本文選題：繼電器 + 微粒碰撞噪聲檢測�。� 參考：《哈爾濱工業(yè)大學(xué)》2014年博士論文

【摘要】：密封繼電器是用于完成信號傳遞、執(zhí)行控制和系統(tǒng)配電等功能的電子元器件，其可靠性直接影響著航天電子系統(tǒng)的可靠性。密封繼電器內(nèi)部多余物是引起繼電器失效的主要原因。因此，密封繼電器出廠前必須通過多余物檢測試驗(yàn)。微粒碰撞噪聲檢測（Particle Impact Noise Detection，PIND）試驗(yàn)是檢測密封電子元器件內(nèi)部多余物的主要手段。大量應(yīng)用實(shí)踐表明，現(xiàn)行PIND試驗(yàn)條件對吸附能力較強(qiáng)的多余物激活能力不足，易發(fā)生誤判和漏判，急需改進(jìn)。目前針對多余物激活過程、PIND極限試驗(yàn)條件及試驗(yàn)條件擴(kuò)展方面的研究較少，PIND試驗(yàn)條件的改進(jìn)沒有理論依據(jù)，無法得到PIND最佳試驗(yàn)條件、無法發(fā)揮PIND最大檢測能力。針對上述問題，本文建立試驗(yàn)條件研究平臺(tái)，研究多余物激活影響因素和PIND極限試驗(yàn)條件，確定PIND最佳試驗(yàn)條件，提出新的用于密封繼電器多余物檢測的PIND試驗(yàn)方法，發(fā)揮PIND最大檢測能力。 首先，為研究PIND試驗(yàn)條件，本文建立試驗(yàn)條件研究平臺(tái)。首次提出將隨機(jī)振動(dòng)應(yīng)用于密封繼電器PIND過程，設(shè)計(jì)并實(shí)現(xiàn)可輸出正弦振動(dòng)激勵(lì)、隨機(jī)振動(dòng)激勵(lì)和沖擊激勵(lì)的密封繼電器多余物自動(dòng)檢測系統(tǒng)；提出將高速攝像技術(shù)用于觀察多余物運(yùn)動(dòng)過程的方法，設(shè)計(jì)并實(shí)現(xiàn)多余物運(yùn)動(dòng)過程分析系統(tǒng)，實(shí)現(xiàn)PIND試驗(yàn)條件可視化研究。 然后，為分析多余物激活影響因素，本文建立多余物激活過程仿真模型，提出密封繼電器多余物激活過程的仿真分析方法，給出試驗(yàn)條件對多余物激活效果影響規(guī)律并通過實(shí)驗(yàn)證明了該規(guī)律的正確性；采用理論推導(dǎo)法和實(shí)驗(yàn)研究法，，確定多余物無效激活頻率；分析多余物微粒在密封繼電器內(nèi)部的靜電吸附特性，給出減小靜電吸附影響方案。 其次，為分析PIND極限試驗(yàn)條件，本文研究試驗(yàn)條件對密封繼電器的損傷機(jī)理，給出密封繼電器PIND極限試驗(yàn)條件的評判標(biāo)準(zhǔn)；提出密封繼電器PIND極限試驗(yàn)條件研究方法；確定密封繼電器在不受損傷的前提下可承受的極限振動(dòng)和沖擊試驗(yàn)條件，并通過實(shí)驗(yàn)驗(yàn)證了PIND極限試驗(yàn)條件的正確性。 最后，為分析PIND最佳試驗(yàn)條件，本文建立多余物激勵(lì)過程的動(dòng)力學(xué)模型，提出多余物激勵(lì)過程仿真分析方法。采用實(shí)驗(yàn)研究法和仿真分析方法研究振動(dòng)試驗(yàn)條件對多余物檢測效果的影響與多余物及被試器件參數(shù)的關(guān)系；采用正交試驗(yàn)設(shè)計(jì)方法和極差分析法研究振動(dòng)試驗(yàn)條件對多余物檢測效果的影響規(guī)律。根據(jù)用途不同，給出4組PIND最佳振動(dòng)試驗(yàn)條件，給出3組PIND最佳沖擊試驗(yàn)條件；提出了能夠發(fā)揮最大檢測能力的用于密封繼電器多余物檢測的PIND試驗(yàn)方法。與GJB65B規(guī)定PIND方法的對比實(shí)驗(yàn)表明，新的方法有效地提高了多余物檢測能力。
[Abstract]:Sealed relay is an electronic component used for signal transmission, control and system distribution. Its reliability directly affects the reliability of aerospace electronic system. The internal surplus of sealed relay is the main reason for the failure of relay. Therefore, the sealed relay must pass the surplus test before leaving the factory. Particle impact noise detection (Particle impact noise detection) test is the main method to detect the internal surplus of sealed electronic components. A large number of practical applications show that the current Pind test conditions have insufficient activation ability to the superfluous materials with strong adsorption capacity, which are liable to misjudge and miss judgment, and are in urgent need of improvement. At present, there are few researches on limit test conditions and expansion of Pind test conditions for the activation process of superfluous materials. There is no theoretical basis for improving the Pind test conditions, and the optimal test conditions for Pind can not be obtained, and the maximum detection ability of Pind can not be brought into full play. In order to solve the above problems, this paper establishes a research platform for test conditions, studies the influence factors of excess activation and Pind limit test conditions, determines the optimal test conditions of Pind, and puts forward a new Pind test method for the detection of surplus material in sealed relays. First of all, in order to study the Pind test conditions, this paper establishes a research platform for the test conditions. It is the first time that the random vibration is applied to the Pind process of the sealed relay, and the automatic detection system of the excess material of the sealed relay is designed and realized, which can output sinusoidal vibration, random vibration excitation and shock excitation. This paper presents a method of using high speed camera technology to observe the motion process of superfluous objects, designs and implements a system for analyzing the motion process of superfluous objects, and realizes visual research on Pind test conditions. Then, in order to analyze the factors affecting the activation of superfluous objects, In this paper, the simulation model of the activation process of the superfluous material is established, and the simulation analysis method of the activation process of the superfluous substance of the sealed relay is put forward. The frequency of invalid activation of superfluous materials is determined by theoretical derivation and experimental research. The electrostatic adsorption characteristics of superfluous particles in sealed relays are analyzed, and the scheme to reduce the influence of electrostatic adsorption is given. Secondly, the limit test conditions of Pind are analyzed. In this paper, the damage mechanism of sealed relay caused by test conditions is studied, and the evaluation standard of Pind limit test condition of sealed relay is given, and the research method of Pind limit test condition of sealed relay is put forward. The limit vibration and shock test conditions of sealed relay without damage are determined, and the correctness of Pind limit test conditions is verified by experiments. Finally, in order to analyze the optimal test conditions of Pind, In this paper, the dynamic model of excited-process of superfluous material is established, and the simulation analysis method of exciting-process of superfluous material is proposed. The relationship between the effect of vibration test condition on the detection effect of excess material and the parameters of spare material and device was studied by means of experimental research and simulation analysis. The orthogonal design method and the range analysis method were used to study the influence of vibration test conditions on the detection effect of superfluous materials. According to the different applications, four groups of Pind optimal vibration test conditions and three groups of Pind optimal impact test conditions are given, and the Pind test method for detecting the surplus of sealed relay is put forward, which can give full play to the maximum detection ability. The comparison experiment with GJB65B Pind method shows that the new method can effectively improve the detection ability of surplus material.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級別】：博士
【學(xué)位授予年份】：2014
【分類號】：TM58

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本文編號：1995204