不同聚合度壬基酚聚氧乙烯醚在酸性光亮鍍銅中的應(yīng)用
發(fā)布時間：2019-08-05 19:37
【摘要】：為研究壬基酚聚氧乙烯醚(NP(EO)_n)可用作酸性光亮鍍銅載體光亮劑的原因以及不同聚合度NP(EO)_n對銅沉積過程的動力學(xué)參數(shù)和沉積層表觀形貌的影響,以NP-10、NP-15、NP-20、NP-40配合Cl~--DPS作為50℃CuSO_4-H_2SO_4鍍液的添加劑,采用電勢掃描交流阻抗法研究NP(EO)_n在電極表面吸附雙電層的形態(tài),采用線性電勢掃描和計時電流法研究NP(EO)_n對電沉積過程的影響,并采用掃描電子顯微鏡和X射線衍射表征沉積層的形貌及晶面取向。結(jié)果表明:NP(EO)_n在電極表面的吸附層阻礙Cu~(2+)的擴散,增強極化,細化晶粒;由于NP(EO)_n吸附層親水鏈長度不同,對Cu~(2+)的屏蔽程度不同,對電沉積影響各異;NP(EO)_n鏈長越長,沉積層的形貌越佳。
[Abstract]:In order to study the reason why nonylphenol polyoxyether (NP (EO) _ n can be used as brightener for acid bright copper plating carrier and the effect of different degree of polymerization NP (EO) _ n on the kinetic parameters and apparent morphology of copper deposition process, NP-10,NP-15,NP-20,NP-40 and Cl~--DPS were used as additives in CuSO_4-H_2SO_4 plating solution at 50 鈩，
本文編號：2523297
[Abstract]:In order to study the reason why nonylphenol polyoxyether (NP (EO) _ n can be used as brightener for acid bright copper plating carrier and the effect of different degree of polymerization NP (EO) _ n on the kinetic parameters and apparent morphology of copper deposition process, NP-10,NP-15,NP-20,NP-40 and Cl~--DPS were used as additives in CuSO_4-H_2SO_4 plating solution at 50 鈩，
本文編號：2523297
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