太陽能電池用低溫固化銀漿的制備及性能研究
發(fā)布時間：2018-11-06 12:52
【摘要】：摘要：低溫固化型導(dǎo)電銀漿是一種特殊添加型導(dǎo)體漿料,一般由基體樹脂粘結(jié)相、導(dǎo)電功能相、有機溶劑及其他助劑組成,其優(yōu)良的電性能以及在較低溫度下固化的特點適用于HIT太陽能電池的正面和背面的電極。本文以低溫固化型導(dǎo)電漿料的原料制備和固化工藝為研究對象,主要內(nèi)容包括微細銀粉的制備、片狀銀粉的化學(xué)還原-機械球磨法制備和理論探討、環(huán)氧樹脂的固化工藝參數(shù)的優(yōu)化以及漿料的合成和性能檢測,同時研究漿料各組分對導(dǎo)電性能的影響,研究結(jié)果如下： (1)以保護劑(PVP)+表面活性劑(吐溫-80)為二元分散體系制備微細球形銀粉,PVP能與Ag+形成配合物促進形核,吐溫-80分子通過吸附作用抑制晶核過快生長,二元分散體系能夠在空間和時間上產(chǎn)生協(xié)同作用,有效加強空間位阻效應(yīng)；同時改變還原液和銀液的PH,銀粒子粒徑降低的速度更快更均勻,可以有效控制銀粉的粒徑。反應(yīng)體系的最佳PH為5。調(diào)節(jié)PVP和吐溫-80的配比和用量,當(dāng)m(吐溫-80+PVP)/m(AgNO3)為0.03時制備的銀粉分散性良好,平均粒徑為1.25μm,振實密度達4.6g/cm3,XRD結(jié)果表明銀粉具有很高的純度。 (2)球狀銀粉相比于樹枝狀銀粉和類球狀銀粉球磨效果更好,在制備工藝上更容易控制,有利于片狀銀粉的制備。HLB值小的表面活性劑與HLB值大的表面活性劑混合使用后,彼此的親水基團和親油基團相互配合,分散作用增強,保護效果較好,本文選取司盤-80和吐溫-80復(fù)配使用,當(dāng)復(fù)合表面活性劑體系的HLB值為6時,體系的分散和保護作用最佳,銀粉的松裝密度低至1.65g/cm3,比表面積為2.85m2/g,從SEM圖片可看出銀粉徑厚比較高,成片性較好,銀粉的片徑均勻。 (3)采用差示掃描量熱DSC法研究了雙酚A型環(huán)氧樹脂E-51固化工藝,從熱力學(xué)角度對環(huán)氧樹脂的固化度進行分析,最終確定最佳固化劑用量為8wt%；對不同升溫速率下環(huán)氧樹脂固化過程的特征溫度進行先行擬合,采用外推法求得固化體系的等溫固化溫度,并確定最佳固化溫度確定為160℃。 (4)將片狀銀粉配制成低溫固化型導(dǎo)電漿料,探索了環(huán)氧樹脂E-51/QNP1固化劑體系條件下的最佳固化工藝,在固化溫度160℃,固化時間25±1min條件下銀片的相互搭界到了比較好的程度,形成良好的導(dǎo)電網(wǎng)絡(luò),電阻率為3.2×10-4Ω·cm,潛伏期為20-30天,電性能滿足HIT太陽能電池應(yīng)用要求。全文
[Abstract]:Abstract: low temperature solidified conductive silver paste is a special additive type of conductive paste, which is generally composed of matrix resin bonded phase, conductive functional phase, organic solvent and other auxiliaries. Its excellent electrical properties and solidification at low temperature are suitable for the front and back electrodes of HIT solar cells. In this paper, the raw material preparation and curing process of low temperature solidified conductive paste are studied. The main contents include the preparation of fine silver powder, the preparation of sheet silver powder by chemical reduction-mechanical ball milling method and the theoretical discussion. The optimization of curing process parameters of epoxy resin, the synthesis and performance testing of the slurry, and the influence of the various components of the slurry on the electrical conductivity of the epoxy resin were studied. The results are as follows: (1) using the protective agent (PVP) surfactant (Tween-80) as binary dispersion system to prepare microsphere silver powder, PVP can form complex with Ag to promote nucleation. Tween-80 molecule can inhibit the rapid growth of crystal nucleus through adsorption, and the binary dispersion system can produce synergistic effect in space and time, and effectively strengthen the steric resistance effect. At the same time, the particle size of PH, silver particles decreased faster and more evenly by changing the reduction solution and silver solution, and the particle size of silver powder could be effectively controlled. The optimum PH of the reaction system is 5. When m (Tween-80 PVP) / m (AgNO3) is 0.03, the silver powder prepared by adjusting the ratio and dosage of PVP and Tween-80 has good dispersion, the average particle size is 1.25 渭 m, and the vibrational density is 4.6 g / cm ~ (-3). XRD results showed that silver powder had high purity. (2) compared with dendritic silver powder and globular silver powder, the ball silver powder has better milling effect and is easier to control in the preparation process, which is beneficial to the preparation of silver flake powder. When the surfactant with small HLB value is mixed with the surfactant with high HLB value, The hydrophilic group and oil group cooperate with each other, the dispersion is enhanced and the protective effect is better. In this paper, the compound of Span-80 and Tween-80 is selected, when the HLB value of the composite surfactant system is 6, The loose density of silver powder is as low as 1.65 g / cm ~ (-3) and the specific surface area is 2.85 m2 / g. From the SEM images, we can see that the diameter of silver powder is high, the lamination property is good, and the diameter of silver powder is uniform. (3) the curing process of bisphenol A epoxy resin E-51 was studied by differential scanning calorimetry (DSC). The curing degree of epoxy resin was analyzed from the point of view of thermodynamics. The characteristic temperature of curing process of epoxy resin at different heating rates was first fitted, and the isothermal curing temperature of the curing system was obtained by extrapolation method, and the optimum curing temperature was determined to be 160 鈩，
本文編號：2314340
[Abstract]:Abstract: low temperature solidified conductive silver paste is a special additive type of conductive paste, which is generally composed of matrix resin bonded phase, conductive functional phase, organic solvent and other auxiliaries. Its excellent electrical properties and solidification at low temperature are suitable for the front and back electrodes of HIT solar cells. In this paper, the raw material preparation and curing process of low temperature solidified conductive paste are studied. The main contents include the preparation of fine silver powder, the preparation of sheet silver powder by chemical reduction-mechanical ball milling method and the theoretical discussion. The optimization of curing process parameters of epoxy resin, the synthesis and performance testing of the slurry, and the influence of the various components of the slurry on the electrical conductivity of the epoxy resin were studied. The results are as follows: (1) using the protective agent (PVP) surfactant (Tween-80) as binary dispersion system to prepare microsphere silver powder, PVP can form complex with Ag to promote nucleation. Tween-80 molecule can inhibit the rapid growth of crystal nucleus through adsorption, and the binary dispersion system can produce synergistic effect in space and time, and effectively strengthen the steric resistance effect. At the same time, the particle size of PH, silver particles decreased faster and more evenly by changing the reduction solution and silver solution, and the particle size of silver powder could be effectively controlled. The optimum PH of the reaction system is 5. When m (Tween-80 PVP) / m (AgNO3) is 0.03, the silver powder prepared by adjusting the ratio and dosage of PVP and Tween-80 has good dispersion, the average particle size is 1.25 渭 m, and the vibrational density is 4.6 g / cm ~ (-3). XRD results showed that silver powder had high purity. (2) compared with dendritic silver powder and globular silver powder, the ball silver powder has better milling effect and is easier to control in the preparation process, which is beneficial to the preparation of silver flake powder. When the surfactant with small HLB value is mixed with the surfactant with high HLB value, The hydrophilic group and oil group cooperate with each other, the dispersion is enhanced and the protective effect is better. In this paper, the compound of Span-80 and Tween-80 is selected, when the HLB value of the composite surfactant system is 6, The loose density of silver powder is as low as 1.65 g / cm ~ (-3) and the specific surface area is 2.85 m2 / g. From the SEM images, we can see that the diameter of silver powder is high, the lamination property is good, and the diameter of silver powder is uniform. (3) the curing process of bisphenol A epoxy resin E-51 was studied by differential scanning calorimetry (DSC). The curing degree of epoxy resin was analyzed from the point of view of thermodynamics. The characteristic temperature of curing process of epoxy resin at different heating rates was first fitted, and the isothermal curing temperature of the curing system was obtained by extrapolation method, and the optimum curing temperature was determined to be 160 鈩，
本文編號：2314340
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