焊料、保護(hù)環(huán)境、滿足電子電路集成化封裝有著重要的意義,并對(duì)自主研制的導(dǎo)電銀膠進(jìn)行了性能測(cè)試,滿足生產(chǎn)用。首先敘述了導(dǎo)電膠的各組成成分和各組成成分的選取原則,確定了導(dǎo)電銀膠的成分為:環(huán)氧樹(shù)脂(E51型)作為基體樹(shù)脂、酸酐類化合物(甲基納迪克酸酐)作為固化劑選、咪唑類化合物(2-已基-4甲基咪唑)作為促進(jìn)劑、1~3μm片狀銀粉作為導(dǎo)電填料。確定了導(dǎo)電銀膠的最佳配比:樹(shù)脂(E51型環(huán)氧樹(shù)脂):固化劑(甲基納迪克酸酐):導(dǎo)電填料(1~3μm片狀銀粉):促進(jìn)劑(2-已基-4甲基咪唑)=100:80:126:0.6。討論了基體樹(shù)脂的固化性能,測(cè)定其固化時(shí)間;通過(guò)實(shí)驗(yàn)分別研究了促進(jìn)劑(2-乙基-4甲基咪唑)對(duì)固化性能的影響、銀粉填充量對(duì)導(dǎo)電銀膠性能的影響、助劑對(duì)導(dǎo)電膠性能的影響、高溫對(duì)導(dǎo)電膠電性能的影響、導(dǎo)電促進(jìn)劑(二乙二醇丁醚)對(duì)導(dǎo)電膠電性能的影響、增韌劑對(duì)導(dǎo)電膠電性能的影響、稀釋劑對(duì)導(dǎo)電銀膠絲網(wǎng)印刷技術(shù)的影響;研究表明:促進(jìn)劑(2-乙基-4甲基咪唑)量多,固化時(shí)間就少,同時(shí)剪切強(qiáng)度也隨之下降;導(dǎo)電銀膠的電學(xué)性能和力學(xué)性能與銀粉填充量有很大關(guān)系,銀粉填充量越大,導(dǎo)電銀膠體積電阻率越低,但同時(shí)拉伸剪切強(qiáng)度下降;二乙二醇丁醚(DBGE)的加入有利于提高導(dǎo)電銀膠的導(dǎo)電性能,但導(dǎo)電銀膠的拉伸剪切強(qiáng)度卻連續(xù)下降;隨著增韌劑量的不斷增加,導(dǎo)電銀膠的剪切強(qiáng)度不斷增加,但導(dǎo)電性能呈現(xiàn)遞減趨勢(shì);導(dǎo)電銀膠通過(guò)添加偶聯(lián)劑、促進(jìn)劑、稀釋劑可以大大提高導(dǎo)電銀膠的導(dǎo)電性能;通過(guò)實(shí)驗(yàn)驗(yàn)證了自制的導(dǎo)電銀膠具有耐高溫性能;研究了導(dǎo)電銀膠的制備工藝和流程,測(cè)試了自主研發(fā)的導(dǎo)電銀膠的電學(xué)性能,測(cè)量體積電阻率為:7.2×10-4??cm;利用材料力學(xué)實(shí)驗(yàn)機(jī)測(cè)定了自制導(dǎo)電銀膠的拉伸剪切強(qiáng)度,剪切強(qiáng)度達(dá)14.6(MPa),基本滿足生產(chǎn)用。通過(guò)此次導(dǎo)電銀膠的制備與性能研究項(xiàng)目,為更進(jìn)一步研究導(dǎo)電銀膠奠定了實(shí)驗(yàn)和理論基礎(chǔ)。
[Abstract]:This paper studies the preparation of a conductive silver gel for electronic packaging, and develops a conductive adhesive for electronic packaging, which is of great significance to replace lead and tin solder, protect the environment and meet the requirements of integrated electronic circuit packaging. The properties of the conductive silver adhesive developed by ourselves were tested to meet the needs of production. Firstly, the composition of the conductive adhesive and the selection principle of each component were described. The composition of conductive silver adhesive was determined as follows: epoxy resin E51) as matrix resin and acid anhydride compound (methyl Nadidiic anhydride) as curing agent. Imidazole compounds (2-hexyl-4-methyl imidazole) were used as accelerators. The best proportion of conductive silver colloid was determined as follows: resin E51 type epoxy resin: curing agent (methyl Nadeic anhydride: conductive filler 1 1 渭 m flake silver powder). The curing properties of the matrix resin were discussed. The curing time was determined. The effects of accelerator 2-ethyl-4-methylimidazole) on the curing properties, the effect of the amount of silver powder on the properties of conductive silver adhesives and the effect of additives on the properties of conductive adhesives were studied. The effect of high temperature on the electrical properties of conductive adhesive, the effect of conductive accelerator (diethylene glycol butyl ether) on the electrical properties of conductive adhesive, the effect of toughening agent on electrical properties of conductive adhesive, and the influence of diluent on screen printing technology of conductive silver gel; The results show that the curing time is less and the shear strength decreases with the increase of the amount of accelerator 2-ethyl-4-methylimidazole. The electrical and mechanical properties of conductive silver gel are related to the content of silver powder. The larger the amount of silver powder is, the lower the volume resistivity of conductive silver colloid is, but the tensile shear strength decreases at the same time. The addition of diethylene glycol butyl ether (DBGE) can improve the conductivity of conductive silver gel, but the tensile shear strength of conductive silver adhesive decreases continuously. With the increasing of the amount of toughening agent, the shear strength of conductive silver adhesive is increasing, but the conductivity is decreasing. Through adding coupling agent, accelerator and diluent, conductive silver adhesive can greatly improve its conductive property. It is proved by experiments that the self-made conductive silver adhesive has high temperature resistance. The preparation process and process of conductive silver colloid were studied. The electrical properties of the conductive silver gel developed by ourselves were tested. The volume resistivity was measured to be 7. 7 脳 10 ~ (-4)? ? Cm; The tensile shear strength of self-made conductive silver adhesive was measured by means of material mechanics test machine. The shear strength reached 14.6 mpa, which was basically suitable for production. The preparation and properties of the conductive silver adhesive were studied. It lays an experimental and theoretical foundation for the further study of conductive silver colloid.
【學(xué)位授予單位】：西華大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN05

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