本文關(guān)鍵詞：LED質(zhì)檢裝備機(jī)械精度標(biāo)定方法研究與應(yīng)用　出處：《華中科技大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

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【摘要】：LED質(zhì)檢裝備是LED芯片封裝前,對(duì)其進(jìn)行光電參數(shù)檢測(cè)、等級(jí)劃分和歸類的設(shè)備的統(tǒng)稱。在檢測(cè)、分選前需要對(duì)移送系統(tǒng)進(jìn)行機(jī)械精度標(biāo)定,以確定核心部件與工藝相關(guān)的功能參數(shù),為實(shí)際生產(chǎn)提供準(zhǔn)確參考。標(biāo)定的精度影響后續(xù)工藝參數(shù)設(shè)置決策,最終影響產(chǎn)品質(zhì)量。同時(shí),提高標(biāo)定效率有利于研制設(shè)備的產(chǎn)業(yè)化。本文以移送系統(tǒng)的機(jī)械精度標(biāo)定為研究對(duì)象,研究了機(jī)械精度標(biāo)定的方法并實(shí)際應(yīng)用于現(xiàn)有設(shè)備,規(guī)范了標(biāo)定程序、提高了測(cè)量效率和精度。主要內(nèi)容有:從LED芯片檢測(cè)、分選工藝著手,結(jié)合移送系統(tǒng)的傳動(dòng)結(jié)構(gòu),分析了LED質(zhì)檢裝備機(jī)械精度的標(biāo)定需求。針對(duì)各項(xiàng)標(biāo)定特性,分析制定了相應(yīng)的可行方案。針對(duì)X-Y工作臺(tái)定位誤差測(cè)量,對(duì)激光干涉測(cè)長(zhǎng)誤差進(jìn)行了系統(tǒng)分析。設(shè)計(jì)了測(cè)量夾具簡(jiǎn)化了測(cè)量組件的安裝和光路的準(zhǔn)直,減少了由于安裝導(dǎo)致的測(cè)量誤差、提高了測(cè)量效率。然后,基于PMAC的誤差補(bǔ)償機(jī)制,對(duì)定位誤差進(jìn)行了必要補(bǔ)償,滿足了設(shè)計(jì)需要。針對(duì)偏心輪從動(dòng)件位置曲線的標(biāo)定,設(shè)計(jì)了基于激光三角法和接觸測(cè)量的標(biāo)定方法并通過實(shí)驗(yàn)對(duì)兩者進(jìn)行了比較。特別分析了非合作表面散射特性對(duì)激光三角法測(cè)量精度的影響,并設(shè)計(jì)了測(cè)量輔具,一方面,改善了被測(cè)表面的散射特性,提高了測(cè)量精度;另一方面也實(shí)現(xiàn)了多部件的同工位標(biāo)定,還減少了激光測(cè)量頭與被測(cè)件之間相對(duì)距離的調(diào)整工作量。最后針對(duì)擺臂取、放芯片力的標(biāo)定,對(duì)不同型號(hào)的吸嘴與擺臂的組合進(jìn)行了取、放力標(biāo)定。結(jié)合擺臂位置曲線共同為芯片取、放的位-力控制提供了可靠基礎(chǔ)。
[Abstract]:LED quality inspection equipment is the general name of the photoelectric parameter detection, classification and classification of LED chip before packaging. Before testing and sorting, it is necessary to calibrate the mechanical accuracy of the transfer system. In order to determine the core components and process related functional parameters, for actual production to provide an accurate reference. Calibration accuracy affects the subsequent process parameters set decision, and ultimately affects the quality of the product. At the same time. Improving the calibration efficiency is beneficial to the industrialization of the development equipment. This paper takes the mechanical precision calibration of the transfer system as the research object, studies the method of the mechanical precision calibration and applies it to the existing equipment, and standardizes the calibration program. The measurement efficiency and precision are improved. The main contents are as follows: starting from the LED chip detection and sorting process, combining with the transmission structure of the transfer system. The calibration requirements of mechanical accuracy of LED quality inspection equipment are analyzed. According to the calibration characteristics, the corresponding feasible scheme is analyzed and the positioning error measurement of X-Y table is made. The measurement fixture is designed to simplify the installation of the measuring module and the collimation of the optical path, reduce the measurement error caused by the installation, and improve the measuring efficiency. Based on the error compensation mechanism of PMAC, the positioning error is compensated to meet the design needs. The calibration of the position curve of the eccentric wheel follower is carried out. The calibration methods based on laser triangulation and contact measurement are designed and compared through experiments, especially the influence of non-cooperative surface scattering characteristics on the measurement accuracy of laser triangulation is analyzed. On the one hand, the scattering characteristics of the measured surface are improved and the measurement accuracy is improved. On the other hand, the calibration of multiple components is realized, and the adjustment of relative distance between the laser measuring head and the measured part is reduced. Finally, the calibration of the chip force is carried out according to the swing arm. The combination of different types of suction nozzle and pendulum arm is used to calibrate the releasing force, and the position curve of the pendulum arm is combined to provide a reliable basis for the position and force control of the chip.
【學(xué)位授予單位】：華中科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN312.8

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