本文關(guān)鍵詞：數(shù)字圖像處理開發(fā)板EMI的仿真與分析　出處：《內(nèi)蒙古大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 高速PCB EMI 場路協(xié)同仿真 經(jīng)驗理論規(guī)則

【摘要】：電子產(chǎn)品的更新?lián)Q代周期越來越短,帶來的除了功能上的更加強大、性能上的更加便攜與低耗,所引起的問題也不容忽視,這就是電子產(chǎn)品的核心組成部分——PCB的高速、高集成所帶來的電磁干擾(Electromagnetic Interference, EMI)問題。本次設(shè)計從經(jīng)驗理論規(guī)則的角度進行PCB板EMI問題的分析研究。利用ANSYS軟件,以及業(yè)內(nèi)廣泛使用的分析方法——場路協(xié)同仿真對其進行仿真分析,由此總結(jié)出基于經(jīng)驗理論的PCB的EMI設(shè)計規(guī)則。其主要工作如下：1.對八條經(jīng)驗理論規(guī)則進行建模仿真,包括PCB的走線長度,過孔數(shù)量,布線與板邊緣距離,回流路徑的不連續(xù),信號保護線的有無,退耦電容的有無,差分信號線的間隔距離以及串?dāng)_問題等。2.根據(jù)分析所得的結(jié)果總結(jié)了基于經(jīng)驗的EMI設(shè)計規(guī)則。3.使用EMIStream對目標(biāo)PCB板進行了EMI測試,然后根據(jù)測試結(jié)果結(jié)合總結(jié)的EMI設(shè)計規(guī)則在Cadence中對開發(fā)板進行修改。4.對改進前后的目標(biāo)PCB板分別進行了場路協(xié)同仿真,由仿真結(jié)果分析目標(biāo)PCB板的EMI問題是否得到改善。5.總結(jié)了基于預(yù)檢測和經(jīng)驗理論規(guī)則的改善高速PCB板EMI問題的方法。
[Abstract]:The replacement cycle of electronic products is getting shorter and shorter, which not only brings more powerful functions, more portable and low consumption, but also causes problems that can not be ignored. This is the core component of electronic products, the high speed, high integration of electromagnetic interference electromagnetic Interference. EMI) problem. This design from the perspective of empirical theory rules of PCB board EMI problem analysis and research, using ANSYS software. As well as the widely used analysis method-field path collaborative simulation for its simulation analysis. This paper summarizes the EMI design rules of PCB based on empirical theory. The main work is as follows: 1. Modeling and simulation of eight empirical theoretical rules, including the length of the PCB line, the number of holes. The distance between the wiring and the edge of the plate, the discontinuity of the reflux path, the existence or not of the signal protection line, the existence or not of the decoupling capacitance. The distance between the differential signal lines and the crosstalk problem. 2. According to the results of the analysis, the rule of EMI design based on experience is summarized. 3. Using EMIStream to carry out EM on the target PCB board. I test. Then according to the test results combined with the summary of the EMI design rules, the development board is modified in Cadence. Finally, the field path collaborative simulation of the target PCB board before and after the improvement is carried out. The simulation results are used to analyze whether the EMI problem of the target PCB board has been improved. 5. The methods of improving the EMI problem of high speed PCB board based on pre-detection and empirical theory rules are summarized.
【學(xué)位授予單位】：內(nèi)蒙古大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN41

【參考文獻】

相關(guān)期刊論文 前5條

1 朱文立;國內(nèi)外電磁兼容發(fā)展動態(tài)[J];電子質(zhì)量;2003年07期

2 李富同,秦偉芳,山其賢,Wayne Hunter;高速PCB板的EMI設(shè)計導(dǎo)則[J];電子質(zhì)量;2004年12期

3 王曉方;羅雷;樊向武;;某型火箭煙幕彈電磁兼容試驗研究[J];裝備制造技術(shù);2010年08期

4 張戟;孫瑞;;板級EMI問題研究[J];山東理工大學(xué)學(xué)報(自然科學(xué)版);2010年06期

5 趙震,黃克軍,張晨;高速電路板的電磁兼容(EMC)設(shè)計[J];鐵道通信信號;2001年06期

相關(guān)碩士學(xué)位論文 前3條

1 王林;EMC掃描儀的研發(fā)[D];杭州電子科技大學(xué);2010年

2 練國輝;基于計算機主板高速PCB電磁兼容設(shè)計和應(yīng)用[D];華南理工大學(xué);2012年

3 楊古月;PCB板的電磁協(xié)同設(shè)計[D];哈爾濱工程大學(xué);2013年

，

本文編號：1414761