本文選題：LED球泡燈 + 封裝　； 參考：《重慶大學(xué)》2014年碩士論文

【摘要】：LED光源由于其節(jié)能、環(huán)保和高壽命等諸多優(yōu)點(diǎn)，正逐步取代白熾燈、熒光燈、高壓氣體放電燈等傳統(tǒng)照明光源，將成為新一代綠色照明光源。然而，隨著LED光源功率日益增大，散熱問題尤為突出，成為了限制其發(fā)展的關(guān)鍵問題之一。 本論文在分析LED封裝結(jié)構(gòu)和散熱方法的基礎(chǔ)上，改進(jìn)了LED基板與散熱器的傳統(tǒng)壓接方式，提出了一款基于冷噴涂技術(shù)的新型整體純鋁散熱器的12WLED球泡燈，用以替代傳統(tǒng)100W白熾燈；借助數(shù)值模擬和實(shí)驗(yàn)相結(jié)合的研究方法，對(duì)該球泡燈的散熱性能進(jìn)行了分析研究，提煉出了影響其散熱的主要因素。 12WLED球泡燈的散熱器由純鋁板裁剪和彎折而成。首先分析了傳統(tǒng)COB封裝的內(nèi)部結(jié)構(gòu)，利用ANSYS軟件模擬分析得出覆銅層厚度是影響熱阻大小的主要因素，提出了一種優(yōu)于傳統(tǒng)COB封裝的基于冷噴涂直焊技術(shù)的新型去除銅基板的封裝方式；進(jìn)一步通過不同LED芯片陣列方式、散熱器結(jié)構(gòu)的比較分析和優(yōu)化，尋求到了一種最優(yōu)的盡可能滿足多方面要求的散熱器結(jié)構(gòu)。利用EFD軟件模擬新型散熱器的溫度場(chǎng)分布并通過實(shí)驗(yàn)驗(yàn)證其可靠性，分析其在額定工況下的散熱性能，最終設(shè)計(jì)出一款完整的LED球泡燈。與現(xiàn)有LED球泡燈相比，不僅能夠滿足散熱和發(fā)光要求、符合人們照明習(xí)慣，而且體積小、質(zhì)量輕、成本低、易于加工，，為L(zhǎng)ED球泡燈的設(shè)計(jì)提供了一種新方法。
[Abstract]:Due to its advantages of energy saving, environmental protection and long life, LED light source is gradually replacing incandescent lamp, fluorescent lamp, high-voltage gas discharge lamp and other traditional lighting sources, which will become a new generation of green lighting source. However, with the increasing power of LED light source, the problem of heat dissipation is particularly prominent, which has become one of the key problems restricting the development of LED light source. Based on the analysis of LED packaging structure and heat dissipation method, the traditional pressing mode of LED substrate and radiator is improved in this paper. A new 12WLED bulb lamp based on cold spraying technology is proposed for the integrated pure aluminum radiator. It is used to replace the traditional 100W incandescent lamp, and the heat dissipation performance of the bulb lamp is analyzed by the method of numerical simulation and experiment. The radiator of 12WLED bulb lamp is made by cutting and bending of pure aluminum plate. Firstly, the internal structure of the traditional COB package is analyzed, and the results of ANSYS software simulation show that the thickness of copper coating is the main factor affecting the thermal resistance. In this paper, a new method of removing copper substrate is proposed, which is superior to traditional COB package, and the structure of radiator is compared and optimized by different LED chip array. A kind of optimal radiator structure is sought, which can satisfy various requirements as far as possible. The temperature field distribution of the new type radiator is simulated by EFD software and its reliability is verified by experiments. The heat dissipation performance under rated working condition is analyzed and a complete LED bulb lamp is designed. Compared with the existing LED bulb lamp, it can not only meet the requirements of heat dissipation and luminescence, but also meet the lighting habits of people. It is also small in volume, light in weight, low in cost and easy to process. It provides a new method for the design of LED bulb lamp.
【學(xué)位授予單位】：重慶大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TM923.34

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