本文關(guān)鍵詞：電子產(chǎn)品組裝CAPP系統(tǒng)研究與開發(fā)　出處：《三峽大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 電子產(chǎn)品組裝 CAPP系統(tǒng)開發(fā) 可組裝性分析 柔性車間調(diào)度 貼裝過程仿真

【摘要】：電子產(chǎn)品組裝工藝規(guī)劃是電子產(chǎn)品生產(chǎn)過程中的關(guān)鍵環(huán)節(jié)，縮短印刷電路板組裝工藝規(guī)程準(zhǔn)備時(shí)間，提高工藝規(guī)劃質(zhì)量，是提高電子產(chǎn)品質(zhì)量和電子產(chǎn)品生產(chǎn)企業(yè)效益的關(guān)鍵環(huán)節(jié)。本文就以電子產(chǎn)品組裝工藝為基礎(chǔ)，結(jié)合CAPP系統(tǒng)開發(fā)基本原理，對(duì)電子產(chǎn)品組裝CAPP系統(tǒng)做了深入研究，同時(shí)對(duì)原型系統(tǒng)的開發(fā)過程做了詳細(xì)的講解。本文的研究工作和主要內(nèi)容包括： （1）基于可組裝性分析的電子產(chǎn)品組裝CAPP系統(tǒng)研究。分析電子產(chǎn)品組裝工藝過程及特點(diǎn)，結(jié)合CAPP系統(tǒng)基本理論和構(gòu)建方法，提出電子產(chǎn)品組裝CAPP系統(tǒng)基本概念，并對(duì)系統(tǒng)總體結(jié)構(gòu)、基本功能模塊、實(shí)現(xiàn)方法、關(guān)鍵技術(shù)和開發(fā)環(huán)境工具做了深入分析；提出了電子產(chǎn)品可組裝性分析基本概念，應(yīng)用多色集合理論建立可組裝性分析模型，結(jié)合多色集合邏輯推理實(shí)現(xiàn)可組裝性分析，最終根據(jù)企業(yè)實(shí)際生產(chǎn)情況生成可組裝性分析報(bào)告。 （2）電子產(chǎn)品組裝工藝規(guī)劃研究。歸納總結(jié)電子產(chǎn)品組裝過程中印制電路板的組裝工藝流程，構(gòu)建系統(tǒng)開發(fā)典型工藝知識(shí)庫(kù)，結(jié)合修訂式CAPP系統(tǒng)開發(fā)技術(shù)和基本原理，開發(fā)符合電子產(chǎn)品組裝的CAPP系統(tǒng)；以復(fù)合式貼片機(jī)貼裝過程優(yōu)化為例，首先建立了貼裝過程優(yōu)化模型，然后用遺傳算法和元胞遺傳算法對(duì)模型求解，最終得到貼裝過程優(yōu)化結(jié)果，將結(jié)果應(yīng)用于系統(tǒng)后續(xù)工時(shí)定額分析。 （3）基于模型庫(kù)的貼裝過程仿真研究�；赑ro/E二次開發(fā)技術(shù)，應(yīng)用其三維參數(shù)化建模功能，建立常用電子封裝元器件三維參數(shù)化模型庫(kù)，再用三維仿真技術(shù)實(shí)現(xiàn)典型貼裝設(shè)備的三維動(dòng)態(tài)仿真，通過仿真技術(shù)及時(shí)發(fā)現(xiàn)電子產(chǎn)品組裝過程中可能出現(xiàn)的缺陷。 （4）電子產(chǎn)品組裝CAPP系統(tǒng)拓展研究。結(jié)合電子產(chǎn)品組裝工藝以及電子產(chǎn)品生產(chǎn)企業(yè)的特點(diǎn)，應(yīng)用多色集合約束模型建立了PCB組裝柔性車間調(diào)度多目標(biāo)優(yōu)化模型，基于模型約束下改進(jìn)NSGA-II多目標(biāo)優(yōu)化算法對(duì)模型進(jìn)行求解，得到調(diào)度甘特圖，并將上述優(yōu)化模塊集成到電子產(chǎn)品組裝CAPP系統(tǒng)，更進(jìn)一步完善了系統(tǒng)功能。 （5）電子產(chǎn)品組裝CAPP系統(tǒng)總體設(shè)計(jì)和實(shí)現(xiàn)。對(duì)電子產(chǎn)品組裝CAPP系統(tǒng)總體框架和模塊功能進(jìn)行規(guī)劃分析，對(duì)分功能模塊進(jìn)行設(shè)計(jì)實(shí)現(xiàn)，開發(fā)了電子產(chǎn)品組裝CAPP原型系統(tǒng)，，并對(duì)系統(tǒng)功能進(jìn)行說明，同時(shí)給出了系統(tǒng)的運(yùn)行實(shí)例。
[Abstract]:The electronic product assembly process planning is the key link in the electronic product production process. It shortens the preparation time of the printed circuit board assembly process rules and improves the quality of the process planning. It is a key link to improve the quality of electronic products and the efficiency of electronic production enterprises. This paper is based on the assembly process of electronic products and the basic principle of CAPP system development. The CAPP system of electronic product assembly is deeply studied, and the development process of the prototype system is explained in detail. The research work and main contents of this paper include: 1) the research of electronic product assembly CAPP system based on assemblability analysis. The process and characteristics of electronic product assembly are analyzed, and the basic theory and construction method of CAPP system are combined. The basic concept of electronic product assembly CAPP system is put forward, and the system structure, basic function module, realization method, key technology and development environment tool are analyzed deeply. The basic concept of assemblability analysis of electronic products is put forward. The analysis model of assemblability is established by using the theory of polychromatic set, and the analysis of assemblability is realized by combining the logic reasoning of polychromatic set. Finally, according to the actual production situation of the enterprise to generate assembly analysis report. Research on assembly process planning of electronic products. Summarize the assembly process of printed circuit board in the process of assembly of electronic products, and construct the knowledge base of system development typical process. Combined with the development technology and basic principle of the revised CAPP system, the CAPP system which accords with the assembly of electronic products is developed. Taking the process optimization of composite mounting machine as an example, the optimization model of mounting process is established first, then the model is solved by genetic algorithm and cellular genetic algorithm, and finally the optimization results of the process are obtained. The results are applied to the system follow-up man-hour quota analysis. Based on the secondary development technology of Pro/E, the 3D parameterized model library of electronic packaging components is established by using its 3D parameterized modeling function. The 3D dynamic simulation of typical mount equipment is realized by using 3D simulation technology, and the possible defects in the assembly process of electronic products can be found by simulation technology. Electronic product assembly CAPP system development research, combined with electronic product assembly process and the characteristics of electronic product manufacturing enterprises. The multi-objective optimization model of PCB assembly flexible job shop scheduling is established by using the multi-color set constraint model. The model is solved based on the improved NSGA-II multi-objective optimization algorithm under the model constraints. The scheduling Gantt diagram is obtained, and the above optimization module is integrated into the electronic product assembly CAPP system, which further improves the function of the system. 5) the overall design and implementation of electronic product assembly CAPP system. The overall framework and module functions of electronic product assembly CAPP system are planned and analyzed, and the sub-functional modules are designed and implemented. The prototype system of electronic product assembly CAPP is developed, and the function of the system is explained. At the same time, the running example of the system is given.
【學(xué)位授予單位】：三峽大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN05

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