本文選題：銅基電接觸材料 + 抗電弧燒蝕��； 參考：《濟南大學》2014年碩士論文

【摘要】：本論文是在實驗室原有研究基礎上，通過加入不同含量的氧化釔、碳化鎢，探究其對銅基電接觸材料組織及性能的影響，特別是對材料抗電弧燒蝕的影響；通過對銅粉磁控濺射鍍銀，研究鍍銀銅粉抗氧性能及其燒結性能；通過在金屬銅中添加不同含量的稀土釔，探究釔對銅性能的影響，特別是對其抗氧化性能的影響；把電阻率法應用于粉末冶金燒結工藝參數的確定。 研究結果表明： (1)當添加適量的氧化釔，材料的密度和硬度都得到了提高，氧化釔的添加量為1.5wt.%時，材料密度提高最為顯著；氧化釔的添加量為2wt.%時，材料硬度提高最為顯著。添加氧化釔有利于阻礙基體銅晶粒的長大，這有利于添加組元更均勻地分布在基體中，能更好地提高材料的電接觸性能。通過20000次電弧侵蝕試驗表明：添加氧化釔制備的電觸頭材料的抗電弧燒蝕性能遠遠優(yōu)于通用的銅鎳合金銀復層觸頭材料，試驗后新觸頭的接觸電阻仍能保持穩(wěn)定的且較低的數值。但是，氧化釔的加入對銅基電觸頭材料的導電性有不利影響。 (2)研究了電阻率法在粉末冶金燒結工藝參數確定方面的應用。通過實時地測定燒結過程中壓坯電阻率的變化，可以快速確定粉末冶金的燒結工藝參數，這種方法對粉末冶金制品的燒結參數的確定具有廣泛的適用性。 (3)添加碳化鎢可以提高材料的抗電弧燒蝕性能，但是碳化鎢對材料的致密度和導電性有不利的影響，添加少量碳化鎢可以提高材料的硬度，但其加入量大于6wt.%時，材料的硬度開始下降。對碳化鎢顆粒表面進行了磁控濺射鍍銅，明顯改善了WC/Cu復合界面，添加鍍膜碳化鎢復合材料的致密度、硬度都比添加未鍍膜碳化鎢復合材料有明顯提高，材料的導電性能也得到改善。 (4)為了改善銅基電接觸材料的抗氧化性，通過磁控濺射的方法，在銅粉表面鍍一層銀膜。通過研究濺射時間與鍍銀銅粉氧化增重之間關系情況，最終確定了濺射時間為23min。通過把銅粉和鍍銀銅粉分別壓制成坯，然后對比在不同燒結時間下的試樣性能情況。研究發(fā)現：鍍銀銅粉制備的試樣在不同的燒結時間下，致密度和硬度都高于純銅粉制備的試樣，抗氧化性能也優(yōu)于純銅粉制備試樣，，但是鍍銀銅粉制備的試樣導電性比純銅試樣差。 (5)在金屬銅添加少量稀土釔（少于0.5wt.%），其導電性能增強，添加過量的稀土釔又會使金屬銅的導電性能變差。通過抗氧化實驗發(fā)現：銅釔合金隨著稀土釔添加量的增大，試樣氧化增重逐漸降低；當稀土釔的添加量為0.1wt.%、0.2wt.%和0.5wt.%時，試樣抗氧化性能的提高較為明顯；隨稀土釔添加量進一步增大時，試樣氧化增重的減小趨勢緩慢下來。由于添加少量釔對銅組織凈化作用，添加0.1wt.%釔時，金屬銅的硬度略微下降，減少了銅中固溶的雜質原子。但金屬銅中隨釔添加量的繼續(xù)增加，銅釔合金的硬度逐步增大。
[Abstract]:This paper is based on the original research in the laboratory, through the addition of different contents of yttrium oxide, tungsten carbide, to explore its impact on the structure and properties of copper based electrical contact materials, especially on the effect of arc ablation resistance of materials; The oxygen resistance and sintering properties of silver plated copper powder were studied by magnetron sputtering of copper powder, and the effect of yttrium on copper properties, especially its oxidation resistance, was investigated by adding different contents of rare earth yttrium to copper. The resistivity method is applied to determine the sintering parameters of powder metallurgy. The results showed that: (1) the density and hardness of yttrium oxide were increased with the addition of appropriate amount of yttrium oxide, the density of yttrium oxide was the most significant when the addition amount of yttrium oxide was 1.5wt.%, and the addition amount of yttrium oxide was 2wt.%. The hardness of the material is the most obvious. The addition of yttrium oxide is beneficial to the growth of copper grains in the matrix, which is conducive to the more uniform distribution of the added components in the matrix, which can improve the electrical contact properties of the materials. The results of 20000 arc erosion tests show that the arc ablation resistance of the contact material prepared by adding yttrium oxide is much better than that of the common copper-nickel alloy silver clad contact material. The contact resistance of the new contact is stable and low after the test. However, the addition of yttrium oxide has a negative effect on the electrical conductivity of copper-based electrical contact materials. (2) the application of resistivity method to the determination of sintering parameters in powder metallurgy is studied. The sintering parameters of powder metallurgy can be quickly determined by measuring the change of the resistivity of compacted billet during sintering in real time. This method is widely applicable to the determination of sintering parameters of powder metallurgy products. (3) addition of tungsten carbide can improve the arc ablation resistance of the materials, but tungsten carbide has a negative effect on the density and conductivity of the materials. Adding a small amount of tungsten carbide can improve the hardness of the material, but when the addition amount is more than 6 wt.%, the hardness of the material begins to decrease. The WC / Cu composite interface was obviously improved by magnetron sputtering copper plating on the surface of tungsten carbide particles. The density and hardness of WC / Cu composite were obviously improved compared with those of uncoated tungsten carbide composites. (4) in order to improve the oxidation resistance of copper based electrical contact materials, a silver film was deposited on the surface of copper powder by magnetron sputtering. By studying the relationship between sputtering time and oxidation weight gain of silver plated copper powder, the sputtering time was determined to be 23 min. The copper powder and silver plated copper powder were respectively pressed into billets, and then the properties of the samples were compared under different sintering time. It was found that the density and hardness of the samples prepared by silver plating copper powder were higher than those prepared by pure copper powder at different sintering times, and the oxidation resistance of the samples prepared by silver plated copper powder was also better than that prepared by pure copper powder. However, the electrical conductivity of the sample prepared by silver plating copper powder is worse than that of pure copper sample. (5) adding a small amount of rare earth yttrium (less than 0.5 wt.%) to metal copper increases its electrical conductivity, and the addition of excess rare earth yttrium will make the conductivity of metal copper worse. It was found that the oxidation weight of the sample decreased with the increase of the amount of yttrium, and the oxidation resistance of the sample increased obviously when the addition amount of yttrium was 0.1wt.% and 0.5wt.%. With the increase of the amount of yttrium, the decreasing trend of the oxidation weight of the sample slowed down. Due to the purification of copper by adding a small amount of yttrium, the hardness of copper decreases slightly when adding 0.1 wt.% yttrium, which reduces the impurity atoms in copper solution. However, with the increase of yttrium content, the hardness of copper and yttrium alloy increases gradually.
【學位授予單位】：濟南大學
【學位級別】：碩士
【學位授予年份】：2014
【分類號】：TM501.3

【參考文獻】

相關期刊論文 前10條

1 葉家健;熊惟皓;徐堅;傅江華;李震彪;;低壓繼電器用AgSnO_2觸頭材料的研究進展[J];材料導報;2007年02期

2 李司山;黃福祥;汪振;李敏;;電接觸材料的研究進展[J];材料導報;2008年S1期

3 錢寶光,耿浩然,郭忠全,陶珍東,田憲法;B_4C對銅基復合材料的力學性能與抗氧化性的影響[J];材料工程;2005年05期

4 ;Interface Structure of Ag/SnO_2 Nanocomposite Fabricated by Reactive Synthesis[J];Journal of Materials Science & Technology;2010年01期

5 雷景軒,馬學鳴,余海峰,朱麗慧;機械合金化制備電觸頭材料進展[J];材料科學與工程;2002年03期

6 錢寶光,耿浩然,郭忠全,楊勤達,陶珍東;電觸頭材料的研究進展與應用[J];機械工程材料;2004年03期

7 溫培剛;顏悅;張官理;望詠林;;磁控濺射沉積工藝條件對薄膜厚度均勻性的影響[J];航空材料學報;2007年03期

8 吳細秀,狄美華,李震彪;電流電弧作用下觸頭表面熱過程的數值計算[J];華中科技大學學報(自然科學版);2003年02期

9 堵永國,龍雁,張家春;電接觸材料的熱導率[J];電工合金;1996年02期

10 李震彪,程禮椿,鄒積巖,張漢民,張逸成;論電器觸頭材料的理論研究問題[J];電工合金;1997年04期

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