本文關(guān)鍵詞：集成電路板焊點(diǎn)缺陷的機(jī)器視覺檢測方法　出處：《天津科技大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 集成電路板 機(jī)器視覺 焊點(diǎn)缺陷檢測 拍攝角度 運(yùn)動平臺

【摘要】：隨著電子制造業(yè)的高速發(fā)展,集成電路板的應(yīng)用日益廣泛。如何快速、高效的檢測產(chǎn)品質(zhì)量,是企業(yè)面臨的一個(gè)重大問題。自動化檢測技術(shù)代替人工檢測成為必然的趨勢。然而對于不同的應(yīng)用背景和檢測對象,檢測方法也各有差異,因此應(yīng)有針對性的設(shè)計(jì)檢測系統(tǒng)。本課題中的檢測對象為車載受信機(jī)電路板,該電路板具有一定的特殊性。它是在經(jīng)過表面貼裝(SMT-Surface Mount Technology)后的印刷電路板(PCB-Printed Circuit Board)上又集成了天線、天線支架等部件,造成了元器件之間的空間遮擋。在此條件下,對芯片引腳焊接質(zhì)量進(jìn)行檢測時(shí),企業(yè)采用的方法仍然是人工目檢,其效率低、準(zhǔn)確率不足,且目前的集成電路板檢測裝置難以被直接使用。本文針對上述實(shí)際問題,結(jié)合企業(yè)的生產(chǎn)需求,確定了基于機(jī)器視覺原理的車載受信機(jī)電路版焊點(diǎn)缺陷檢測方法。本文對車載電路板焊點(diǎn)缺陷的視覺檢測方法進(jìn)行了而深入的研究,根據(jù)電路板元器件分布的特殊空間結(jié)構(gòu),設(shè)計(jì)了滿足要求的該類電路板焊點(diǎn)缺陷檢測系統(tǒng)。通過實(shí)驗(yàn)驗(yàn)證了該方法的通用性和可行性。本文的主要研究內(nèi)容有以下幾個(gè)方面：1.總結(jié)集成電路板焊點(diǎn)缺陷檢測方法,結(jié)合車載電路板元器件空間分布的特殊性,研究了針對該類型電路板的視覺檢測方法,并通過實(shí)驗(yàn)得到驗(yàn)證。2.設(shè)計(jì)了基于固高GT-400三自由度運(yùn)動平臺的自動檢測裝置,通過調(diào)整電路板的位置,對不同焊點(diǎn)進(jìn)行檢測。3.使用機(jī)器視覺檢測缺陷時(shí),相機(jī)與芯片引腳平面呈一定的角度,由于景深的存在使得部分引腳出現(xiàn)離焦模糊現(xiàn)象。通過分析,推導(dǎo)出了合理的拍攝角度,可拍攝到清晰的全部引腳焊點(diǎn)圖像,并通過實(shí)驗(yàn)進(jìn)行驗(yàn)證。4.設(shè)計(jì)了檢測系統(tǒng)的軟件部分,實(shí)現(xiàn)運(yùn)動控制和圖像采集與處理。其中包括：軌跡學(xué)習(xí)模塊、在線處理模塊等。
[Abstract]:With the rapid development of electronic manufacturing industry, the application of integrated circuit board is more and more extensive. How to detect the product quality quickly and efficiently. Automatic detection technology instead of manual detection has become an inevitable trend. However, for different application backgrounds and detection objects, the detection methods are different. Therefore, there should be a targeted design of the detection system. The subject of this subject is the on-board circuit board. The circuit board has some particularity. It is a printed circuit board (PCB) after the surface mount of SMT-Surface Mount technology (SMT-Surface Mount technology). The antenna is integrated on the PCB-Printed Circuit board. Antenna support and other components, resulting in a spatial occlusion between components. Under this condition, when the chip pin welding quality detection, the enterprise still uses artificial inspection, its efficiency is low, the accuracy is not enough. And the current integrated circuit board detection device is difficult to be directly used. This paper aims at the above practical problems, combined with the production needs of enterprises. Based on the principle of machine vision, the detection method of solder joint defect in the electromechanical circuit plate of vehicle is determined. In this paper, the visual detection method of solder joint defect of on-board circuit board is studied deeply. According to the special spatial structure of circuit board components. The testing system of solder joint defect of this kind of circuit board is designed, and the generality and feasibility of the method are verified by experiments. The main research contents of this paper are as follows:. 1. Summarize the detection method of solder joint defect in integrated circuit board. Combined with the particularity of the spatial distribution of the components of the on-board circuit board, the visual detection method for this type of circuit board is studied. And through the experiment to verify .2.designed based on the fixed height GT-400 three-degree-of-freedom motion platform automatic detection device, by adjusting the position of the circuit board. When using machine vision to detect defects, the plane of camera and chip pin is at a certain angle, because of the existence of depth of field, some pins appear defocus blur phenomenon. The reasonable shooting angle is deduced and all the pin solder joint images can be captured clearly. Finally, the software part of the detection system is designed. Motion control and image acquisition and processing, including: trajectory learning module, online processing module and so on.
【學(xué)位授予單位】：天津科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN407

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本文編號：1433619