本文關(guān)鍵詞：溫度與振動(dòng)耦合條件下的電路板級(jí)焊點(diǎn)失效模式與疲勞壽命分析　出處：《電子學(xué)報(bào)》2017年07期 　論文類型：期刊論文

  更多相關(guān)文章： 溫度與振動(dòng)耦合 焊點(diǎn) 失效模式 疲勞壽命

【摘要】：基于正交試驗(yàn)法研究不同溫度與振動(dòng)耦合條件下的板級(jí)焊點(diǎn)失效行為與模式,采用L9(34)混合水平正交表設(shè)計(jì)了不同溫度(T)、加速度功率譜密度(PSD)與頻率(V)條件下的加速壽命試驗(yàn),結(jié)果表明三者對(duì)焊點(diǎn)可靠性影響程度為TPSDV,且溫度是影響焊點(diǎn)失效模式的主要因素,隨溫度的升高,焊點(diǎn)裂紋逐漸從近封裝側(cè)的界面金屬化合物(IMC)層向釬體內(nèi)部擴(kuò)展,焊點(diǎn)失效模式從脆性斷裂向韌性斷裂演化.基于焊點(diǎn)失效數(shù)據(jù)分析,發(fā)現(xiàn)焊點(diǎn)疲勞壽命對(duì)數(shù)值與PCB板背側(cè)最大應(yīng)變范圍存在關(guān)聯(lián)關(guān)系,并采用多項(xiàng)式擬合的方法建立了焊點(diǎn)疲勞壽命模型,擬合結(jié)果顯示,該模型能較好的評(píng)估溫度與振動(dòng)耦合條件下的焊點(diǎn)壽命,預(yù)測精度較高.
[Abstract]:Based on the orthogonal test method, the failure behavior and mode of plate grade solder joints under different temperature and vibration coupling conditions are studied. Different temperatures are designed by using L9 / 34) mixed horizontal orthogonal table. The accelerated life tests under the conditions of acceleration power spectrum density (PSD) and frequency density (V) show that the effect of the three factors on the reliability of solder joint is TPSDV. Temperature is the main factor affecting the failure mode of solder joint. With the increase of temperature, the crack of solder joint extends gradually from the interface metal compound (IMC) layer near the package side to the inner part of the solder. The failure mode of solder joint evolves from brittle fracture to ductile fracture. Based on the analysis of the failure data of solder joint, it is found that there is a correlation between the fatigue life of solder joint and the maximum strain range on the back of PCB plate. The fatigue life model of solder joint is established by polynomial fitting. The fitting results show that the model can better evaluate the solder joint life under the coupling condition of temperature and vibration, and the prediction accuracy is higher.
【作者單位】： 空軍工程大學(xué)航空航天工程學(xué)院;
【基金】：陜西省自然科學(xué)基金(No.2015JM6345) 航空科學(xué)基金(No.20142896022)
【分類號(hào)】：TN406
【正文快照】： 1引言在電子設(shè)備中,電子芯片通過焊點(diǎn)實(shí)現(xiàn)與電路板之間的機(jī)械固定與電氣互聯(lián).隨著電子制造技術(shù)的進(jìn)步,焊點(diǎn)尺寸越來越小,密度越來越高,電子設(shè)備的服役環(huán)境卻越來越嚴(yán)酷,尤其是在航空航天與軍事領(lǐng)域,機(jī)載或彈載電子設(shè)備通常工作在高、低溫頻繁轉(zhuǎn)換與振動(dòng)等惡劣環(huán)境中,板級(jí)焊點(diǎn)，

本文編號(hào)：1425870