發(fā)布時(shí)間：2018-01-10 02:24

  本文關(guān)鍵詞：低壓成套開(kāi)關(guān)設(shè)備內(nèi)部環(huán)境溫度的測(cè)試與分析　出處：《大連理工大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 低壓成套開(kāi)關(guān)設(shè)備 溫升 型式試驗(yàn) 內(nèi)部環(huán)境溫度

【摘要】：本文首先對(duì)低壓成套開(kāi)關(guān)設(shè)備進(jìn)行了簡(jiǎn)單的介紹,說(shuō)明低壓成套開(kāi)關(guān)設(shè)備的發(fā)展方向,聲明了熱問(wèn)題對(duì)低壓成套開(kāi)關(guān)設(shè)備的影響,表明了研究熱問(wèn)題對(duì)低壓成套開(kāi)關(guān)設(shè)備的重要性。引入低壓成套開(kāi)關(guān)設(shè)備檢測(cè)的國(guó)家標(biāo)準(zhǔn),講解檢測(cè)標(biāo)準(zhǔn)的換版歷史,說(shuō)明我國(guó)低壓成套開(kāi)關(guān)設(shè)備檢測(cè)行業(yè)的現(xiàn)狀,以及檢測(cè)過(guò)程中存在的問(wèn)題和矛盾：落后檢測(cè)方法,無(wú)法適應(yīng)高新科技產(chǎn)品的檢測(cè)需求,人力電力損耗巨大。為了解決該問(wèn)題和矛盾,本文嘗試性的提出用模擬仿真方法代替?zhèn)鹘y(tǒng)的溫升型式試驗(yàn)方法。最終引出本課題研究對(duì)象——低壓成套開(kāi)關(guān)設(shè)備的溫升型式試驗(yàn)問(wèn)題。針對(duì)低壓成套開(kāi)關(guān)設(shè)備的溫升型式試驗(yàn)問(wèn)題,提出溫度場(chǎng)的概念,構(gòu)建低壓成套開(kāi)關(guān)設(shè)備溫度場(chǎng)的有限元分析數(shù)學(xué)模型,講解傳熱學(xué)的基本理論,說(shuō)明穩(wěn)態(tài)溫度場(chǎng)的熱微分方程,最后說(shuō)明低壓成套開(kāi)關(guān)設(shè)備溫度場(chǎng)分析的有限元法。使用ANSYS14.0軟件對(duì)低壓成套開(kāi)關(guān)設(shè)備的溫升型式試驗(yàn)進(jìn)行仿真試驗(yàn),構(gòu)建XL-21型低壓成套開(kāi)關(guān)設(shè)備的三維實(shí)體模型,劃分網(wǎng)格,施加載荷,數(shù)據(jù)計(jì)算,得出仿真數(shù)據(jù)。嚴(yán)格按照國(guó)家標(biāo)準(zhǔn)的要求,使用先進(jìn)的電流發(fā)生裝置,對(duì)XL型低壓成套開(kāi)關(guān)設(shè)備進(jìn)行溫升型式試驗(yàn),使用GP20型便攜式無(wú)紙記錄儀對(duì)溫度進(jìn)行監(jiān)控和采集,得出試驗(yàn)數(shù)據(jù)。把仿真數(shù)據(jù)同試驗(yàn)數(shù)據(jù)進(jìn)行比較,說(shuō)明低壓成套開(kāi)關(guān)設(shè)備溫升型式試驗(yàn)仿真試驗(yàn)方法的可行性。
[Abstract]:This paper first introduces the low-voltage switchgear, explains the development direction of the low-voltage switchgear, and states the influence of the heat problem on the low-voltage switchgear. This paper shows the importance of studying heat problem to low voltage switchgear, introduces the national standard of low voltage switchgear testing, and explains the history of test standard change. Explain the current situation of the low-voltage switchgear testing industry in our country, and the problems and contradictions in the testing process: backward detection methods, can not meet the testing needs of high-tech products. The manpower power consumption is huge. In order to solve this problem and contradiction. In this paper, we try to replace the traditional temperature rise type test method with the simulation method. Finally, the problem of the temperature rise type test of the low voltage switchgear is brought out. In view of the low voltage complete switchgear, the temperature rise type test problem of the low voltage switchgear is introduced. The temperature rise type test problem. The concept of temperature field is put forward, the finite element analysis mathematical model of temperature field of low voltage switchgear is constructed, the basic theory of heat transfer is explained, and the thermal differential equation of steady state temperature field is explained. Finally, the finite element method for temperature field analysis of low voltage switchgear is introduced. The temperature rise type test of low voltage switchgear is simulated by using ANSYS14.0 software. The three-dimensional solid model of XL-21 type low-voltage switchgear is constructed, the grid is divided, the load is applied, the data is calculated, and the simulation data is obtained. According to the requirements of the national standard, advanced electric current generating devices are used. The temperature rise type test of XL low voltage switchgear is carried out, and the temperature is monitored and collected by GP20 portable paperless recorder, and the test data are obtained. The simulation data are compared with the test data. The feasibility of simulation test method for temperature rise type test of low voltage switchgear is explained.
【學(xué)位授予單位】：大連理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TM643

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