隨著電氣和電子設(shè)備的不斷發(fā)展,元器件的微型化以及功率密度的快速增加致使電子設(shè)備的熱管理需求不斷提高。為了解決這一問題,提高常用于關(guān)鍵零部件的聚合物導(dǎo)熱性能具有重要意義。在本文中,我們對四種廣泛應(yīng)用于電子設(shè)備的熱塑性聚合物進(jìn)行了研究。首先,我們通過熱壓方法在聚合物基體中構(gòu)建了胞室狀的三維石墨烯網(wǎng)絡(luò)結(jié)構(gòu)來提升聚合物基底的熱導(dǎo)率,同時(shí)探討了熱壓溫度、壓力和聚合物粒料尺寸對熱導(dǎo)率的影響。之后,我們同樣采用熱壓工藝,在聚丙烯中制備了胞室狀的石墨烯網(wǎng)絡(luò)結(jié)構(gòu),以提升復(fù)合材料的電導(dǎo)率并應(yīng)用于電磁波屏蔽。最后,我們采用微波等離子體輔助的化學(xué)氣相沉積系統(tǒng),成功制備了垂直生長的石墨烯結(jié)構(gòu),并填充聚合物形成復(fù)合材料。垂直的石墨烯導(dǎo)熱結(jié)構(gòu)能夠有效提高聚合物的面外熱導(dǎo)率。本研究解決了在較低石墨烯填料含量下,聚合物復(fù)合材料熱導(dǎo)率難以提升的瓶頸問題,提高了石墨烯/聚合物復(fù)合材料在電子元器件熱管理應(yīng)用的潛在可能。 

【文章來源】：中國科學(xué)院大學(xué)(中國科學(xué)院寧波材料技術(shù)與工程研究所)浙江省

【文章頁數(shù)】：95 頁

【學(xué)位級(jí)別】：博士

【文章目錄】：
摘要
Abstract
Chapter 1: Introduction
    1.1 Preamble
    1.2 Multifunctional composites materials
    1.3 Thesis Objective
    1.4 Thesis overview
    References
Chapter 2: Background
    2.1 Graphene
    2.2 Synthesis of Graphene
    2.3 Polymers
        2.3.1 Properties of thermoplastics
        2.3.2 Thermal conductivity of thermoplastics
    2.4 Thermal conductive mechanism of graphene-based polymer composites
    2.5 Thermal conductive fillers for polymer composites
        2.5.1 Metallic fillers
        2.5.2 Carbon-based materials
        2.5.3 Ceramic fillers
    2.6 Highly thermal conductive graphene-based composites
    2.7 Electrically conductive graphene-based polymer composites
    2.8 Electromagnetic interference shielding effectiveness （EMI SE）
    2.9 EMI SE of graphene-based polymer composites
    References
Chapter 3: High thermal conductive graphene/thermoplastics composite
    3.1 Materials and Method
        3.1.1 Materials
        3.1.2 Methods
    3.2 Results and Discussion
        3.2.1 Morphology of GNPs and GNPs/PP composites
        3.2.2 Thermal diffusivity and conductivity of GNPs/PP composites
        3.2.3 Comparison and mechanism of thermally conductive GNPs/PP composites
        3.2.4 Thermal conductivity of GNPs/thermoplastics composites
        3.2.5 Heat dissipation performance
    3.3 Conclusion
    References
Chapter 4: Electrical conductivity and EMI SE of graphene/PP composites
    4.1 Materials and Methods
        4.1.1 Materials
        4.1.2 Method
    4.2 Results and Discussion
        4.2.1 Morphology of GNPs/PP composites
        4.2.2 Electrical conductivity of GNPs/PP composites
        4.2.3 EMI SE of GNPs/PP composites
        4.2.4 Thermal stability of the GNPs/PP composites
        4.2.5 Dynamic mechanical Analysis of GNPs/PP composites
    4.3 Conclusion
    References
Chapter 5: The high thermal conductivity of vertically aligned graphene/PVDF composites
    5.1 Materials and Methods
        5.1.1 Materials
        5.1.2 Methods
        5.1.3 Characterization
    5.2 Results and discussion
        5.2.1 Morphology of VAG
        5.2.2 Morphology and microstructure of VAG/PVDF composites
        5.2.3 Thermal conductivity of VAG/PVDF composites
        5.2.4 Heat dissipation performance of VAG/PVDF composite
    5.3 Conclusion
    References
Chapter 6: Conclusion and Recommendations
    6.1 Summary
    6.2 Recommendations
List of Publication
Acknowledgements



本文編號(hào)：2997759