發(fā)布時(shí)間：2018-01-22 04:17

  本文關(guān)鍵詞： 印刷電子 醋酸銅 無(wú)顆粒型導(dǎo)電墨水 燒結(jié)涂層 電阻率　出處：《鄭州大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：隨著印刷電子的高速發(fā)展,印刷電子成為微電子領(lǐng)域的一種革命性先進(jìn)制造技術(shù),引起全球電子行業(yè)、制造行業(yè)等相關(guān)行業(yè)的廣泛關(guān)注。電子器件向著高精度、低成本的目標(biāo)發(fā)展,并且對(duì)材料、工藝的要求逐漸提高。導(dǎo)電墨水憑借其優(yōu)異的導(dǎo)電性和廣泛的應(yīng)用領(lǐng)域等特點(diǎn),必將成為電子印刷研究的核心技術(shù)。其中,金屬基導(dǎo)電墨水除了具有導(dǎo)電性外,還可以通過(guò)印刷的方式來(lái)制備電子線路、圖案,因此其在標(biāo)簽線路、柔性顯示器、傳感器等電子設(shè)備上將廣泛應(yīng)用。傳統(tǒng)的導(dǎo)電墨水是以金或銀等貴金屬為導(dǎo)電源,但因其成本過(guò)高,將限制其更為廣泛的應(yīng)用。銅憑借低成本、高導(dǎo)電性等優(yōu)勢(shì)逐漸受到人們廣泛關(guān)注�；谝陨显�,本課題通過(guò)對(duì)導(dǎo)電墨水配方的優(yōu)化,制備出了以醋酸銅為前驅(qū)體具有較高導(dǎo)電性的無(wú)顆粒型墨水,考察了銅胺配比、銅酸配比、溶劑配比等對(duì)燒結(jié)涂層導(dǎo)電性能的影響,同時(shí)對(duì)燒結(jié)條件對(duì)涂層導(dǎo)電性能的影響也做了初步探究,實(shí)現(xiàn)了醋酸銅基無(wú)顆粒型導(dǎo)電墨水的低溫?zé)Y(jié)。首先以醋酸銅為前驅(qū)體,通過(guò)對(duì)醋酸銅基無(wú)顆粒導(dǎo)電墨水的絡(luò)合劑和醇溶劑進(jìn)行優(yōu)化選擇,制備出了具有較高導(dǎo)電性的墨水。采用1,2丙二胺、異丙醇胺、正辛胺、N,N-二甲基乙醇胺、2-氨基-2-甲基-1-丙醇(AMP)這五種胺作為絡(luò)合劑,并對(duì)所形成的絡(luò)合物進(jìn)行熱穩(wěn)定性分析。結(jié)果表明,有機(jī)胺能夠較大程度地降低醋酸銅的熱分解溫度,并且以AMP為絡(luò)合劑時(shí),導(dǎo)電墨水的燒結(jié)涂層電阻率最低,為8.5μ??m。以甲酸為還原劑,通過(guò)改變導(dǎo)電墨水中醇溶劑的類型,調(diào)節(jié)體系的表面張力、粘度等,得到具有良好穩(wěn)定性的導(dǎo)電墨水。在丙三醇和正丙醇為醋酸銅導(dǎo)電墨水的復(fù)合溶劑時(shí),其燒結(jié)涂層電阻率低至3.4μ?·m。其次,在上述基礎(chǔ)上,確定了以AMP為絡(luò)合劑,丙三醇、正丙醇為復(fù)合醇溶劑,制備醋酸銅基無(wú)顆粒型導(dǎo)電墨水,進(jìn)一步研究了墨水中銅胺配比、銅酸配比、溶劑配比對(duì)導(dǎo)電墨水導(dǎo)電性能的影響。當(dāng)銅、胺、酸的物質(zhì)的量配比為1:2.5:4,溶劑v(丙三醇):v(正丙醇):v(水)的體積比為3:3:2時(shí),所制備的導(dǎo)電墨水的燒結(jié)涂層電阻率最低為3.4μ?·m。最后,對(duì)導(dǎo)電墨水燒結(jié)過(guò)程中燒結(jié)溫度和時(shí)間對(duì)燒結(jié)涂層導(dǎo)電性能的影響進(jìn)行了初步的研究。結(jié)果表明,燒結(jié)溫度較低時(shí),燒結(jié)涂層的電阻率較高,當(dāng)燒結(jié)溫度達(dá)到180℃時(shí),電阻率低至3.4μ??m。伴隨著燒結(jié)溫度的繼續(xù)上升,燒結(jié)涂層電阻率呈現(xiàn)上升的趨勢(shì);導(dǎo)電墨水在180℃下燒結(jié)得到的燒結(jié)涂層導(dǎo)電性能隨著燒結(jié)時(shí)間的增加呈現(xiàn)出先升高后降低的趨勢(shì),并在燒結(jié)時(shí)間為0.5 h時(shí),電阻率最低為3.4μ??m;并且在無(wú)需通入還原性氣體的120℃空氣氣氛爐中進(jìn)行燒結(jié),能夠得到均勻、致密、電阻率較低(4.4μ??m)的燒結(jié)涂層,初步實(shí)現(xiàn)了無(wú)顆粒型導(dǎo)電墨水在空氣氛圍中的低溫?zé)Y(jié)。
[Abstract]:With the rapid development of printing electronics, printing electronics has become a revolutionary advanced manufacturing technology in the field of microelectronics. Low cost target development, and the requirements of materials, technology gradually increased. Conductive ink, due to its excellent conductivity and wide range of applications, will become the core technology of electronic printing research. In addition to its electrical conductivity, metal-based conductive ink can also be printed to prepare electronic circuits and patterns, so that it can be used in label lines and flexible displays. Sensors and other electronic devices will be widely used. The traditional conductive ink is based on gold or silver as the guide power supply, but its high cost will limit its wider application. Copper with low cost. The advantages of high conductivity have been paid more and more attention. Based on the above reasons, through optimizing the formula of conductive ink, a kind of non-granular ink with copper acetate as precursor has been prepared. The effects of copper-amine ratio, copper-acid ratio and solvent ratio on the conductive properties of the sintered coatings were investigated. At the same time, the effects of sintering conditions on the conductive properties of the sintered coatings were also preliminarily investigated. The low temperature sintering of copper acetate based granular conductive ink was realized. Firstly, the complexing agent and alcohol solvent of copper acetate free conductive ink were optimized by using copper acetate as precursor. The ink with high conductivity was prepared by using 1o 2 propylenediamine, isopropanolamine, n-octylamine N- dimethyl ethanolamine. 2-amino-2-methyl-1-propanol (AMP) was used as a complexing agent, and the thermal stability of the complex was analyzed. Organic amines can lower the thermal decomposition temperature of copper acetate, and when AMP is used as complexing agent, the resistivity of conductive ink is the lowest, 8.5 渭? ? Using formic acid as reducing agent, by changing the type of alcohol solvent in conductive ink, adjusting the surface tension and viscosity of the system, etc. Conductive ink with good stability was obtained. When glycerol and n-propanol were used as composite solvents for copper acetate conductive ink, the resistivity of the sintered coating was as low as 3.4 渭? Secondly, on the basis of the above, the copper-free conductive acetic acid ink was prepared by using AMP as the complexing agent, glycerol and n-propanol as the complex alcohol solvent, and the ratio of copper amine in the ink was further studied. The effect of copper-acid ratio and solvent ratio on the conductivity of conductive ink. When the ratio of copper, amine and acid is 1: 2.5: 4. When the volume ratio of the solvent v: v is 3: 3: 2, the resistivity of the sintered coating of the conductive ink prepared by the solvent is the lowest 3.4 渭? Finally, the effect of sintering temperature and time on the conductive properties of the sintered coating was studied. The results showed that the resistivity of the sintered coating was higher when the sintering temperature was lower. When the sintering temperature reaches 180 鈩，

本文編號(hào)：1453632