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面向IC封裝的氣浮定位平臺的研究

發(fā)布時間:2018-01-19 03:03

  本文關(guān)鍵詞: 芯片封裝 定位平臺 直線電機 氣體潤滑 氣浮驅(qū)動機構(gòu) 出處:《西安工業(yè)大學(xué)》2015年碩士論文 論文類型:學(xué)位論文


【摘要】:隨著半導(dǎo)體技術(shù)的飛速發(fā)展,芯片集成度不斷增大、管腳數(shù)量迅速增多、引線間距日益減小,對定位平臺的精度、速度和穩(wěn)定性提出了更迫切的要求。本文以高速精密定位平臺為研究對象,提出了一種新型兩自由度直線電機定位平臺的結(jié)構(gòu),研究了其結(jié)構(gòu)設(shè)計及靜動態(tài)特性,并搭建了測試平臺對其進行實驗驗證。主要研究工作及取得的成果如下:首先,綜合考慮串并聯(lián)機構(gòu)的優(yōu)缺點及直線電機驅(qū)動的優(yōu)勢,為了消除摩擦力對定位平臺性能的影響,設(shè)計了由直線電機直接驅(qū)動的廣義并聯(lián)氣浮定位平臺,利用三維建模軟件Soildworks的參數(shù)化構(gòu)型方法構(gòu)件零件的三維模型,通過對三維零部件結(jié)構(gòu)特征的修改,使機構(gòu)的空間布局合理,以滿足裝配、制造等方面要求。利用有限元分析軟件ANSYS對所設(shè)計的平臺進行靜力學(xué)和動力學(xué)分析,以尋求最佳設(shè)計參數(shù)的組合,使氣浮面的變形小于0.1μ m,同時,盡量減小移動部件的質(zhì)量,在此基礎(chǔ)上對定位平臺的結(jié)構(gòu)進行優(yōu)化設(shè)計。其次,在MATLAB軟件環(huán)境下,依據(jù)雷諾控制方程和氣體流量守恒定律,研究了整體式氣浮定位平臺及氣浮驅(qū)動機構(gòu)的氣浮特性,對氣浮定位平臺的承載力、氣浮驅(qū)動機構(gòu)在不同工況下的承載力等進行了分析研究。最后,基于上述研究內(nèi)容,進行了定位平臺的加工,搭建了測試平臺并進行了定位平臺性能的測試,實驗結(jié)果與理論分析基本符合,能夠滿足設(shè)計要求。上述研究內(nèi)容豐富了芯片封裝的設(shè)計理論,對促進封裝設(shè)備技術(shù)進步具有重要意義,為進一步研究高加速度氣浮定位平臺的制造奠定了一定的理論基礎(chǔ)。
[Abstract]:With the rapid development of semiconductor technology, the chip integration is increasing, the number of pins is increasing rapidly, the lead distance is decreasing day by day, and the accuracy of the positioning platform. Speed and stability put forward more urgent requirements. This paper takes the high-speed precision positioning platform as the research object, proposes a new structure of a new two-degree-of-freedom linear motor positioning platform. The structure design and static and dynamic characteristics are studied, and the test platform is built to verify the structure. The main research work and the results obtained are as follows: first. Considering the advantages and disadvantages of series-parallel mechanism and the advantages of linear motor drive, in order to eliminate the influence of friction on the performance of positioning platform, a generalized parallel air-floating positioning platform driven by linear motor is designed. By using the parameterized configuration method of 3D modeling software Soildworks, the 3D model of component parts is modified to make the spatial layout of the mechanism reasonable to satisfy the assembly. The finite element analysis software ANSYS is used to analyze the statics and dynamics of the designed platform in order to find the best combination of design parameters and make the deformation of the floatation surface less than 0.1 渭 m. At the same time, the mass of moving parts is minimized, and the structure of the positioning platform is optimized. Secondly, under the environment of MATLAB, the Reynolds control equation and the law of conservation of gas flow are adopted. The characteristics of air floatation of integral air floatation platform and its driving mechanism are studied. The bearing capacity of the air floating positioning platform and the bearing capacity of the air floating driving mechanism under different working conditions are analyzed. Finally. Based on the above research content, the processing of the positioning platform is carried out, the test platform is built and the performance of the positioning platform is tested. The experimental results are basically consistent with the theoretical analysis. The above research enriches the design theory of chip packaging and is of great significance to promote the technological progress of packaging equipment. It lays a theoretical foundation for further research on the manufacture of high acceleration air floatation positioning platform.
【學(xué)位授予單位】:西安工業(yè)大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2015
【分類號】:TN405

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