醋酸銅基無顆粒型導電墨水的制備和性能研究
發(fā)布時間:2018-01-22 04:17
本文關鍵詞: 印刷電子 醋酸銅 無顆粒型導電墨水 燒結涂層 電阻率 出處:《鄭州大學》2017年碩士論文 論文類型:學位論文
【摘要】:隨著印刷電子的高速發(fā)展,印刷電子成為微電子領域的一種革命性先進制造技術,引起全球電子行業(yè)、制造行業(yè)等相關行業(yè)的廣泛關注。電子器件向著高精度、低成本的目標發(fā)展,并且對材料、工藝的要求逐漸提高。導電墨水憑借其優(yōu)異的導電性和廣泛的應用領域等特點,必將成為電子印刷研究的核心技術。其中,金屬基導電墨水除了具有導電性外,還可以通過印刷的方式來制備電子線路、圖案,因此其在標簽線路、柔性顯示器、傳感器等電子設備上將廣泛應用。傳統(tǒng)的導電墨水是以金或銀等貴金屬為導電源,但因其成本過高,將限制其更為廣泛的應用。銅憑借低成本、高導電性等優(yōu)勢逐漸受到人們廣泛關注。基于以上原因,本課題通過對導電墨水配方的優(yōu)化,制備出了以醋酸銅為前驅體具有較高導電性的無顆粒型墨水,考察了銅胺配比、銅酸配比、溶劑配比等對燒結涂層導電性能的影響,同時對燒結條件對涂層導電性能的影響也做了初步探究,實現(xiàn)了醋酸銅基無顆粒型導電墨水的低溫燒結。首先以醋酸銅為前驅體,通過對醋酸銅基無顆粒導電墨水的絡合劑和醇溶劑進行優(yōu)化選擇,制備出了具有較高導電性的墨水。采用1,2丙二胺、異丙醇胺、正辛胺、N,N-二甲基乙醇胺、2-氨基-2-甲基-1-丙醇(AMP)這五種胺作為絡合劑,并對所形成的絡合物進行熱穩(wěn)定性分析。結果表明,有機胺能夠較大程度地降低醋酸銅的熱分解溫度,并且以AMP為絡合劑時,導電墨水的燒結涂層電阻率最低,為8.5μ??m。以甲酸為還原劑,通過改變導電墨水中醇溶劑的類型,調節(jié)體系的表面張力、粘度等,得到具有良好穩(wěn)定性的導電墨水。在丙三醇和正丙醇為醋酸銅導電墨水的復合溶劑時,其燒結涂層電阻率低至3.4μ?·m。其次,在上述基礎上,確定了以AMP為絡合劑,丙三醇、正丙醇為復合醇溶劑,制備醋酸銅基無顆粒型導電墨水,進一步研究了墨水中銅胺配比、銅酸配比、溶劑配比對導電墨水導電性能的影響。當銅、胺、酸的物質的量配比為1:2.5:4,溶劑v(丙三醇):v(正丙醇):v(水)的體積比為3:3:2時,所制備的導電墨水的燒結涂層電阻率最低為3.4μ?·m。最后,對導電墨水燒結過程中燒結溫度和時間對燒結涂層導電性能的影響進行了初步的研究。結果表明,燒結溫度較低時,燒結涂層的電阻率較高,當燒結溫度達到180℃時,電阻率低至3.4μ??m。伴隨著燒結溫度的繼續(xù)上升,燒結涂層電阻率呈現(xiàn)上升的趨勢;導電墨水在180℃下燒結得到的燒結涂層導電性能隨著燒結時間的增加呈現(xiàn)出先升高后降低的趨勢,并在燒結時間為0.5 h時,電阻率最低為3.4μ??m;并且在無需通入還原性氣體的120℃空氣氣氛爐中進行燒結,能夠得到均勻、致密、電阻率較低(4.4μ??m)的燒結涂層,初步實現(xiàn)了無顆粒型導電墨水在空氣氛圍中的低溫燒結。
[Abstract]:With the rapid development of printing electronics, printing electronics has become a revolutionary advanced manufacturing technology in the field of microelectronics. Low cost target development, and the requirements of materials, technology gradually increased. Conductive ink, due to its excellent conductivity and wide range of applications, will become the core technology of electronic printing research. In addition to its electrical conductivity, metal-based conductive ink can also be printed to prepare electronic circuits and patterns, so that it can be used in label lines and flexible displays. Sensors and other electronic devices will be widely used. The traditional conductive ink is based on gold or silver as the guide power supply, but its high cost will limit its wider application. Copper with low cost. The advantages of high conductivity have been paid more and more attention. Based on the above reasons, through optimizing the formula of conductive ink, a kind of non-granular ink with copper acetate as precursor has been prepared. The effects of copper-amine ratio, copper-acid ratio and solvent ratio on the conductive properties of the sintered coatings were investigated. At the same time, the effects of sintering conditions on the conductive properties of the sintered coatings were also preliminarily investigated. The low temperature sintering of copper acetate based granular conductive ink was realized. Firstly, the complexing agent and alcohol solvent of copper acetate free conductive ink were optimized by using copper acetate as precursor. The ink with high conductivity was prepared by using 1o 2 propylenediamine, isopropanolamine, n-octylamine N- dimethyl ethanolamine. 2-amino-2-methyl-1-propanol (AMP) was used as a complexing agent, and the thermal stability of the complex was analyzed. Organic amines can lower the thermal decomposition temperature of copper acetate, and when AMP is used as complexing agent, the resistivity of conductive ink is the lowest, 8.5 渭? ? Using formic acid as reducing agent, by changing the type of alcohol solvent in conductive ink, adjusting the surface tension and viscosity of the system, etc. Conductive ink with good stability was obtained. When glycerol and n-propanol were used as composite solvents for copper acetate conductive ink, the resistivity of the sintered coating was as low as 3.4 渭? Secondly, on the basis of the above, the copper-free conductive acetic acid ink was prepared by using AMP as the complexing agent, glycerol and n-propanol as the complex alcohol solvent, and the ratio of copper amine in the ink was further studied. The effect of copper-acid ratio and solvent ratio on the conductivity of conductive ink. When the ratio of copper, amine and acid is 1: 2.5: 4. When the volume ratio of the solvent v: v is 3: 3: 2, the resistivity of the sintered coating of the conductive ink prepared by the solvent is the lowest 3.4 渭? Finally, the effect of sintering temperature and time on the conductive properties of the sintered coating was studied. The results showed that the resistivity of the sintered coating was higher when the sintering temperature was lower. When the sintering temperature reaches 180 鈩,
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